摘要:
The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure.A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein R1 represents an organic group with a valence of 2 to 8, having at least two carbon atoms; R2 represents an organic group with a valence of 2 to 6, having at least two carbon atoms; R3 represents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q>0.
摘要:
The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein R1 represents an organic group with a valence of 2 to 8, having at least two carbon atoms; R2 represents an organic group with a valence of 2 to 6, having at least two carbon atoms; R3 represents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q>0.
摘要翻译:本发明涉及曝光后显示良好的储存稳定性的正型感光性树脂前体组合物。 光敏树脂前体组合物包含(a)基本上由式(1)表示的结构单元组成的聚合物; (b)至少两个光酸产生剂; 和(c)具有烷氧基甲基的化合物:其中R 1表示具有至少两个碳原子的价数为2至8的有机基团; R 2表示具有至少两个碳原子的价数为2至6的有机基团; R 3表示氢或碳数为1〜20的有机基团; n表示10〜100,000的数; m表示0〜2的整数, p和q表示0〜4的整数,满足p + q> 0。
摘要:
The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.6 debye (b) There is included a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid and/or an ester of a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid (In general formula (1), R1 represents a bivalent to octavalent organic group with at least two carbon atoms, R2 represents a bivalent to hexavalent organic group with at least two carbon atoms, and R3 represents hydrogen or an organic group with from one to ten carbons. n is an integer in the range 10 to 100,000, m is an integer in the range 0 to 2, and p and q are integers in the range 0 to 4, but p and q are not simultaneously 0.) (In the formula, R23, R24, R26 and R27 each represents a hydrogen atom or a C1-8 alkyl group, alkoxy group, carboxyl group or ester group. At least one R25 is hydroxyl group, while the rest represent hydrogen atoms and C1-8 alkyl groups. aa, bb, cc and dd represent integers in the range 0 to 3. However, aa+bb≦5, bb+dd≦5 and aa+bb>0. ee represents an integer in the range 1 to 3.)
摘要:
A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.
摘要:
A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.
摘要:
This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.
摘要:
A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a planarization film for a TFT substrate, an interlayer dielectrics or a core or cladding of an optical waveguide. The positive photosensitive siloxane composition includes a siloxane polymer, quinonediazide compound and solvent, and a cured film formed of the composition has a light transmittance per 3 μm of film thickness at a wavelength of 400 nm of 95% or more.
摘要:
This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.
摘要:
Provided is an optical glass fiber coating composition which when coated on an optical glass fiber and suitably cured provides a coating having the combination of properties (i) through (iv):(i) a stable tensile modulus that is low at room temperature and over a broad range of temperatures below room temperature,(ii) an adhesion to the optical glass fiber sufficient to prevent structural defects and microbending in the optical glass fiber,(iii) the capability of being removed by stripping from the optical glass fiber substantially no residue left on the optical glass fiber, and(iv) which satisfies each of the following inequalities (I) and (II),X.ltoreq.0.2 kg/mm.sup.2 (I)X/Y.gtoreq.1/10 (II) wherein X is the tensile modulus (kg/mm.sup.2) measured at 23.degree. C. and Y is the tensile modulus (kg/mm.sup.2) measured at -40.degree. C.,This coating composition comprises:(A) a urethane (meth)acrylate formed from,(a) a diol compound containing at least one structure represented by one of the following formulas (1) and (2), ##STR1## (b) a compound containing two isocyanate groups, and (c) a compound containing a (meth)acrylate group and a hydroxy group;(B) a second (meth)acrylate-containing compound of which the homopolymer has a glass transition temperature of at most about 0.degree. C.; and(C) a polymerization initiator.
摘要:
Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.