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1.发明授权Carrier unit for a semiconductor device and semiconductor socket using the same 有权用于半导体器件的载体单元和使用其的半导体插座公开(公告)号：US07411794B2
公开(公告)日：2008-08-12
申请号：US11387797
申请日：2006-03-24
IPC分类号： H05K5/00
CPC分类号： G01R1/0483
摘要： In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.
摘要翻译： 在载体单元中，在载体单元21中的电极片32上放置用于将裸片稳定地平行于电极片32的平坦表面的姿势稳定构件30。
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2.发明申请Carrier unit for a semiconductor device and semiconductor socket using the same 有权用于半导体器件的载体单元和使用其的半导体插座公开(公告)号：US20060232291A1
公开(公告)日：2006-10-19
申请号：US11387797
申请日：2006-03-24
IPC分类号： G01R31/02
CPC分类号： G01R1/0483
摘要： In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.
摘要翻译： 在载体单元中，在载体单元21中的电极片32上放置用于将裸片稳定地平行于电极片32的平坦表面的姿势稳定构件30。
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公开(公告)号：US20050250363A1
公开(公告)日：2005-11-10
申请号：US11166383
申请日：2005-06-27
CPC分类号： H05K7/1023 , H01R12/82
摘要： The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
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公开(公告)号：US06910898B2
公开(公告)日：2005-06-28
申请号：US10614196
申请日：2003-07-08
CPC分类号： H05K7/1023 , H01R12/82
摘要： The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
摘要翻译： 按压盖的盖体具有用于按压裸片的各个侧面的端部的接触片中的基板的按压部分的片状片。
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公开(公告)号：US07159292B2
公开(公告)日：2007-01-09
申请号：US11010669
申请日：2004-12-14
IPC分类号： B23P6/00
CPC分类号： H01R13/22 , H01R43/002 , H05K3/4007 , H05K2201/0367 , H05K2203/0278 , H05K2203/0307 , H05K2203/1152 , Y10T29/49002 , Y10T29/49117 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49718 , Y10T29/49725
摘要： While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.
摘要翻译： 虽然具有预定表面粗糙度的转印板10的转印表面10a与形成在基板44M上的接触片44上的多个凸起44B接触，该基片44 M的线膨胀系数大于转印系数 板10在预定压力下，将衬底44M和转印板10加热到预定温度，以将凸块44B的表面粗糙度恢复到预定值。
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公开(公告)号：US08312626B2
公开(公告)日：2012-11-20
申请号：US12516155
申请日：2008-09-02
IPC分类号： H01R43/04
CPC分类号： G01R3/00 , G01R1/06716 , Y10T29/49121 , Y10T29/49204 , Y10T29/49218 , Y10T29/4979
摘要： To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off.By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.
摘要翻译： 当探头接触的基板端部断裂并切断时，使压裂位置以高精度方便地进行控制。 通过用推动部件压缩基板端部的前表面，沿着雕刻槽在基板上产生脆性断裂，并且将基板端部与基板切断。 上述断裂中的断裂位置被控制为沿着断裂位置，其延伸部将两个压裂控制结构的应力集中端部置于其上。 这里，压裂控制结构通过光刻的对准技术在基板的正面上位置精度高。 以这种方式，可以以高精度稳定地形成由从作为基板11a的端部的压裂位置突出的端部构成的弹性电枢。
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公开(公告)号：US20100050431A1
公开(公告)日：2010-03-04
申请号：US12516155
申请日：2008-09-02
IPC分类号： H01R43/16
CPC分类号： G01R3/00 , G01R1/06716 , Y10T29/49121 , Y10T29/49204 , Y10T29/49218 , Y10T29/4979
摘要： To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off.By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.
摘要翻译： 当探头接触的基板端部断裂并切断时，使压裂位置以高精度方便地进行控制。 通过用推动部件压缩基板端部的前表面，沿着雕刻槽在基板上产生脆性断裂，并且将基板端部与基板切断。 上述断裂中的断裂位置被控制为沿着断裂位置，其延伸部将两个压裂控制结构的应力集中端部置于其上。 这里，压裂控制结构通过光刻的对准技术在基板的正面上位置精度高。 以这种方式，可以以高精度稳定地形成由从作为基板11a的端部的压裂位置突出的端部构成的弹性电枢。
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公开(公告)号：US20050102828A1
公开(公告)日：2005-05-19
申请号：US11010669
申请日：2004-12-14
CPC分类号： H01R13/22 , H01R43/002 , H05K3/4007 , H05K2201/0367 , H05K2203/0278 , H05K2203/0307 , H05K2203/1152 , Y10T29/49002 , Y10T29/49117 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49718 , Y10T29/49725
摘要： While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.
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公开(公告)号：US06905952B2
公开(公告)日：2005-06-14
申请号：US10443813
申请日：2003-05-23
CPC分类号： H01L21/4846 , H01L2924/0002 , H05K3/225 , H05K3/4007 , H01L2924/00
摘要： While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.
摘要翻译： 虽然具有预定表面粗糙度的转印板10的转印表面10a与形成在基板44M上的接触片44上的多个凸起44B接触，该基片44 M的线膨胀系数大于转印系数 板10在预定压力下，将衬底44M和转印板10加热到预定温度，以将凸块44B的表面粗糙度恢复到预定值。
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公开(公告)号：US06439552B1
公开(公告)日：2002-08-27
申请号：US09423205
申请日：1999-11-03
申请人： Satoshi Ageishi , Hiroshi Amano , Yoshio Narumiya , Toru Uchikoshi , Shoji Konta , Yoshinori Wakabayashi , Takeyoshi Shinbori , Takeshi Uchida
发明人： Satoshi Ageishi , Hiroshi Amano , Yoshio Narumiya , Toru Uchikoshi , Shoji Konta , Yoshinori Wakabayashi , Takeyoshi Shinbori , Takeshi Uchida
IPC分类号： F16F500
摘要： The overhead wire tensioning device of the present invention is improved in reliability and eliminates the need for constant maintenance work by protecting the slide mechanism between the cylinder case of the gas spring type overhead wire tensioning device and the cylinder rod, and the pivoting mechanism for the connecting rod connecting this cylinder with the overhead wire from external influences.
摘要翻译： 本发明的架空线张紧装置的可靠性提高，并且通过保护气弹簧式架空线张紧装置的气缸壳体与气缸杆之间的滑动机构，以及用于 将该气缸与架空线连接的连杆从外部影响。
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