利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.028 秒)

    Oxygen absorbent
    3.
    发明授权
    Oxygen absorbent 失效
    吸氧剂

    公开(公告)号：US4192773A

    公开(公告)日：1980-03-11

    申请号：US934489

    申请日：1978-08-17

    申请人： Yoshio Yoshikawa ,  Takanari Nawata ,  Akira Amemiya ,  Toshio Komatsu ,  Yoshiaki Inoue ,  Megumu Yuyama

    发明人： Yoshio Yoshikawa ,  Takanari Nawata ,  Akira Amemiya ,  Toshio Komatsu ,  Yoshiaki Inoue ,  Megumu Yuyama

    IPC分类号： A23L3/34 ,  A23L3/3436 ,  B01D53/14 ,  B01J20/02 ,  B01J31/26 ,  B01J27/08

    CPC分类号： B01D53/1493 ,  A23L3/3436

    摘要： An oxygen absorbent comprising (a) metal halide-coated metal powder having at least one metal halide coated on the surface of at least one metal powder, the amount of metal halide coated being in the range of from about 0.001 part to about 10 parts by weight per 100 parts by weight of the metal powder, and the water content of the metal halide-coated metal powder being less than 1% by weight on the basis of total weight of the metal halide-coated metal powder an (b) a water-containing material and a process for producing the same are disclosed.

    摘要翻译： 一种氧吸收剂，其包含（a）金属卤化物涂覆的金属粉末，其具有涂覆在至少一种金属粉末的表面上的至少一种金属卤化物，涂覆的金属卤化物的量在约0.001份至约10份的范围内， 重量每100重量份的金属粉末，金属卤化物涂覆的金属粉末的水含量基于金属卤化物涂覆的金属粉末的总重量小于1重量％a（b）水 并且公开了其制造方法。

    Method of bonding a metal by solder
    6.
    发明授权
    Method of bonding a metal by solder 失效
    通过焊料接合金属的方法

    公开(公告)号：US5305948A

    公开(公告)日：1994-04-26

    申请号：US67599

    申请日：1993-05-27

    申请人： Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Teruo Takeuchi ,  Kazuo Fujinami

    发明人： Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Teruo Takeuchi ,  Kazuo Fujinami

    IPC分类号： B23K1/20 ,  B23K35/36 ,  H05K3/34 ,  B23K35/363 ,  B23K35/38 ,  H01L21/50 ,  H01L21/54

    CPC分类号： B23K1/203 ,  B23K35/3612 ,  B23K35/3616 ,  H05K3/3489 ,  Y10T29/49146

    摘要： The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

    摘要翻译： 通过在包含金属的部件的金属表面（作为焊料粘合的部分）上施加包含卤素化合物的比例为0.2％以下的卤素的后通量进行焊接， 一个不透气的容器与防锈剂包一起以密封的方式。 本发明的方法以非常简单的方式以低成本，通过将包含金属的构件保持在其中不存在氧，水分或腐蚀性物质的还原气氛中，并以 该还原气体与包括金属构件的材料共存，并且使用含有少量卤素的助熔剂容易实现焊料的良好的接合性能。 因此，在焊接后不需要通过有机卤素系溶剂去除焊剂，可以简化清洗工序，降低成本。

    Inhibitor parcel and method for preserving electronic devices or electronic parts
    8.
    发明授权
    Inhibitor parcel and method for preserving electronic devices or electronic parts 失效
    用于保护电子设备或电子部件的抑制剂包裹和方法

    公开(公告)号：US5510166A

    公开(公告)日：1996-04-23

    申请号：US381403

    申请日：1995-01-31

    申请人： Yoshiaki Inoue ,  Shigeru Murabayashi ,  Yoshio Yoshikawa ,  Takeshi Nagasaka ,  Yoshihiko Harima ,  Isamu Yoshino

    发明人： Yoshiaki Inoue ,  Shigeru Murabayashi ,  Yoshio Yoshikawa ,  Takeshi Nagasaka ,  Yoshihiko Harima ,  Isamu Yoshino

    IPC分类号： B32B5/26 ,  B65D81/26 ,  B32B9/00

    CPC分类号： B32B5/26 ,  Y10S428/913 ,  Y10T428/1307 ,  Y10T428/1334 ,  Y10T428/1366 ,  Y10T428/23 ,  Y10T428/234 ,  Y10T428/239 ,  Y10T428/24562

    摘要： Disclosed are an inhibitor parcel comprising (a) a composition comprising an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point unwoven fabric onto the other side of the base sheet, said permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2.Atm.Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 H.sub.2 O mg.Atm/O.sub.2 ml! or above at 25.degree. C. at a relative humidity of 50% and said composition (a) being parcelled by said permeable diffusing-parcelling material (b) and an inhibitor parcel for use in electronic devices and electronic parts which comprises said inhibitor parcel and a method for preserving electronic devices and electronic parts using said inhibitor parcel.

