Semiconductor module
    7.
    发明申请
    Semiconductor module 有权
    半导体模块

    公开(公告)号:US20090310313A1

    公开(公告)日:2009-12-17

    申请号:US12457522

    申请日:2009-06-15

    IPC分类号: H05K7/20 H05K7/10

    摘要: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

    摘要翻译: 提供了一种半导体模块,其包括在模块主体的暴露表面上的模块体和减震构件。 模块体可以包括在衬底上的至少一个半导体封装,并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。 根据示例实施例,模块主体还可以在至少一个半导体封装上包括传热构件,并且模块主体的暴露表面可以包括传热构件的暴露表面。