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    Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejection Heads, And Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters
    1.
    发明申请
    Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejection Heads, And Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters 有权
    微流体喷射装置，制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头

    公开(公告)号：US20110094102A1

    公开(公告)日：2011-04-28

    申请号：US12690955

    申请日：2010-02-16

    申请人： Yimin Guan ,  Stuart Jacobsen ,  Carl Sullivan

    发明人： Yimin Guan ,  Stuart Jacobsen ,  Carl Sullivan

    IPC分类号： B23P17/00

    CPC分类号： B41J2/14129 ,  B41J2202/03 ,  B41J2202/11 ,  Y10T29/49401

    摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.

    摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

    Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters
    2.
    发明申请
    Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters 失效
    微流体喷射装置，制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头

    公开(公告)号：US20080165227A1

    公开(公告)日：2008-07-10

    申请号：US11683572

    申请日：2007-03-08

    申请人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

    发明人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

    IPC分类号： B41J2/05

    CPC分类号： B41J2/14129 ,  B41J2202/03 ,  B41J2202/11 ,  Y10T29/49401

    摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.

    摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

    Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
    4.
    发明授权
    Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters 失效
    微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头

    公开(公告)号：US07673972B2

    公开(公告)日：2010-03-09

    申请号：US11683572

    申请日：2007-03-08

    申请人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

    发明人： Yimin Guan ,  Stuart Jacobsen ,  Carl Edmond Sullivan

    IPC分类号： B41J2/05

    CPC分类号： B41J2/14129 ,  B41J2202/03 ,  B41J2202/11 ,  Y10T29/49401

    摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.

    摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。

    On-chip fluid recirculation pump for micro-fluid applications
    5.
    发明授权
    On-chip fluid recirculation pump for micro-fluid applications 有权
    用于微流体应用的片上流体再循环泵

    公开(公告)号：US08814293B2

    公开(公告)日：2014-08-26

    申请号：US13349933

    申请日：2012-01-13

    申请人： Timothy L. Strunk ,  Yimin Guan

    发明人： Timothy L. Strunk ,  Yimin Guan

    IPC分类号： B41J29/38

    CPC分类号： B41J2/1404 ,  B41J2/175 ,  B41J2/17596 ,  B41J2002/14467 ,  B41J2202/12

    摘要： A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few.

    摘要翻译： 微流体喷射头具有在基板上形成为薄膜层的流体喷射元件。 衬底上的流体流动特征使流体从流体源流向围绕喷射元件的喷射室。 衬底上的泵将流体从源循环到喷射室，并再次返回到源。 流动更新室内的流体，以最大限度地减少蒸发的有害影响。 控制器协调泵的流量和其他变量，以优化系统生产率。 其他实施例考虑泵位置，泵类型，泵计数和流体特征，例如路径，扩散器，扼流圈和尺寸，仅举几个例子。

    ON-CHIP FLUID RECIRCULATION PUMP FOR MICRO-FLUID APPLICATIONS
    6.
    发明申请
    ON-CHIP FLUID RECIRCULATION PUMP FOR MICRO-FLUID APPLICATIONS 有权
    用于微流体应用的片上流体回流泵

    公开(公告)号：US20130182022A1

    公开(公告)日：2013-07-18

    申请号：US13349933

    申请日：2012-01-13

    申请人： Timothy L. Strunk ,  Yimin Guan

    发明人： Timothy L. Strunk ,  Yimin Guan

    IPC分类号： B41J29/38 ,  B41J2/18

    CPC分类号： B41J2/1404 ,  B41J2/175 ,  B41J2/17596 ,  B41J2002/14467 ,  B41J2202/12

    摘要： A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few.

