摘要:
The substrate coating device (10) includes a slit nozzle (1), a first camera (3), a second camera (4), a control section (5), a pump (8), and a pressure control chamber (9). The control section (5) controls the supply of the coating liquid from the pump (8) to the slit nozzle (1) in accordance with the result of comparison between a bead shape imaged by the first camera (3) and a reference shape. The control section (5) also controls the air pressure on the upstream side of the slit nozzle (1) by the pressure control chamber (9) in accordance with the result of comparison between a distance measured from an image taken by the second camera (4) and a reference distance.
摘要:
A substrate coating device is provided which is capable of reducing non-uniform film thickness areas that take place in a coating start portion and a coating end portion during coating using a slit nozzle coater.The substrate coating device (10) includes at least a slider driving motor (4), a pump (8), a delivery state quantity measuring section (82), and a control section (5). The slider driving motor (4) scans a slit nozzle (1) over a substrate (100) at an established velocity relative to the substrate (100). The pump (8) controls the supply of the coating liquid to the slit nozzle (1). The delivery state quantity measuring section (82) is configured to measure a state quantity indicative of a delivery state of the coating liquid from the tip of the slit nozzle (1). The control section (5) corrects control information to be fed to the slider driving motor (4) in such a manner as to cancel out a difference between control information fed to the pump (8) and measurement information fed from the delivery state quantity measuring section (82) based on difference information indicative of the difference.
摘要:
A substrate coating device is provided which is capable of reducing non-uniform film thickness areas that take place in a coating start portion and a coating end portion during coating using a slit nozzle coater.The substrate coating device (10) includes at least a slider driving motor (4), a pump (8), a delivery state quantity measuring section (82), and a control section (5). The slider driving motor (4) scans a slit nozzle (1) over a substrate (100) at an established velocity relative to the substrate (100). The pump (8) controls the supply of the coating liquid to the slit nozzle (1). The delivery state quantity measuring section (82) is configured to measure a state quantity indicative of a delivery state of the coating liquid from the tip of the slit nozzle (1). The control section (5) corrects control information to be fed to the slider driving motor (4) in such a manner as to cancel out a difference between control information fed to the pump (8) and measurement information fed from the delivery state quantity measuring section (82) based on difference information indicative of the difference.
摘要:
The substrate coating device (10) includes a slit nozzle (1), a first camera (3), a second camera (4), a control section (5), a pump (8), and a pressure control chamber (9). The control section (5) controls the supply of the coating liquid from the pump (8) to the slit nozzle (1) in accordance with the result of comparison between a bead shape imaged by the first camera (3) and a reference shape. The control section (5) also controls the air pressure on the upstream side of the slit nozzle (1) by the pressure control chamber (9) in accordance with the result of comparison between a distance measured from an image taken by the second camera (4) and a reference distance.
摘要:
Provided is a patterning method that can greatly reduce process costs and environmental load. The patterning method includes: a film forming step of forming a functional film (2) on a substrate (1) ; and an etching step of irradiating the substrate with vacuum ultraviolet light (12) from above a mask (4) that is placed on the functional film (2) and has an arbitrarily-defined opening (4A) so as to dry etch the functional film (2) positioned below the opening (4A). The dry etching step can be carried out in an atmosphere containing oxygen. For example, dry air can be used as process gas. In addition, N2 may be supplied as an inert gas to the substrate (1) placed in the atmosphere.
摘要:
A method for controlling a flow rate of a pump (10) transporting a liquid being driven by a drive system having a sliding portion, wherein a flow rate is maintained at a minute first flow rate (R1) at an early stage of operation of the pump (10); and subsequently the flow rate is increased to a steady second flow rate (R). With the method, at the early stage of operation of the pump (10), a state is established beforehand in which the pump (10) is kept stable at the minute first flow rate in order for the stick-slip phenomenon not to occur; and because the flow rate of the pump is increased from the state, transition from static friction to kinetic friction does not occur; and thus a disorderly flow rate of the pump (10) due to the stick-slip phenomenon of a motor (12) is suppressed.This makes it possible to attain a stable control of the flow rate at the early stage of operation of the pump (10).
摘要:
A film in a dry state is efficiently dissolved and removed. A film removing method includes steps of moving a nozzle head (10B) close to a soluble film (201) formed on a substrate (200), forming a liquid pool (302) of chemical liquid (300) between the nozzle head (10B) and the film (201) by continuously and simultaneously discharging and sucking the chemical liquid (300) from the nozzle head (10B), and horizontally moving the substrate (100) in a state in which the nozzle head (10B) and the surface of the film (201) are not contacted so as to relatively move the liquid pool (302) of the chemical liquid on the substrate (100).
摘要:
A film in a dry state is efficiently dissolved and removed. A film removing method includes steps of moving a nozzle head (10B) close to a soluble film (201) formed on a substrate (200), forming a liquid pool (302) of chemical liquid (300) between the nozzle head (10B) and the film (201) by continuously and simultaneously discharging and sucking the chemical liquid (300) from the nozzle head (10B), and horizontally moving the substrate (100) in a state in which the nozzle head (10B) and the surface of the film (201) are not contacted so as to relatively move the liquid pool (302) of the chemical liquid on the substrate (100).