公开(公告)号：US20080210675A1

公开(公告)日：2008-09-04

申请号：US11933719

申请日：2007-11-01

申请人： Yoshinari Sasaki ,  Kosei Aso ,  Hidehisa Murase ,  Naoki Yamada

发明人： Yoshinari Sasaki ,  Kosei Aso ,  Hidehisa Murase ,  Naoki Yamada

IPC分类号： B23K26/00

CPC分类号： B23K26/16 ,  B23K26/142 ,  B23K26/1476

摘要： Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.

摘要翻译： 公开了一种激光加工装置。 激光加工装置包括照射激光束的激光束源和激光加工头。 激光加工头包括激光束通过的透射窗口，形成在激光头的底部中的孔，并允许激光束经由透射窗口通过，将气体引入激光加工头中的引入孔， 以及将激光加工头中的气体排出到外部的排气孔。 激光加工头还包括将气体引入激光照射区域的周边的空气孔，允许对激光照射区域的环境气体进行放电的空气孔，以及设置在发送窗口和 孔，以及与导入孔和排气孔连通的通气部。

公开(公告)号：US08288681B2

公开(公告)日：2012-10-16

申请号：US11515896

申请日：2006-09-06

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： B23K26/16 ,  H05K3/08 ,  G02F1/1343

CPC分类号： B23K26/142 ,  B23K2103/30 ,  B23K2103/50 ,  G02F1/13439

摘要： A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.

摘要翻译： 提供了一种激光加工装置。 激光加工装置在图案化工序中去除并提取通过用激光照射形成在基板上的透明树脂层而产生的碎屑，并且包括设置在基板上侧的碎屑提取模块，其中，碎屑提取模块抽吸 由于从其下侧照射激光的基板上的透明树脂层产生的升华，热处理和复合作用产生的碎片。

公开(公告)号：US08283596B2

公开(公告)日：2012-10-09

申请号：US12138050

申请日：2008-06-12

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： B23K26/00 ,  B29C35/08

CPC分类号： H05K3/0032 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/123 ,  B23K26/142 ,  B23K26/1462 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  G02F1/1303 ,  G02F1/133371 ,  G02F1/133555 ,  H05K3/0038 ,  H05K2203/082

摘要： A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

摘要翻译： 提供一种激光加工装置，用于用激光图案化形成在基板上的树脂膜或金属膜。 该装置包括激光光源; 以及具有透射窗的碎片收集装置，通过该透射窗透射激光，通过使气体流入树脂膜或金属膜的激光照射区域附近的区域而产生涡流气流的涡流生成机构， 以及具有开口的筛选装置，入射的激光穿过该开口并筛选碎屑流。 该机构靠近树脂膜或基板上的金属膜放置。 通过激光照射产生的碎片和堆叠在物体膜上的前后被夹带在由涡流发生机构产生的涡流气流中，并通过筛分装置排出到外部。

公开(公告)号：US07692115B2

公开(公告)日：2010-04-06

申请号：US11933719

申请日：2007-11-01

申请人： Yoshinari Sasaki ,  Kosei Aso ,  Hidehisa Murase ,  Naoki Yamada

发明人： Yoshinari Sasaki ,  Kosei Aso ,  Hidehisa Murase ,  Naoki Yamada

IPC分类号： B23K26/00 ,  B23K26/12

CPC分类号： B23K26/16 ,  B23K26/142 ,  B23K26/1476

摘要： Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.

摘要翻译： 公开了一种激光加工装置。 激光加工装置包括照射激光束的激光束源和激光加工头。 激光加工头包括激光束通过的透射窗口，形成在激光头的底部中的孔，并允许激光束经由透射窗口通过，将气体引入激光加工头中的引入孔， 以及将激光加工头中的气体排出到外部的排气孔。 激光加工头还包括将气体引入激光照射区域的周边的空气孔，允许对激光照射区域的环境气体进行放电的空气孔，以及设置在发送窗口和 孔，以及与导入孔和排气孔连通的通气部。

公开(公告)号：US20070056941A1

公开(公告)日：2007-03-15

申请号：US11515896

申请日：2006-09-06

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： B23K26/14

CPC分类号： B23K26/142 ,  B23K2103/30 ,  B23K2103/50 ,  G02F1/13439

摘要： A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, including debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.

