Method for making filled epoxy resin compositions
    1.
    发明申请
    Method for making filled epoxy resin compositions 失效
    填充环氧树脂组合物的制备方法

    公开(公告)号:US20060083851A1

    公开(公告)日:2006-04-20

    申请号:US10967646

    申请日:2004-10-14

    IPC分类号: H05K3/00 B05D5/12

    摘要: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.

    摘要翻译: 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电器件,和(5)固化填充的环氧树脂 组成。

    Filled epoxy resin compositions
    2.
    发明申请
    Filled epoxy resin compositions 失效
    填充环氧树脂组合物

    公开(公告)号:US20060084727A1

    公开(公告)日:2006-04-20

    申请号:US10967115

    申请日:2004-10-14

    IPC分类号: C08L63/00 H01L21/56 B32B27/38

    摘要: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.

    摘要翻译: 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。

    Process for making encapsulant for opto-electronic devices
    3.
    发明申请
    Process for making encapsulant for opto-electronic devices 失效
    制造光电器件密封剂的工艺

    公开(公告)号:US20050101699A1

    公开(公告)日:2005-05-12

    申请号:US11007766

    申请日:2004-12-07

    IPC分类号: C08K3/40 C08L63/00 H01L23/29

    摘要: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

    摘要翻译: 用于光电器件和光学部件的密封剂包括由已经加工成颗粒形式并加热至预定温度预定时间的玻璃制成的填料,以及具有与 将玻璃加热至预定温度预定时间,以防止填料颗粒与环氧树脂混合后使填料颗粒沉降,从而获得颗粒在环氧树脂中的均匀分散。 密封剂提供高的透光率,并且其热膨胀系数可以通过改变填料的量而改变,而基本上不改变密封剂的光学性质。 由于填料颗粒在环氧树脂中的均匀分散,密封剂内的热膨胀变化系数优选小于30%。

    Filled epoxy resin compositions
    4.
    发明授权
    Filled epoxy resin compositions 失效
    填充环氧树脂组合物

    公开(公告)号:US07311972B2

    公开(公告)日:2007-12-25

    申请号:US10967115

    申请日:2004-10-14

    摘要: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.

    摘要翻译: 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。

    Method for making filled epoxy resin compositions
    5.
    发明授权
    Method for making filled epoxy resin compositions 失效
    填充环氧树脂组合物的制备方法

    公开(公告)号:US07381359B2

    公开(公告)日:2008-06-03

    申请号:US10967646

    申请日:2004-10-14

    摘要: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.

    摘要翻译: 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电子器件,和(5)固化填充的环氧树脂 组成。

    Method to augment heat transfer using chamfered cylindrical depressions in cast internal cooling passages
    6.
    发明申请
    Method to augment heat transfer using chamfered cylindrical depressions in cast internal cooling passages 审中-公开
    在铸造内部冷却通道中使用倒角圆柱形凹陷来增加传热的方法

    公开(公告)号:US20070201980A1

    公开(公告)日:2007-08-30

    申请号:US11390616

    申请日:2006-03-27

    IPC分类号: F01D5/18

    摘要: An air-cooled turbine blade is provided having an airfoil shape defined by a convex suction side wall, a concave pressure side wall, a leading edge, a trailing edge, a root and a tip, each wall including an interior surface that defines an interior with the edges, root and tip. The blade includes a plurality of independent cooling circuit flow paths within the blade interior and a roughened surface. The roughened surface is formed on an interior surface of at least one of the convex suction side wall and the concave pressure side wall, the roughened surface comprising a plurality of cylindrical depressions. Each depression includes a cylindrical wall coupled to a bottom wall by a chamfered edge formed therebetween, and the roughened surface defines at least a portion of one of the flow paths of the plurality of independent cooling circuit flow paths. Methods for forming the blade are also provided.

    摘要翻译: 提供一种风冷式涡轮叶片,其具有由凸形吸入侧壁,凹形压力侧壁,前缘,后缘,根部和尖端限定的翼型,每个壁包括限定内部的内表面 边缘,根部和尖端。 叶片包括在叶片内部和粗糙表面内的多个独立的冷却回路流动路径。 粗糙表面形成在凸吸入侧壁和凹压侧壁中的至少一个的内表面上,粗糙表面包括多个圆柱形凹陷。 每个凹陷包括通过其间形成的倒角边缘连接到底壁的圆柱形壁,粗糙表面限定多个独立冷却回路流动路径中的一个流路的至少一部分。 还提供了形成叶片的方法。

    Mint plant named ‘Clackamas’
    8.
    植物专利
    Mint plant named ‘Clackamas’ 有权
    薄荷厂名为“Clackamas”

    公开(公告)号:USPP14450P2

    公开(公告)日:2004-01-06

    申请号:US10193213

    申请日:2002-07-12

    申请人: Mark Morris

    发明人: Mark Morris

    IPC分类号: A01H500

    CPC分类号: A01H5/12

    摘要: A new and distinct peppermint plant ‘Clackamas’ characterized by its resistance to Mint rust (Puccinia menthe Pers), Mint wilt (Ferticillium dahliae and Verticillium albo-atrum), and Spider mites as well as a more upright growth habit and a lighter green color the Black Mitcham peppermint plant.

    摘要翻译: 一种新的和独特的薄荷植物“Clackamas”,其特征在于它对薄荷锈病(Puccinia menthe Pers),薄荷苔藓(大戟属和大戟属)和蜘蛛螨的抗性以及更直立的生长习性和较浅的绿色 黑Mitcham薄荷植物。

    Diffuser particle separator
    10.
    发明申请
    Diffuser particle separator 失效
    扩散器粒子分离器

    公开(公告)号:US20070235373A1

    公开(公告)日:2007-10-11

    申请号:US11213125

    申请日:2005-08-26

    IPC分类号: B07C5/342

    摘要: A diffuser particle separator may be integrated into a gas turbine engine to remove corrosive dust and salt particles from the engine's core air flow. The air flow may pass over a series of particle accumulator entrance orifices, trapping particles in a particle accumulator while allowing the air flow to continue unimpeded. Since dust deposits may become molten at high temperatures, removal of dust from the core and secondary airflow may be critical for long-life superalloy and ceramic components, particularly those with small diameter air-cooling holes and thermal barrier coatings.

    摘要翻译: 扩散器颗粒分离器可以集成到燃气涡轮发动机中以从发动机的核心空气流中去除腐蚀性灰尘和盐颗粒。 空气流可以通过一系列颗粒蓄能器入口,将颗粒捕获在颗粒蓄积器中,同时允许气流继续畅通无阻。 由于灰尘沉积物可能在高温下变得熔融,因此从长期使用的超级合金和陶瓷部件,特别是具有小直径空气冷却孔和热障涂层的那些部件中,从芯部和二次气流中除去灰尘可能是至关重要的。