Organometallic precursor for forming metal pattern and method of forming metal pattern using the same
    2.
    发明授权
    Organometallic precursor for forming metal pattern and method of forming metal pattern using the same 失效
    用于形成金属图案的有机金属前体和使用其形成金属图案的方法

    公开(公告)号:US06599587B2

    公开(公告)日:2003-07-29

    申请号:US10238595

    申请日:2002-09-11

    IPC分类号: B05D306

    摘要: Disclosed is an organometallic precursor for forming a metal pattern, having a structure defined by the following Formula 1, and a method of forming the metal pattern using the same, in which the conductive metal pattern is readily formed through an exposing step without using a photo-resist. L′—M—L  Formula 1 wherein, M is a transition metal selected from the group consisting of Ag, Au, Cu, Pd, Ni, and Pt; L is an imidazolylidene compound having a structure defined by the following Formula 2; and L′ is an imidazolylidene compound having a structure defined by the following Formula 2 or a &bgr;-diketonate compound having a structure defined by the following Formula 3: wherein, R1, R2, R3, and R4 are independently a hydrogen atom, or alkyl group, alkenyl group, alkynyl group, carboxyl group, alkoxy group, or ester group with 1 to 20 carbons, or aromatic hydrocarbon group with 6 to 20 carbons; and wherein, R5, R6, and R7 are independently a hydrogen atom, or alkyl group, alkenyl group, alkynyl group, carboxyl group, alkoxy group, or ester group with 1 to 20 carbons, or aromatic hydrocarbon group with 6 to 20 carbons.

    摘要翻译: 公开了一种用于形成具有由下式1定义的结构的金属图案的有机金属前体,以及使用该金属图案形成金属图案的方法,其中通过曝光步骤容易地形成导电金属图案而不使用照片 其中M是选自Ag,Au,Cu,Pd,Ni和Pt的过渡金属; L是具有由下式2定义的结构的咪唑基亚基化合物; 并且L'是具有由下式2定义的结构的咪唑并噻唑化合物或具有由下式3定义的结构的β-二酮化合物:其中,R 1,R 2,R 3和R 4独立地为氢原子或烷基 碳原子数1〜20的烷基或碳原子数为6〜20的芳香族烃基, 其中,R 5,R 6和R 7独立地为氢原子或烷基,烯基,炔基,羧基,烷氧基或碳原子数为1〜20的酯基,或碳原子数为6〜20的芳香族烃基。

    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    3.
    发明授权
    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition 失效
    用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法

    公开(公告)号:US08715914B2

    公开(公告)日:2014-05-06

    申请号:US12929151

    申请日:2011-01-04

    IPC分类号: G03C1/735

    CPC分类号: G03F7/0043 G03F7/0042

    摘要: An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness, and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.

    摘要翻译: 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。

    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    4.
    发明授权
    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition 有权
    用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法

    公开(公告)号:US07883838B2

    公开(公告)日:2011-02-08

    申请号:US10718809

    申请日:2003-11-24

    IPC分类号: B01J31/12 C08F4/42

    CPC分类号: G03F7/0043 G03F7/0042

    摘要: An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.

    摘要翻译: 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。

    Organometallic precursor for forming metal pattern and method of forming metal pattern using the same
    5.
    发明授权
    Organometallic precursor for forming metal pattern and method of forming metal pattern using the same 有权
    用于形成金属图案的有机金属前体和使用其形成金属图案的方法

    公开(公告)号:US06774034B2

    公开(公告)日:2004-08-10

    申请号:US10425882

    申请日:2003-04-30

    IPC分类号: H01L214763

    摘要: An organometallic precursor for forming a metal pattern and a method of forming the metal pattern using the same, in which an electrically conductive metal pattern is formed using an organometallic precursor, through an exposing step without using a separate photosensitive resin. The exposure time required to dissociate the organic ligands from the metals of the organometallic precursor is very short making the overall patterning process very efficient.

    摘要翻译: 用于形成金属图案的有机金属前体和使用其形成金属图案的方法,其中使用有机金属前体形成导电金属图案,通过不使用单独的感光树脂的曝光步骤。 将有机配体从有机金属前体的金属中解离所需的暴露时间非常短,使整个图案化过程非常有效。

    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition
    6.
    发明申请
    Organometallic composition for forming a metal alloy pattern and a method of forming such a pattern using the composition 失效
    用于形成金属合金图案的有机金属组合物和使用该组合物形成这种图案的方法

    公开(公告)号:US20110104617A1

    公开(公告)日:2011-05-05

    申请号:US12929151

    申请日:2011-01-04

    IPC分类号: G03F7/20

    CPC分类号: G03F7/0043 G03F7/0042

    摘要: An organometallic composition containing an organometallic compound (I) containing Ag, an organometallic compound (II) containing Au, Pd, or Ru, and an organometallic compound (III) containing Ti, Ta, Cr, Mo, Ru, Ni, Pd, Cu, Au, or Al, wherein the metal components of organometallic compounds (II) and (III), respectively, are present in an amount of 0.01˜10 mol % based on the amount of Ag in the organometallic compound (I), and a method of forming a metal alloy pattern using the same. Silver alloy patterns can be obtained through a simplified manufacturing process, which patterns have enhanced heat resistance, adhesiveness, and chemical stability. The method may be applied to making a reflective film for LCD and metal wiring (gate, source, drain electrode) for flexible displays or flat panel displays, and further to CMP-free damascene processing and PR-free ITO film deposition.

    摘要翻译: 含有含Ag的有机金属化合物(I),含有Au,Pd或Ru的有机金属化合物(II)和含有Ti,Ta,Cr,Mo,Ru,Ni,Pd,Cu的有机金属化合物(III)的有机金属组合物 ,Au或Al,其中有机金属化合物(II)和(III)的金属组分分别以有机金属化合物(I)中的Ag的量为0.01〜10摩尔%,和 使用其形成金属合金图案的方法。 可以通过简化的制造工艺获得银合金图案,该图案具有增强的耐热性,粘合性和化学稳定性。 该方法可以应用于制造用于LCD和用于柔性显示器或平板显示器的LCD和金属布线(栅极,源极,漏极)的反射膜,并且还可用于制造无CMP的镶嵌加工和无PR的ITO膜沉积。