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公开(公告)号：USD599750S1
公开(公告)日：2009-09-08
申请号：US29325554
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
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公开(公告)号：US08388177B2
公开(公告)日：2013-03-05
申请号：US13363879
申请日：2012-02-01
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V7/04
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译： 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。
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公开(公告)号：US20100001306A1
公开(公告)日：2010-01-07
申请号：US12204260
申请日：2008-09-04
申请人： Young Sam PARK , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
发明人： Young Sam PARK , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.
摘要翻译： 本发明提供了一种发光二极管封装，其包括具有空腔的引线框架; 模具暴露空腔并容纳引线框架; 以及安装在腔体上的LED芯片，其中通过LED芯片的上边缘的光通过腔体的上边缘。
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公开(公告)号：USD595247S1
公开(公告)日：2009-06-30
申请号：US29325559
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
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公开(公告)号：USD595245S1
公开(公告)日：2009-06-30
申请号：US29325555
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
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公开(公告)号：US08258526B2
公开(公告)日：2012-09-04
申请号：US12204260
申请日：2008-09-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.
摘要翻译： 本发明提供了一种发光二极管封装，其包括具有空腔的引线框架; 模具暴露空腔并容纳引线框架; 以及安装在腔体上的LED芯片，其中通过LED芯片的上边缘的光通过腔体的上边缘。
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公开(公告)号：US08132935B2
公开(公告)日：2012-03-13
申请号：US12535251
申请日：2009-08-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V7/04
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译： 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。
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公开(公告)号：US20120127705A1
公开(公告)日：2012-05-24
申请号：US13363879
申请日：2012-02-01
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V21/005 , F21V5/04 , F21V21/00
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译： 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。
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公开(公告)号：US20100053956A1
公开(公告)日：2010-03-04
申请号：US12535251
申请日：2009-08-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译： 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。
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公开(公告)号：USD595246S1
公开(公告)日：2009-06-30
申请号：US29325557
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
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