    摘要翻译： 公开了一种抑制剂包，其包含（a）包含不饱和脂肪酸化合物作为其主要成分的组合物和（b）通过将透氧性树脂层层压并粘合到制成的基片的一侧而制备的可渗透扩散分解材料 纤维材料和粘合剂或由纤维材料制成的基片的一个粘合剂涂布面上，然后层压并粘合到透氧树脂层上并层压和粘合低软化点树脂的多孔膜或低 软质点无纺织物在基片的另一侧上，透氧扩散分解材料（b）具有104至106ml / m 2的透氧性.Atm.Day和（水蒸汽透过率/氧透过率）比为0.02 [H2O mg.Atm / O 2 ml]或以上，相对湿度为50％的25℃，所述组合物（a）由所述可渗透扩散分解材料（b）和用于电子的抑制剂包裹 IC器件和包括所述抑制剂包裹的电子部件以及使用所述抑制剂包裹保存电子器件和电子部件的方法。

    Inhibitor parcel and method for preserving electronic devices or electronic parts
    9.
    发明授权
    Inhibitor parcel and method for preserving electronic devices or electronic parts 失效
    用于保护电子设备或电子部件的抑制剂包裹和方法

    公开(公告)号：US5415907A

    公开(公告)日：1995-05-16

    申请号：US599525

    申请日：1990-10-18

    申请人： Yoshiaki Inoue ,  Shigeru Murabayashi ,  Yoshio Yoshikawa ,  Takeshi Nagasaka ,  Yoshihiko Harima ,  Isamu Yoshino

    发明人： Yoshiaki Inoue ,  Shigeru Murabayashi ,  Yoshio Yoshikawa ,  Takeshi Nagasaka ,  Yoshihiko Harima ,  Isamu Yoshino

    IPC分类号： B32B5/26 ,  B65D81/26 ,  B29D22/00 ,  B32B3/00 ,  F17C11/00

    CPC分类号： B32B5/26 ,  Y10S428/913 ,  Y10T428/1307 ,  Y10T428/1334 ,  Y10T428/1366 ,  Y10T428/23 ,  Y10T428/234 ,  Y10T428/239 ,  Y10T428/24562

    摘要： Disclosed are an inhibitor parcel including (a) a composition including an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point nonwoven fabric onto the other side of the base sheet, the permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2. Atm. Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 [H.sub.2 O mg.Atm/O.sub.2 ml] or above at 25.degree. C. at a relative humidity of 50% and the composition (a) being parcelled by the permeable diffusing-parcelling material (b) and an inhibitor parcel for use in electronic devices and electronic parts which includes the inhibitor parcel and a method for preserving electronic devices and electronic parts using the inhibitor parcel.

    摘要翻译： 公开了一种抑制剂包，其包括（a）包含不饱和脂肪酸化合物作为其主要成分的组合物和（b）通过将透氧性树脂层层压并粘合到制成的基材片的一面上而制备的可渗透扩散分解材料 纤维材料和粘合剂或由纤维材料制成的基片的一个粘合剂涂布面上，然后层压并粘合到透氧树脂层上并层压和粘合低软化点树脂的多孔膜或低 软化点无纺织物在基片的另一侧，透氧扩散分解材料（b）的透氧度为104〜106ml / m 2。 atm。 日和相对湿度为50％的25℃下的（水蒸气渗透性/氧气渗透性）比为0.02 [H 2 O·mg·A·m 2 O 2·ml]或更高，组合物（a） 分配材料（b）和用于包括抑制剂包裹的电子设备和电子部件的抑制剂包裹以及使用该抑制剂包裹保存电子设备和电子部件的方法。

    Adhesive solid having anti-mutual adhesion, method of producing the same and method of packaging the same
    10.
    发明授权
    Adhesive solid having anti-mutual adhesion, method of producing the same and method of packaging the same 失效
    具有抗相互粘合性的粘合剂固体，其制造方法和包装方法

    公开(公告)号：US07010901B2

    公开(公告)日：2006-03-14

    申请号：US10463864

    申请日：2003-06-18

    申请人： Kazuhiro Ogura ,  Yoshio Yoshikawa

    发明人： Kazuhiro Ogura ,  Yoshio Yoshikawa

    IPC分类号： B65B29/00

    CPC分类号： B65B63/08

    摘要： A method of producing a hot melt adhesive solid, the method comprising the steps of inserting a hot melt adhesive heated to higher than a flow temperature into a container having a mold-releasing internal surface and a bottom plate which is openable and closable or removably fixable to the container, cooling the hot melt adhesive at least until the surface of hot melt adhesive becomes solidified, and taking out the hot melt adhesive from the container by opening the bottom plate or displacing the same; hot melt adhesive solid; method of packaging the same; and method of transporting the same.

    摘要翻译： 一种制造热熔粘合剂固体的方法，所述方法包括以下步骤：将加热到高于流动温度的热熔粘合剂插入具有脱模内表面的容器和可打开和关闭或可拆卸地固定的底板 至少容易地将热熔粘合剂冷却至热熔粘合剂的表面固化，并且通过打开底板或使其移位而从容器中取出热熔粘合剂; 热熔胶固体; 包装方法相同; 及其运输方法。