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1.发明授权公开(公告)号：US07087467B2
公开(公告)日：2006-08-08
申请号：US10752552
申请日：2004-01-08
CPC分类号： H01L23/49861 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T29/49128 , Y10T428/24917 , H01L2924/00
摘要： A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture which comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.
摘要翻译： 导热基板包括附接到引线框架的导热树脂片部件。 引线框架包括导热树脂片部件，并且与引导框架上的导热树脂片部件一体化。 导热性树脂片部件由热固性树脂混合物形成，该热固性树脂混合物包含70至90重量份的无机填料和5至30重量份的包含热固性树脂的热固性树脂组合物，并且所述热固性树脂为半 固化状态。
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2.发明授权公开(公告)号：US06870244B2
公开(公告)日：2005-03-22
申请号：US10026522
申请日：2001-12-27
IPC分类号： H01L23/373 , H01L23/498 , H05K1/03 , H05K1/05 , H05K3/20 , H01L23/48
CPC分类号： H01L23/49861 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T29/49128 , Y10T428/24917 , H01L2924/00
摘要： A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.
摘要翻译： 导热基板包括附接到引线框架的导热树脂片部件。 引线框架包括导热树脂片部件，并且与引导框架上的导热树脂片部件一体化。 导热性树脂片部件由热固性树脂混合物形成，该热固性树脂混合物包含70至90重量份的无机填料和5至30重量份的包含热固性树脂的热固性树脂组合物，并且所述热固性树脂为半 固化状态。
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公开(公告)号：US06791034B2
公开(公告)日：2004-09-14
申请号：US10238688
申请日：2002-09-10
申请人： Masaki Suzumura , Kazuo Okada , Koichi Hirano , Takaaki Okawa , Shinya Tanaka
发明人： Masaki Suzumura , Kazuo Okada , Koichi Hirano , Takaaki Okawa , Shinya Tanaka
IPC分类号： H05K100
CPC分类号： H05K3/0061 , H01L23/49861 , H01L23/5387 , H01L2924/0002 , H05K3/041 , H05K3/202 , H05K3/28 , H05K2201/0209 , H05K2203/066 , H01L2924/00
摘要： A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.
摘要翻译： 电路板的引线框架在与散热板相反的方向上冲压。 即使由于冲孔产生毛刺，毛刺也不会渗透到薄片或与散热板短路。 抗蚀剂膜在电路板的引线框架的焊盘的周围紧密接触，并且电镀层紧密地接触在焊盘上。 这样可以防止电子元件在地面上的安装不良。
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4.发明授权Circuit board and method for manufacturing the same, and electronic apparatus comprising it 失效电路板及其制造方法以及包括该电路的电子设备公开(公告)号：US06737153B2
公开(公告)日：2004-05-18
申请号：US10088035
申请日：2002-06-28
申请人： Masaki Suzumura , Fumiaki Hashimoto
发明人： Masaki Suzumura , Fumiaki Hashimoto
IPC分类号： H05W702
CPC分类号： H05K1/056 , H01L2924/0002 , H05K1/0373 , H05K3/202 , H05K3/28 , H05K2201/0209 , H05K2201/09881 , Y10S428/901 , Y10T428/12514 , Y10T428/12556 , Y10T428/24917 , Y10T428/31681 , H01L2924/00
摘要： A circuit board comprising a composite resin and a metal plate, the metal plate forming circuit patterns. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a hardener. The metal plate is surface treated to reinforce the adhesion at least at one surface contacting with the composite resin. The composite resin fills spaces between the circuit patterns, and the composite resin composition and the metal plate form a plane at a side of the metal plate for mounting components. Since the resin composition including the inorganic filler is also present in the spaces between circuit patterns of a metal plate, heat dissipation characteristic of the circuit board is extremely high, and is suited for electronic apparatus containing heat generating parts such as power circuit.
