摘要:
A substrate processing apparatus that is arranged adjacent to an exposure device includes a processing section including a first processing unit and a second processing unit. The first processing unit includes a development region, a first cleaning region, and a first transport region. The development region and the first cleaning region are arranged opposite to each other with the first transport region interposed therebetween. The second processing unit includes a reversing region, a second cleaning region, and a second transport region. The reversing region and the second cleaning region are arranged opposite to each other with the second transport region interposed therebetween. The second processing unit is arranged between the first processing unit and the exposure device. The substrate processing apparatus also includes a transfer section coupled to the processing section and an interface configured to receive and transfer the substrate between the processing section and the exposure device.
摘要:
In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.
摘要:
A deck movable between cassettes arranged on a base for storing a plurality of substrates in multiple stages and a substrate cleaning section for cleaning the substrates, supports a substrate fetching arm for fetching the substrates from the cassettes, and a cleaned substrate depositing arm for depositing treated substrates. The depositing arm is vertically movable between a position in which a substrate supporting surface thereof is situated below a substrate supporting surface of the substrate fetching arm to render the latter operative, and a position in which the supporting surface of the depositing arm is situated above the supporting surface of the fetching arm to render the depositing arm operative.
摘要:
An interface apparatus for transferring substrates between processing apparatus which provide various treatments for the substrates. The interface apparatus includes a transfer mechanism which, during a normal operation, receives substrates from an upstream processing apparatus and delivers the substrates to a downstream processing apparatus. Upon occurrence of a trouble in the downstream processing apparatus, the substrates transported from the upstream processing apparatus to the transfer mechanism are deposited in a substrate storage by a depositing and fetching mechanism. After the trouble is eliminated, the transfer mechanism delivers the substrates taken out of the storage to the downstream processing apparatus.
摘要:
In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.
摘要:
A substrate treating apparatus includes a substrate treating station for performing a predetermined treatment of substrates by supplying a predetermined treating solution to the substrates, and at least one treating solution supply mechanism for supplying the treating solution in a forced feed under gas pressure to the substrate treating station. The solution supply mechanism has a treating solution storage tank, a pressurizing mechanism, a pressure release mechanism and a valve for selectively allowing and stopping supply of the treating solution. The storage tank begins to be pressurized a predetermined time before the treating solution is supplied to a first substrate in a lot including a plurality of substrates to be treated successively with the same solution. Pressure is released from the storage tank based on a time at which the treating solution is stopped being supplied to a last substrate in the lot or at a predetermined slightly later time. Such control is effected lot by lot. Gas dissolution in the treating solution is reduced without using an expensive gas which would result in high running cost.
摘要:
A substrate processing apparatus is arranged adjacent to an exposure device and includes a processing section, a transfer section configured to carry the substrate into and out of the processing section, and an interface configured to receive and transfer the substrate between the processing section and the exposure device. The processing section includes a first processing unit having a photosensitive film formation region, a thermal processing region having a first thermal processing unit, and a first transport region having a first transport unit. The photosensitive film formation region is arranged opposite the thermal processing region with the first transport region interposed therebetween. The processing section also includes a second processing unit having a first development region, a second development region, and a second transport region having a second transport unit. The first development region is arranged opposite to the second development region with the second transport region interposed therebetween.
摘要:
A substrate holding apparatus includes a rotary table rotatable about a vertical center axis for supporting a substrate in a horizontal plane, and substrate travel regulating pins fixed to the rotary table and arranged at positions in contact with the outer edge of the substrate so that the center of gravity of the substrate supported on the rotary table is spaced from the center axis for regulating the travel of the substrate in a horizontal direction. Centrifugal force generated with respect to the substrate when the rotary table rotates about the center axis, urges the periphery of the substrate towards the travel regulating pins so that the resulting frictional force prevents rotary slippage between the substrate and the rotary table as rotation of the latter relates to the latter. The structure of this apparatus is simple because the substrate holding portion does not include a movable portion. It is easy to mount a substrate onto this apparatus because it is not necessary to align the orientation flat and the like at a predetermined position.
摘要:
A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.
摘要:
An improved swing type substrate cleaning apparatus comprises a substrate chuck for holding the substrate while rotating the same, a cleaning brush holding apparatus for holding a cleaning brush while rotating the same, a cleaning brush elevating apparatus for holding the cleaning brush holding apparatus in a manner enabling elevation and swing of the same, and a buffer apparatus for reducing the velocity at which the cleaning brush elevating apparatus lowers the cleaning brush holding apparatus when the cleaning brush is lowered to be in contact with the substrate. Since the velocity with which the cleaning brush is lowered is reduced to be lower than a prescribed value by means of the buffer apparatus, no significant shock is created when the cleaning brush is brought into contact with the substrate.