Testing of semiconductor integrated circuits
    2.
    发明授权
    Testing of semiconductor integrated circuits 失效
    半导体集成电路测试

    公开(公告)号:US5793219A

    公开(公告)日:1998-08-11

    申请号:US691173

    申请日:1996-08-01

    申请人: Shunichi Iida

    发明人: Shunichi Iida

    摘要: A semiconductor integrated circuit is tested such that probe styli are brought into contact with electrodes on integrated circuit chips formed in a semiconductor wafer to test circuit characteristics of the integrated circuit chips. A test is conducted over a given number of integrated circuit chips. A fraction defective over the given number of integrated circuit chips is calculated as a result of the test conducted. Probe pressure with which the probe styli contact the electrodes on the integrated circuit chips is controlled on the basis of the calculated fraction defective.

    摘要翻译: 测试半导体集成电路,使得探针测针与形成在半导体晶片中的集成电路芯片上的电极接触,以测试集成电路芯片的电路特性。 在给定数量的集成电路芯片上进行测试。 作为进行测试的结果,计算出给定数量的集成电路芯片的部分缺陷。 探针测针与集成电路芯片上的电极接触的探头压力是根据计算出的部分有缺陷来控制的。