公开(公告)号：US07980255B2

公开(公告)日：2011-07-19

申请号：US11846400

申请日：2007-08-28

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B3/04

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没液体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20100006124A1

公开(公告)日：2010-01-14

申请号：US12345605

申请日：2008-12-29

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Hoaquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Hoaquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B5/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US06955516B2

公开(公告)日：2005-10-18

申请号：US10286404

申请日：2002-11-01

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： H01L21/304 ,  H01L21/00 ,  B65G1/133

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20070295371A1

公开(公告)日：2007-12-27

申请号：US11846400

申请日：2007-08-28

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B1/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20060174921A1

公开(公告)日：2006-08-10

申请号：US11398058

申请日：2006-04-04

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

公开(公告)号：US20050241684A1

公开(公告)日：2005-11-03

申请号：US11179926

申请日：2005-07-12

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： H01L21/304 ,  H01L21/00 ,  B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

公开(公告)号：US20050229426A1

公开(公告)日：2005-10-20

申请号：US11054336

申请日：2005-02-09

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B05D3/02 ,  F26B3/00 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  H01L21/67034

摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

摘要翻译： 在第一方面中，提供了干燥基板的第一种方法。 第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。 干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

公开(公告)号：US20060201532A1

公开(公告)日：2006-09-14

申请号：US11080959

申请日：2005-03-14

申请人： Guy Shirazi

发明人： Guy Shirazi

IPC分类号： B08B3/12 ,  B08B3/00

CPC分类号： B08B3/12 ,  H01L21/67057

摘要： In a first aspect, a method is provided for cleaning a substrate without scrubbing the substrate. Two different megasonic frequencies are applied to the substrate. Preferably two different fluids, each having a different ph, are used to apply the two different megasonic frequencies. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种清洗衬底而不洗涤衬底的方法。 将两个不同的兆声频率施加到基底。 优选地，使用两个不同的流体，每个具有不同的ph，以应用两个不同的兆声波频率。 提供了许多其他方面。