摘要翻译： 包括复合树脂和金属板的电路板，金属板形成电路图案。 复合树脂包含70-95重量份的无机填料和5-30重量份的包含热固性树脂和硬化剂的树脂组合物。 至少在与复合树脂接触的一个表面处，对金属板进行表面处理以增强粘合力。 复合树脂填充电路图案之间的空间，并且复合树脂组合物和金属板在用于安装部件的金属板的一侧形成一个平面。 由于包含无机填料的树脂组合物也存在于金属板的电路图案之间的空间中，因此电路板的散热特性非常高，并且适用于包含诸如电源电路的发热部件的电子设备。
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公开(公告)号：US20130170676A1
公开(公告)日：2013-07-04
申请号：US13823762
申请日：2011-10-12
申请人： Tetsushi Itano , Masaki Suzumura
发明人： Tetsushi Itano , Masaki Suzumura
IPC分类号： H04R3/00
摘要： A bond magnet according to the present invention is anisotropic, and a magnetic field is oriented from a lowest edge of side surface of the bond magnet toward an upper section of side surface of the bond magnet. Further, the bond magnet is configured such that the upper section of side surface of the bond magnet is disposed closer to a yoke side surface of a yoke than the lower side surface of the bond magnet is, and the upper section of side surface of the bond magnet faces against the yoke side surface. With this, a magnetic gap is provided between the upper section of side surface of the bond magnet and the yoke side surface. Thus, it is possible to improve a magnetism characteristic of the bond magnet, and to achieve both of magnetic efficiency and productivity of a magnetic circuit for a speaker.
摘要翻译： 根据本发明的粘结磁体是各向异性的，并且磁场从接合磁体的侧表面的最低边缘朝向粘结磁体的侧表面的上部取向。 此外，接合磁铁被配置为使得接合磁体的侧表面的上部设置成比轭合磁体的下侧表面更靠近磁轭的轭侧表面，并且其侧表面的上部 粘结磁体面对轭侧表面。 由此，在接合磁体的侧面的上部与磁轭侧面之间设置有磁隙。 因此，能够提高接合磁铁的磁特性，并且能够实现扬声器的磁路的磁效率和生产率。
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公开(公告)号：US08744116B2
公开(公告)日：2014-06-03
申请号：US13823762
申请日：2011-10-12
申请人： Tetsushi Itano , Masaki Suzumura
发明人： Tetsushi Itano , Masaki Suzumura
IPC分类号： H04R25/00
摘要： A bond magnet according to the present invention is anisotropic, and a magnetic field is oriented from a lowest edge of side surface of the bond magnet toward an upper section of side surface of the bond magnet. Further, the bond magnet is configured such that the upper section of side surface of the bond magnet is disposed closer to a yoke side surface of a yoke than the lower side surface of the bond magnet is, and the upper section of side surface of the bond magnet faces against the yoke side surface. With this, a magnetic gap is provided between the upper section of side surface of the bond magnet and the yoke side surface. Thus, it is possible to improve a magnetism characteristic of the bond magnet, and to achieve both of magnetic efficiency and productivity of a magnetic circuit for a speaker.
摘要翻译： 根据本发明的粘结磁体是各向异性的，并且磁场从接合磁体的侧表面的最低边缘朝向粘结磁体的侧表面的上部取向。 此外，接合磁铁被配置为使得接合磁体的侧表面的上部设置成比轭合磁体的下侧表面更靠近磁轭的轭侧表面，并且其侧表面的上部 粘结磁体面对轭侧表面。 由此，在接合磁体的侧面的上部与磁轭侧面之间设置有磁隙。 因此，能够提高接合磁铁的磁特性，并且能够实现扬声器的磁路的磁效率和生产率。
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7.发明申请Speaker, speaker-use diaphragm, dust cap, production methods and production devices for them 审中-公开扬声器，扬声器使用隔膜，防尘盖，生产方法和生产设备公开(公告)号：US20070131478A1
公开(公告)日：2007-06-14
申请号：US10576964
申请日：2005-02-01
申请人： Masatoshi Okazaki , Masaki Suzumura , Shinya Mizone , Yoshimichi Kajihara , Kazuaki Nishimura , Masahide Sumiyama
发明人： Masatoshi Okazaki , Masaki Suzumura , Shinya Mizone , Yoshimichi Kajihara , Kazuaki Nishimura , Masahide Sumiyama
IPC分类号： H04R7/00
CPC分类号： H04R31/003 , H04R7/12 , H04R2231/001 , H04R2307/021 , H04R2307/025 , H04R2307/029
摘要： A speaker diaphragm or a dust cap formed by injection molding a mixture at least containing a resin material and a fiber material. The speaker diaphragm or the dust cap combines the advantages of both a paper diaphragm and a resin diaphragm. The advantage of a paper diaphragm is a large degree of freedom in setting physical properties. The advantages of a resin diaphragm are being excellent in moisture resistance reliability, strength, external appearance, productivity and dimension stability.
