摘要:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要:
An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.
摘要:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
摘要:
An air-cooled turbine blade is provided having an airfoil shape defined by a convex suction side wall, a concave pressure side wall, a leading edge, a trailing edge, a root and a tip, each wall including an interior surface that defines an interior with the edges, root and tip. The blade includes a plurality of independent cooling circuit flow paths within the blade interior and a roughened surface. The roughened surface is formed on an interior surface of at least one of the convex suction side wall and the concave pressure side wall, the roughened surface comprising a plurality of cylindrical depressions. Each depression includes a cylindrical wall coupled to a bottom wall by a chamfered edge formed therebetween, and the roughened surface defines at least a portion of one of the flow paths of the plurality of independent cooling circuit flow paths. Methods for forming the blade are also provided.
摘要:
A cooled shroud assembly includes an angled slot and a plurality of dilution jet openings. The shroud forward cavity is modified such that at least one recirculation zone is produced. The angled slot forces an axial change in momentum of the hot gas flow and increases radial and axial pressure variation attenuation. The cooled shroud assembly isolates the shroud structure and seals from the hot flow path and a cooling flow from the dilution jet openings dilutes the hot gas flow. A series of recirculation zones shields the shroud carrier and high pressure seals from the hot gas flow.
摘要:
A new and distinct peppermint plant ‘Clackamas’ characterized by its resistance to Mint rust (Puccinia menthe Pers), Mint wilt (Ferticillium dahliae and Verticillium albo-atrum), and Spider mites as well as a more upright growth habit and a lighter green color the Black Mitcham peppermint plant.
摘要:
Compounds represented by formula I: or pharmaceutically acceptable salts and solvates thereof, wherein A, B, B′, X, Y, R1, R1′, R2, R2′, R3, R3′, R5, R5′, R6, m, n, or p are as defined herein, are useful for treating flaviviridae viral infections.
摘要:
A diffuser particle separator may be integrated into a gas turbine engine to remove corrosive dust and salt particles from the engine's core air flow. The air flow may pass over a series of particle accumulator entrance orifices, trapping particles in a particle accumulator while allowing the air flow to continue unimpeded. Since dust deposits may become molten at high temperatures, removal of dust from the core and secondary airflow may be critical for long-life superalloy and ceramic components, particularly those with small diameter air-cooling holes and thermal barrier coatings.