公开(公告)号：US20170368664A1

公开(公告)日：2017-12-28

申请号：US15626936

申请日：2017-06-19

申请人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

发明人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

公开(公告)号：US20170368663A1

公开(公告)日：2017-12-28

申请号：US15626857

申请日：2017-06-19

申请人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

发明人： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC分类号： B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

公开(公告)号：US20140030956A1

公开(公告)日：2014-01-30

申请号：US13558140

申请日：2012-07-25

申请人： Jimin Zhang ,  Jose Salas-Vernis ,  Ingemar Carlsson ,  David H. Mai ,  Huyen Tran ,  Zhihong Wang ,  Wen-Chiang Tu ,  Stephen Jew ,  Boguslaw A. Swedek ,  Shih-Haur Shen ,  James C. Wang ,  Yen-Chu Yang

发明人： Jimin Zhang ,  Jose Salas-Vernis ,  Ingemar Carlsson ,  David H. Mai ,  Huyen Tran ,  Zhihong Wang ,  Wen-Chiang Tu ,  Stephen Jew ,  Boguslaw A. Swedek ,  Shih-Haur Shen ,  James C. Wang ,  Yen-Chu Yang

IPC分类号： B24B51/00

CPC分类号： B24B51/00 ,  B24B37/013

摘要： A polishing method includes positioning two substrates in contact with the same polishing pad. Prior to commencement of polishing and while the two substrates are in contact with the polishing pad, two starting values are generated from an in-situ monitoring system. Either a starting polishing time or a pressure applied to one of the substrates can be adjusted so that the two substrates have closer endpoint conditions. During polishing the two substrates are monitored with the in-situ monitoring system to generate a two sequences of values, and a polishing endpoint can be detected or an adjustment for a polishing parameter can be based on the two sequences of values.

摘要翻译： 抛光方法包括将两个基板定位成与相同的抛光垫接触。 在开始抛光之前，当两个基板与抛光垫接触时，从原位监测系统产生两个起始值。 可以调整施加到一个基板的起始抛光时间或压力，使得两个基板具有更接近的端点条件。 在抛光期间，用原位监测系统监测两个基底以产生两个值序列，并且可以检测抛光终点，或者可以基于两个值序列来调整抛光参数。