公开(公告)号：US09475167B2

公开(公告)日：2016-10-25

申请号：US13397908

申请日：2012-02-16

申请人： Toru Maruyama ,  Tadakazu Sone ,  Yasuyuki Motoshima

发明人： Toru Maruyama ,  Tadakazu Sone ,  Yasuyuki Motoshima

IPC分类号： B24B37/015 ,  B24B37/04

CPC分类号： B24B37/04 ,  B24B37/015

摘要： A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.

摘要翻译： 衬底抛光装置包括：支撑抛光垫的抛光台; 顶环，构造成将衬底压靠在抛光垫上; 以及衬垫温度调节器，其构造成调节抛光垫的表面温度。 焊盘温度调节器包括焊盘接触元件和液体供应系统，该液体供应系统被配置为将温度控制的液体供应到焊盘接触元件。 垫接触元件在其中具有空间和将空间分成串联连接的第一液体通道和第二液体通道的隔板。 在第一液体通道和第二液体通道的每一个中设置至少一个基本上垂直于抛光台的径向的挡板。

公开(公告)号：US08845391B2

公开(公告)日：2014-09-30

申请号：US12974123

申请日：2010-12-21

申请人： Tadakazu Sone ,  Yasuyuki Motoshima ,  Toru Maruyama ,  Katsutoshi Ono ,  Yoichi Shiokawa

发明人： Tadakazu Sone ,  Yasuyuki Motoshima ,  Toru Maruyama ,  Katsutoshi Ono ,  Yoichi Shiokawa

IPC分类号： B24B1/00 ,  B24B55/02 ,  B24B37/015 ,  B24B37/34 ,  B24B37/10

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

摘要： An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

摘要翻译： 用于抛光基板的装置包括：支撑抛光垫的可旋转的抛光台;衬底保持器，其构造成保持基板，并将基板压靠在旋转的抛光台上的抛光垫的抛光表面上，以便抛光基板;以及 衬垫温度检测器，被配置为测量抛光垫的抛光表面的温度。 该装置还包括：衬垫温度调节器，其被配置为接触抛光表面以调节抛光表面的温度;以及温度控制器，其被配置为通过基于关于温度的信息控制焊盘温度调节器来控制抛光表面的温度 由焊盘温度检测器检测到的抛光表面。

公开(公告)号：US08777198B2

公开(公告)日：2014-07-15

申请号：US13398216

申请日：2012-02-16

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： B23Q1/00

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：基板保持件，用于通过使基板（W）的表面的周边部分与第一密封构件接触来支撑基板（W）; 以及基板按压部，其相对于基板保持件下降，以将由基板保持件保持的基板（W）向下压，从而使第一密封部件与基板（W）压力接触。 基板按压部设置有与基板保持件的环状保持部的上表面压力接触的第二环状密封部件，从而密封基板按压部的周边区域。

公开(公告)号：US20060243204A1

公开(公告)日：2006-11-02

申请号：US11454790

申请日：2006-06-19

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02 ,  B05C19/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US20120141246A1

公开(公告)日：2012-06-07

申请号：US13398216

申请日：2012-02-16

申请人： Masahiko SEKIMOTO ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko SEKIMOTO ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： H01L21/683

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：基板保持件，用于通过使基板（W）的表面的周边部分与第一密封构件接触来支撑基板（W）; 以及基板按压部，其相对于基板保持件下降，以将由基板保持件保持的基板（W）向下压，从而使第一密封部件与基板（W）压力接触。 基板按压部设置有与基板保持件的环状保持部的上表面压力接触的第二环状密封部件，从而密封基板按压部的周边区域。

公开(公告)号：US20110159782A1

公开(公告)日：2011-06-30

申请号：US12974123

申请日：2010-12-21

申请人： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

发明人： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC分类号： B24B51/00

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

摘要： An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

摘要翻译： 提供了一种用于抛光衬底的设备。 该装置包括：支撑抛光垫的可旋转抛光台; 衬底保持器，其构造成保持衬底并将衬底压靠在旋转的抛光台上的抛光垫的抛光表面上以抛光衬底; 焊盘温度检测器，被配置为测量抛光垫的抛光表面的温度; 衬垫温度调节器，被配置为接触抛光表面以调节抛光表面的温度; 以及温度控制器，其被配置为通过基于由所述焊盘温度检测器检测到的关于所述抛光表面的温度的信息来控制所述焊盘温度调节器来控制所述抛光表面的温度。

公开(公告)号：US07575636B2

公开(公告)日：2009-08-18

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来

公开(公告)号：US20060243205A1

公开(公告)日：2006-11-02

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

IPC分类号： B05C3/02 ,  B05C13/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US07087117B2

公开(公告)日：2006-08-08

申请号：US10712348

申请日：2003-11-14

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C5/02 ,  B23H7/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US08141513B2

公开(公告)日：2012-03-27

申请号：US12983474

申请日：2011-01-03

申请人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko Sekimoto ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： B05C13/00 ,  B05C3/18

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：基板保持件，用于通过使基板（W）的表面的周边部分与第一密封构件接触来支撑基板（W）; 以及基板按压部，其相对于基板保持件下降，以将由基板保持件保持的基板（W）向下压，从而使第一密封部件与基板（W）压力接触。 基板按压部设置有与基板保持件的环状保持部的上表面压力接触的第二环状密封部件，从而密封基板按压部的周边区域。