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公开(公告)号：US07311972B2
公开(公告)日：2007-12-25
申请号：US10967115
申请日：2004-10-14
CPC分类号： H01L31/0203 , C08G59/226 , C08G59/4215 , C08G59/686 , C08K3/40 , C08K9/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译： 对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率， 在400至900nm范围内的波长处，密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。 还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近 （3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂 组成。
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公开(公告)号：US07381359B2
公开(公告)日：2008-06-03
申请号：US10967646
申请日：2004-10-14
CPC分类号： C08G59/24 , C08G59/4215 , C08G59/688 , C08K9/06 , C08L63/00 , Y10T428/31511
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译： 对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率， 在400至900nm范围内的波长处，密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。 还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近 （3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂 组成。
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公开(公告)号：US20060083851A1
公开(公告)日：2006-04-20
申请号：US10967646
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
CPC分类号： C08G59/24 , C08G59/4215 , C08G59/688 , C08K9/06 , C08L63/00 , Y10T428/31511
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译： 对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率， 在400至900nm范围内的波长处，密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。 还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近 （3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电器件，和（5）固化填充的环氧树脂 组成。
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公开(公告)号：US20060084727A1
公开(公告)日：2006-04-20
申请号：US10967115
申请日：2004-10-14
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
CPC分类号： H01L31/0203 , C08G59/226 , C08G59/4215 , C08G59/686 , C08K3/40 , C08K9/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要翻译： 对于光电器件或光学部件描述了一种密封剂，其提供小于50ppm /℃的热膨胀系数，其变化小于±30％，并进一步提供至少20％的光透射率， 在400至900nm范围内的波长处，密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料，其基本上不含二氧化钛和氧化铅，并且折射率在1.48至1.60范围内，其变化小于约0.001。 还描述了制造密封剂的方法，该方法包括以下步骤：（1）处理玻璃以形成直径在1至500μm之间的颗粒;（2）制备环氧树脂组合物，其在固化阶段的折射率接近 （3）将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物，（4）用填充的环氧树脂组合物封装光电子器件，和（5）固化填充的环氧树脂 组成。
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公开(公告)号：US20050101699A1
公开(公告)日：2005-05-12
申请号：US11007766
申请日：2004-12-07
申请人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Meyers , Mark Morris , D. Meixner , Satyabrata Raychaudhuri
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译： 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与 将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。
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公开(公告)号：US07304102B2
公开(公告)日：2007-12-04
申请号：US11007766
申请日：2004-12-07
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译： 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与 将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。
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公开(公告)号：US06841888B2
公开(公告)日：2005-01-11
申请号：US10455733
申请日：2003-06-04
申请人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
发明人： Yongan Yan , Douglas Evan Meyers , Mark Allen Morris , D. Laurence Meixner , Satyabrata Raychaudhuri
IPC分类号： C08K3/40 , C08L63/00 , H01L23/29 , H01L31/0203 , H01L23/28
CPC分类号： C08K3/40 , C08L63/00 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要翻译： 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料，以及具有与 将玻璃加热至预定温度预定时间，以防止填料颗粒与环氧树脂混合后使填料颗粒沉降，从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率，并且其热膨胀系数可以通过改变填料的量而改变，而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散，密封剂内的热膨胀变化系数优选小于30％。
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公开(公告)号：US20100168264A1
公开(公告)日：2010-07-01
申请号：US12488309
申请日：2009-06-19
IPC分类号： C08K3/36
CPC分类号： G02B1/113 , C08F283/10 , C08F290/06 , C08F290/064 , C08K3/36 , C09D5/006 , C09D7/62 , C09D133/06 , C09D151/10 , Y10S977/773 , C08L2666/02
摘要： Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy (meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index greater than about 1.70 at a wavelength of 510 nm. The coating compositions are deposited in a process that produces an antireflection coating in less than 90 minutes of processing time.
