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公开(公告)号：US5980822A
公开(公告)日：1999-11-09
申请号：US9309
申请日：1998-01-20
申请人： Young-Zoon Moon , Jae-Ho Han , Chul-Woo Park
发明人： Young-Zoon Moon , Jae-Ho Han , Chul-Woo Park
CPC分类号： B23K35/262
摘要： A leadless alloy for soldering containing 0.1 to 5.0% bismuth, 0.1 to 5.0% silver, 0.1 to 3.0% antimony, 0.1 to 5.5% copper, 0.001 to 0.01% phosphorus, 0.01 to 0.1% germanium and 81.4 to 99.6% tin by weight.
摘要翻译： 一种用于焊接的无铅合金，其含有0.1至5.0％的铋，0.1至5.0％的银，0.1至3.0％的锑，0.1至5.5％的铜，0.001至0.01％的磷，0.01至0.1％的锗和81.4至99.6重量％的锡。
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公开(公告)号：US6126060A
公开(公告)日：2000-10-03
申请号：US238494
申请日：1999-01-27
申请人： Young-Zoon Moon
发明人： Young-Zoon Moon
CPC分类号： B23K1/08 , H05K3/3468 , B23K2201/42 , H05K2203/0763 , H05K3/3447
摘要： A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.
摘要翻译： 一种适用于浸渍方法的焊接装置，即使安装到PCB基板（P）的部件的引线（L）之间的空间相对较窄，防止相邻引线（L）不熔融在铅（Pb）中，该器件具有引线 其中熔融铅被填充到其上端并保持在预定温度，所述装置包括设置在引导槽的上表面处的接收板，并形成有用于与PCB基板的焊接部分接触的接收单元， 引线，安装在用于PCB基板的接收板上的固定单元，其被容纳，从接收单元分离并固定到接收单元，以及设置成水平和倾斜地升高接收板的高度。
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