    摘要翻译： 微流体喷射头具有在基板上形成为薄膜层的流体喷射元件。 衬底上的流体流动特征使流体从流体源流向围绕喷射元件的喷射室。 衬底上的泵将流体从源循环到喷射室，并再次返回到源。 流动更新室内的流体，以最大限度地减少蒸发的有害影响。 控制器协调泵的流量和其他变量，以优化系统生产率。 其他实施例考虑泵位置，泵类型，泵计数和流体特征，例如路径，扩散器，扼流圈和尺寸，仅举几个例子。

    Capping layer for insulator in micro-fluid ejection heads
    7.
    发明授权
    Capping layer for insulator in micro-fluid ejection heads 有权
    微流体喷射头中的绝缘体封盖层

    公开(公告)号：US08376523B2

    公开(公告)日：2013-02-19

    申请号：US12764357

    申请日：2010-04-21

    申请人： Yimin Guan ,  Burton Joyner, II

    发明人： Yimin Guan ,  Burton Joyner, II

    IPC分类号： B41J2/05

    CPC分类号： B41J2/14129 ,  B41J2002/14387

    摘要： A micro-fluid ejection head has a resistor layer defining a heater element. An insulative layer underlies the heater element and a capping layer on the insulative layer substantially prevents ion mobility between the resistor and insulative layers. Resistance stability of the heater has been shown improved as has adhesion of the heater to the insulator. Representative layers include insulation of methyl silesquioxane (MSQ) in a thickness of about 5000 Angstroms or more, while the cap is a silicon nitride in a thickness of about 2000 Angstroms or less. Other capping layers include silicon carbide, silicon oxide or dielectrics. The resistor layer typifies TaAlN in a thickness of about 350 Angstroms, including overlying anode and cathode conductors that define the heater. Coating layers are also disclosed as are thermal barrier layers.

    摘要翻译： 微流体喷射头具有限定加热器元件的电阻层。 绝缘层位于加热器元件的下面，并且绝缘层上的覆盖层基本上防止电阻器和绝缘层之间的离子迁移。 由于加热器对绝缘体的粘附性，加热器的电阻稳定性得到改善。 代表性层包括厚度约5000埃或更大的甲基倍半硅氧烷（MSQ）的绝缘，而盖是约2000埃或更小的厚度的氮化硅。 其它覆盖层包括碳化硅，氧化硅或电介质。 电阻层以大约350埃的厚度代表TaAlN，包括覆盖加热器的阳极和阴极导体。 还公开了涂层是热障层。

    Method for making a thin film resistor
    8.
    发明授权
    Method for making a thin film resistor 有权
    制造薄膜电阻的方法

    公开(公告)号：US07918015B2

    公开(公告)日：2011-04-05

    申请号：US12336767

    申请日：2008-12-17

    申请人： Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan ,  George K. Parish

    发明人： Byron V. Bell ,  Robert W. Cornell ,  Yimin Guan ,  George K. Parish

    IPC分类号： H01C17/00

    CPC分类号： B41J2/14129 ,  B41J2202/03 ,  Y10T29/49082 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49163 ,  Y10T29/49346 ,  Y10T29/49401

    摘要： A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

    摘要翻译： 一种用于制造微流体喷射装置的流体喷射头的方法。 在一个实施例中，该方法包括在衬底上沉积薄膜电阻层以提供多个薄膜加热器。 薄膜电阻层包括主要由AlN，TaN和TaAl合金组成的钽 - 氮化铝材料，并且含有约30至约70原子％的钽，约10至约40原子％的铝和约5至约 约30原子％的氮。

    Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack
    10.
    发明申请
    Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack 有权
    微流体喷射装置中的加热器堆叠和在加热器堆叠中形成浮动电加热器元件的方法

    公开(公告)号：US20100165056A1

    公开(公告)日：2010-07-01

    申请号：US12345788

    申请日：2008-12-30

    申请人： Yimin Guan ,  Zachary Justin Reitmeier ,  Carl Edmond Sullivan

    发明人： Yimin Guan ,  Zachary Justin Reitmeier ,  Carl Edmond Sullivan

    IPC分类号： B41J2/14 ,  H01L21/3213

    CPC分类号： B41J2/1412 ,  B41J2/1601 ,  B41J2/1629 ,  B41J2/1631

    摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.

    摘要翻译： 一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖 加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域 在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生 浮动加热元件。