摘要翻译： 提供了一种激光加工装置。 激光加工装置在图案化处理中，通过激光照射形成在基板上的透明树脂层而产生的碎片，包括设置在基板上侧的碎片提取模块，其中，碎屑提取模块吸取并提取碎屑 升华，热处理及其从其下侧照射激光的基板上的透明树脂层产生的复合作用。

公开(公告)号：US20090068598A1

公开(公告)日：2009-03-12

申请号：US12138050

申请日：2008-06-12

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： G03F7/20 ,  G03B27/32

CPC分类号： H05K3/0032 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/123 ,  B23K26/142 ,  B23K26/1462 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  G02F1/1303 ,  G02F1/133371 ,  G02F1/133555 ,  H05K3/0038 ,  H05K2203/082

摘要： A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

摘要翻译： 提供一种激光加工装置，用于用激光图案化形成在基板上的树脂膜或金属膜。 该装置包括激光光源; 以及具有透射窗的碎片收集装置，通过该透射窗透射激光，通过使气体流入树脂膜或金属膜的激光照射区域附近的区域而产生涡流气流的涡流生成机构， 以及具有开口的筛选装置，入射的激光穿过该开口并筛选碎屑流。 该机构靠近树脂膜或基板上的金属膜放置。 通过激光照射产生的碎片和堆叠在物体膜上的前后被夹带在由涡流发生机构产生的涡流气流中，并通过筛分装置排出到外部。

公开(公告)号：US08581140B2

公开(公告)日：2013-11-12

申请号：US11467407

申请日：2006-08-25

申请人： Kosei Aso ,  Yoshinari Sasaki ,  Hidehisa Murase ,  Naoki Yamada

发明人： Kosei Aso ,  Yoshinari Sasaki ,  Hidehisa Murase ,  Naoki Yamada

IPC分类号： B23K26/14 ,  B23K26/12 ,  B23K26/36

CPC分类号： B23K26/1476 ,  B23K26/123 ,  B23K26/1462 ,  B23K26/364

摘要： A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

摘要翻译： 提供了一种激光加工装置。 激光加工装置包括具有透光窗口，开口部分，出口孔，第一通气孔和第二通气孔的激光加工头。 传输窗口传输照射加工对象的激光。 开口部将透射的激光传递到激光加工头的底部。 出口孔将处理对象的激光照射区域附近的气氛排出到外部。 第一通气孔将气体引导到激光照射区域附近。 第二通气孔在激光照射区域附近排出气氛。 从加工对象产生的碎屑从与设置在激光加工头的底部的开口部连续的出口孔和第二通气孔排出。

公开(公告)号：US07863542B2

公开(公告)日：2011-01-04

申请号：US11467388

申请日：2006-08-25

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： B23K26/16

CPC分类号： B23K26/16 ,  B23K26/1462

摘要： A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.

摘要翻译： 提供了一种激光加工装置。 该激光加工装置用于通过使用激光对在基板上的多层膜上形成的透明导电膜进行图案处理，包括具有涡流生成机构的碎片提取模块，其通过将气体引导到 透明导电膜的激光照射部分。 碎屑提取模块靠近基板设置，并且在沉积之前和在通过激光照射产生的基板上沉积之后的碎片被截留到涡流中以用气体提取到外部。

公开(公告)号：US20070145026A1

公开(公告)日：2007-06-28

申请号：US11467388

申请日：2006-08-25

申请人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

发明人： Hidehisa Murase ,  Yoshinari Sasaki ,  Kosei Aso ,  Naoki Yamada

IPC分类号： B23K26/14

CPC分类号： B23K26/16 ,  B23K26/1462

摘要： A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.

摘要翻译： 提供了一种激光加工装置。 该激光加工装置用于通过使用激光对在基板上的多层膜上形成的透明导电膜进行图案处理，包括具有涡流生成机构的碎片提取模块，其通过将气体引导到 透明导电膜的激光照射部分。 碎屑提取模块靠近基板设置，并且在沉积之前和在通过激光照射产生的基板上沉积之后的碎片被截留到涡流中以用气体提取到外部。

公开(公告)号：US20070210045A1

公开(公告)日：2007-09-13

申请号：US11467407

申请日：2006-08-25

申请人： Kosei Aso ,  Yoshinari Sasaki ,  Naoki Yamada

发明人： Kosei Aso ,  Yoshinari Sasaki ,  Naoki Yamada

IPC分类号： B23K26/00

CPC分类号： B23K26/1476 ,  B23K26/123 ,  B23K26/1462 ,  B23K26/364

摘要： A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

摘要翻译： 提供了一种激光加工装置。 激光加工装置包括具有透光窗口，开口部分，出口孔，第一通气孔和第二通气孔的激光加工头。 传输窗口传输照射加工对象的激光。 开口部将透射的激光传递到激光加工头的底部。 出口孔将处理对象的激光照射区域附近的气氛排出到外部。 第一通气孔将气体引导到激光照射区域附近。 第二通气孔在激光照射区域附近排出大气。 从加工对象产生的碎屑从与设置在激光加工头的底部的开口部连续的出口孔和第二通气孔排出。