公开(公告)号：US20130032943A1

公开(公告)日：2013-02-07

申请号：US13476609

申请日：2012-05-21

Applicant: Young-Jin CHO

Inventor： Young-Jin CHO

IPC: H01L23/48

CPC classification number: H05K1/181 ,  G09G3/3225 ,  G09G3/3648 ,  G09G2300/04 ,  H01L23/15 ,  H01L23/48 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other.

Abstract translation: 半导体器件包括：半导体芯片，其包括彼此间隔开的第一电路和第二电路，没有将第一电路和第二电路彼此电连接的内部布线，其上设置有半导体芯片的基板， 以及布置在基板上并将第一电路和第二电路彼此电连接的基板布线。