摘要翻译： 公开了涂料组合物以及将它们沉积在制品的表面上以产生抗反射涂层的方法。 在一个实施方案中，涂料组合物包含（甲基）丙烯酸酯官能的硅醇盐，二氧化硅颗粒，（甲基）丙烯酸酯单体，环氧（甲基）丙烯酸酯低聚物，光引发剂，溶剂，酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处的折射率小于约1.60。 在另一个实施方案中，涂料组合物包括除有机金属化合物硅之外的有机金属化合物，环氧官能的硅醇盐，非环氧官能的硅醇盐，与环氧官能的分子相容的固化剂， 溶剂，无机酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处具有大于约1.70的折射率。 涂料组合物以不到90分钟处理时间产生抗反射涂层的方法沉积。
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公开(公告)号：US08865786B2
公开(公告)日：2014-10-21
申请号：US12488309
申请日：2009-06-19
IPC分类号： C08K3/36 , C09D7/12 , C09D151/10 , C09D5/00 , G02B1/11 , C08F290/06 , C08F283/10 , C09D133/06
CPC分类号： G02B1/113 , C08F283/10 , C08F290/06 , C08F290/064 , C08K3/36 , C09D5/006 , C09D7/62 , C09D133/06 , C09D151/10 , Y10S977/773 , C08L2666/02
摘要： Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy (meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index greater than about 1.70 at a wavelength of 510 nm. The coating compositions are deposited in a process that produces an antireflection coating in less than 90 minutes of processing time.
摘要翻译： 公开了涂料组合物以及将它们沉积在制品的表面上以产生抗反射涂层的方法。 在一个实施方案中，涂料组合物包含（甲基）丙烯酸酯官能的硅醇盐，二氧化硅颗粒，（甲基）丙烯酸酯单体，环氧（甲基）丙烯酸酯低聚物，光引发剂，溶剂，酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处的折射率小于约1.60。 在另一个实施方案中，涂料组合物包括除有机金属化合物硅之外的有机金属化合物，环氧官能的硅醇盐，非环氧官能的硅醇盐，与环氧官能的分子相容的固化剂， 溶剂，无机酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处具有大于约1.70的折射率。 涂料组合物以不到90分钟处理时间产生抗反射涂层的方法沉积。
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10.发明申请Antireflective coating compositions and methods for depositing such coatings 审中-公开防反射涂料组合物和沉积这种涂料的方法公开(公告)号：US20080003373A1
公开(公告)日：2008-01-03
申请号：US11432685
申请日：2006-05-10
IPC分类号： B05D3/00 , C04B41/50 , C09D183/04
CPC分类号： G02B1/113 , C08F283/10 , C08F290/06 , C08F290/064 , C08K3/36 , C09D5/006 , C09D7/62 , C09D133/06 , C09D151/10 , Y10S977/773 , C08L2666/02
摘要： Coating compositions, and methods for depositing them on the surface of an article to produce an antireflection coating, are disclosed. In one embodiment, the coating composition includes a (meth)acrylate-functional silicon alkoxide, silica particles, a (meth)acrylate monomer, an epoxy(meth)acrylate oligomer, a photoinitiator, a solvent, an acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index less than about 1.60 at a wavelength of 510 nm. In another embodiment, the coating composition includes an organo-metallic compound other than an organo-metallic compound of silicon, an epoxy-functional silicon alkoxide, a non-epoxy-functional silicon alkoxide, a curing agent compatible with epoxy-functional molecules, a solvent, an inorganic acid, and water. The relative amounts of these constituents are controlled such that, when the coating composition is deposited onto the surface of an article and cured, it has a refractive index greater than about 1.70 at a wavelength of 510 nm. The coating compositions are deposited in a process that produces an antireflection coating in less than 90 minutes of processing time.
摘要翻译： 公开了涂料组合物以及将它们沉积在制品的表面上以产生抗反射涂层的方法。 在一个实施方案中，涂料组合物包含（甲基）丙烯酸酯官能的硅醇盐，二氧化硅颗粒，（甲基）丙烯酸酯单体，环氧（甲基）丙烯酸酯低聚物，光引发剂，溶剂，酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处的折射率小于约1.60。 在另一个实施方案中，涂料组合物包括除有机金属化合物硅之外的有机金属化合物，环氧官能的硅醇盐，非环氧官能的硅醇盐，与环氧官能的分子相容的固化剂， 溶剂，无机酸和水。 控制这些成分的相对量，使得当涂料组合物沉积在制品的表面上并固化时，其在波长510nm处具有大于约1.70的折射率。 涂料组合物以不到90分钟处理时间产生抗反射涂层的方法沉积。
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