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    Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same
    1.
    发明申请
    Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same 失效
    具有侧面双密封构件的微电子机械系统（MEMS）封装及其制造方法

    公开(公告)号：US20060081951A1

    公开(公告)日：2006-04-20

    申请号：US11180302

    申请日：2005-07-12

    申请人： Suk Hong ,  Dong Park ,  Yeong Lee

    发明人： Suk Hong ,  Dong Park ,  Yeong Lee

    IPC分类号： H01L29/82

    CPC分类号： B81C1/00293 ,  B81B2203/0384 ,  B81C2203/019 ,  H01L24/81

    摘要： A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

    摘要翻译： 公开了一种具有侧面双密封构件的微机电系统（MEMS）封装以及MEMS封装的制造方法。 MEMS封装通过图案化在基底基板上形成金属层而形成，使得金属层围绕设置在基底基板上的MEMS元件，将盖玻璃接合到金属层，并在其上提供侧面双重密封构件 基底基板的表面和盖玻璃的侧表面，从而将MEMS元件从外部环境气密地密封。 MEMS封装包括基底基板，其中MEMS元件设置在基底基板的表面上; 连接到基底基板上的盖玻璃使得盖玻璃覆盖MEMS元件并透射入射光; 设置在基底基板的表面和盖玻璃的侧面的坝密封构件，从而将MEMS元件从外部环境气密地密封; 以及第二密封构件，其沉积在所述坝密封构件的上表面上，使得所述第二密封构件设置在所述基底基板的表面和所述盖玻璃的侧表面上，从而二次将所述MEMS元件与所述外部环境密封 。

    Micro-electro-mechanical system (MEMS) package having hydrophobic layer
    2.
    发明申请
    Micro-electro-mechanical system (MEMS) package having hydrophobic layer 失效
    具有疏水层的微机电系统（MEMS）封装

    公开(公告)号：US20060076666A1

    公开(公告)日：2006-04-13

    申请号：US11180979

    申请日：2005-07-12

    申请人： Yeong Lee ,  Suk Hong

    发明人： Yeong Lee ,  Suk Hong

    IPC分类号： H01L23/24

    CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

    摘要翻译： 公开了一种具有疏水层的微机电系统（MEMS）封装。 MEMS封装包括：基底基板，其具有设置在基底基板的表面上的MEMS元件; 与设置在基底基板上并覆盖MEMS元件的MEMS元件间隔开的盖; 侧密封构件，设置在基底基板的侧面和盖的表面上，从而将MEMS元件从外部环境密封; 以及覆盖侧面密封构件暴露于外部环境的部分的疏水层，从而从侧面密封构件除去亲水性。

    Micro optical communication device package
    3.
    发明申请
    Micro optical communication device package 审中-公开
    微光通讯器件封装

    公开(公告)号：US20050078920A1

    公开(公告)日：2005-04-14

    申请号：US10734146

    申请日：2003-12-15

    申请人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

    发明人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

    IPC分类号： G02B6/26 ,  B81B7/02 ,  G02B6/00 ,  G02B6/35 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  G02B26/08 ,  H04B10/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/60

    CPC分类号： G02B6/3582 ,  G02B6/266 ,  G02B6/3552 ,  G02B6/3594 ,  G02B6/36 ,  G02B6/3887 ,  G02B6/4248

    摘要： The present invention relates to a micro optical communication device package. The package of the invention comprises a Micro-Electro-Mechanical System (MEMS) chip for executing an optical communication function. The MEMS chip is mounted on a base. An upper housing having an opened bottom is placed on the base to form an internal space together with the base. The upper housing is sealed with the base to hermetically seal the MEMS chip within the internal space. The MEMS chip is connected an optical fiber, which is extended through the upper housing to form a light path. A boot is fit around the optical fiber and fixed to the upper housing to seal a portion of the upper housing for allowing passage of the optical fiber.