摘要翻译： 通过注射成型至少含有树脂材料和纤维材料的混合物形成的扬声器隔膜或防尘盖。 扬声器隔膜或防尘盖结合了纸张隔膜和树脂膜片的优点。 纸张隔膜的优点是在物理性质方面具有很大的自由度。 树脂隔膜的优点是耐湿可靠性，强度，外观，生产率和尺寸稳定性都优异。
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8.发明申请Diaphragm for Speaker, Method for Producing Same, Speaker Using Such Diaphragm, and Apparatus Using Such Speaker 审中-公开扬声器的隔膜，相同的方法，使用这种隔膜的扬声器，以及使用这种扬声器的设备公开(公告)号：US20080212800A1
公开(公告)日：2008-09-04
申请号：US11883767
申请日：2006-03-30
CPC分类号： B29C45/0005 , B29K2277/10 , B29L2031/3418 , H04R7/02 , H04R31/003
摘要： A diaphragm for a loudspeaker contains resin, aramid fibers, and an organic silicon compound binding the resin with the aramid fibers. By this structure, high elasticity and high internal loss as characteristics of the aramid fibers are maintained; flexibility in the setting of properties of the diaphragm is thus increased. Accordingly, a diaphragm securing humidity resistance reliability and strength, and having a superior appearance can be provided.
摘要翻译： 用于扬声器的隔膜包含树脂，芳族聚酰胺纤维和将树脂与芳族聚酰胺纤维结合的有机硅化合物。 通过这种结构，保持了作为芳族聚酰胺纤维的特性的高弹性和高的内部损失; 因此，提高了隔膜的特性设定的灵活性。 因此，可以提供确保耐湿性可靠性和强度并且具有优异外观的隔膜。
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公开(公告)号：US06600400B1
公开(公告)日：2003-07-29
申请号：US09806670
申请日：2001-06-27
申请人： Kimihiro Andou , Mitsutaka Enomoto , Masaki Suzumura , Katsuhiko Minaga , Shuji Saiki , Sawako Usuki
发明人： Kimihiro Andou , Mitsutaka Enomoto , Masaki Suzumura , Katsuhiko Minaga , Shuji Saiki , Sawako Usuki
IPC分类号： H01F710
CPC分类号： H04R13/02 , G10K9/13 , H04R7/04 , H04R2499/11
摘要： The present invention relates to an electromagnetic electro-acoustic transducer to be used for generating an incoming indicator tone for mobile phones and the like. A resin magnet 11 is formed with a hard magnetic material and a soft magnetic material, the lowest resonant frequency can be easily set by changing the magnetic flux density in a magnetic gap by changing the compound ratio of the soft magnetic material, a high magnetic flux density is attained by increasing the magnetic permeability of the resin magnet 11 with the soft magnetic material, thus achieving a smaller size as well as a higher sound pressure through an increase in the driving force exerted to the diaphragm.
摘要翻译： 本发明涉及用于生成移动电话等的输入指示音的电磁电声换能器。 树脂磁体11由硬磁性材料和软磁性材料形成，通过改变软磁性材料的混合比例，高磁通量，可以容易地设定最小的共振频率来设定磁场的磁通密度 通过用软磁性材料增加树脂磁体11的磁导率来获得密度，从而通过增加施加到隔膜的驱动力来实现更小的尺寸和更高的声压。
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