专利检索 ap:("Yen Cheng Chen" OR "Ching Lin Tseng" OR "Sher Chain Wei" OR "Ming Li Chang") AND inv:"Ching Lin Tseng" 第 1 页

1.

发明授权
SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power 失效

公开(公告)号：US07081645B2

公开(公告)日：2006-07-25

申请号：US11078344

申请日：2005-03-14

申请人： Yen Cheng Chen , Ching Lin Tseng , Sher Chain Wei , Ming Li Chang

发明人： Yen Cheng Chen , Ching Lin Tseng , Sher Chain Wei , Ming Li Chang

IPC分类号： H01L29/22

CPC分类号： H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00

摘要： A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.