    摘要翻译： 本发明涉及一种微型光通信设备封装。 本发明的封装包括用于执行光通信功能的微机电系统（MEMS）芯片。 MEMS芯片安装在基座上。 具有开口底部的上壳体被放置在基座上以与基部一起形成内部空间。 上壳体与基座密封，以将MEMS芯片密封在内部空间内。 MEMS芯片连接有光纤，该光纤通过上壳体延伸以形成光路。 导光罩装在光纤周围并固定在上壳体上，以密封上壳体的一部分，以允许光纤通过。

    Wavelength division multiplexing system having built-in optical attenuator
    5.
    发明申请
    Wavelength division multiplexing system having built-in optical attenuator 审中-公开
    具有内置光衰减器的波分复用系统

    公开(公告)号：US20050084205A1

    公开(公告)日：2005-04-21

    申请号：US10822726

    申请日：2004-04-13

    申请人： Suk Hong ,  Moo Park ,  Yeong Lee

    发明人： Suk Hong ,  Moo Park ,  Yeong Lee

    IPC分类号： G02B6/00 ,  G02B6/26 ,  G02B6/293 ,  G02B6/34 ,  G02B6/35 ,  H04J14/02 ,  G02B6/42

    CPC分类号： G02B6/353 ,  G02B6/266 ,  G02B6/29353 ,  G02B6/29364 ,  G02B6/29389 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/357 ,  G02B6/3594

    摘要： Disclosed is a WDM system for demultiplexing mixed optical signals transmitted through one channel from the outside to distribute specific wavelength optical signals into a plurality of channels. The WDM system has a receiving optical fiber for receiving the mixed optical signals. A filter is arranged in an output end of the receiving optical fiber for selectively transmitting a specific optical signal of a wavelength identical with the peak wavelength of the filter but reflecting remaining wavelength optical signals. A transmitting optical fiber outputs the specific wavelength optical signal transmitted through the filter. A shutter member attenuates the specific wavelength optical signal between the filter and the transmitting optical fiber. An actuator drives the shutter member across the propagation of the specific wavelength optical signal transmitted through the filter; and a control unit for controlling the actuation of the actuator. The built-in optical attenuators allow integration of individual components, simplify the structure of the system as well as improve the performance and reliability of the system.

    摘要翻译： 公开了一种WDM系统，用于从外部将通过一个信道传输的混合光信号解复用，以将特定波长的光信号分配到多个信道中。 WDM系统具有用于接收混合光信号的接收光纤。 滤波器布置在接收光纤的输出端，用于选择性地发射与滤波器的峰值波长相同的波长的特定光信号，但反射剩余的波长光信号。 发送光纤输出通过滤波器发送的特定波长光信号。 快门部件衰减滤光器和发射光纤之间的特定波长光信号。 致动器驱动快门部件穿过通过过滤器传输的特定波长光信号的传播; 以及用于控制致动器的致动的控制单元。 内置的光衰减器可以集成各个组件，简化系统的结构，并提高系统的性能和可靠性。

    Variable control of write parameters for hard disk drive
    8.
    发明申请
    Variable control of write parameters for hard disk drive 审中-公开
    变量控制硬盘驱动器的写入参数

    公开(公告)号：US20060103964A1

    公开(公告)日：2006-05-18

    申请号：US10987417

    申请日：2004-11-12

    申请人： Sang Chu ,  Kang Lee ,  Jong Yun ,  Yeong Lee

    发明人： Sang Chu ,  Kang Lee ,  Jong Yun ,  Yeong Lee

    IPC分类号： G11B5/02 ,  G11B5/09

    CPC分类号： G11B5/40

    摘要： A hard disk drive that changes a variable write parameter of a head during a write operation. The controller can change the variable write parameter to compensate for a transient temperature profile of the head during the initial stage of a write operation. By way of example, the controller can provide a relatively large overshoot control signal of a head during the writing of a first sector of a write operation. The value of the overshoot control signal may be decremented for a second sector, a third sector etc., until the head attains a thermal steady state at which point the overshoot control signal is provided with a constant value.

    摘要翻译： 在写入操作期间更改头的可变写入参数的硬盘驱动器。 控制器可以改变可变写入参数，以在写入操作的初始阶段补偿磁头的瞬态温度曲线。 作为示例，控制器可以在写操作的第一扇区的写入期间提供头的相对较大的过冲控制信号。 对于第二扇区，第三扇区等，过冲控制信号的值可以减小，直到磁头达到热稳定状态，在该点处，过冲控制信号被提供有恒定值。