摘要:
A dynamic semiconductor memory device is made up of a plurality of dynamic memory cells arrayed along a plurality of bit line pairs, and a plurality of dynamic sense amplifiers associated with the plurality of bit line pairs, each sense amplifier having a pair of MOS transistors connected to a corresponding pair of bit lines. In one embodiment, the first and second transistors of one of the sense amplifiers and the first and second transistors of another sense amplifier adjacent thereto are positioned within a region defined by two adjacent pairs of bit lines. Each of the bit line pairs has first and second bit lines extending in a first direction perpendicular to a second direction in which the source and drain regions are formed in the semiconductor substrate so that the transistors of the sense amplifiers are arranged one for every four bit lines in the second direction.
摘要:
A random-access memory includes an array of rows and columns of memory cells. Word lines are associated with rows of memory cells, bit lines lines are with columns of memory cells. A row decoder and a core control circuit are connected to the word lines. A column decoder and a sense amplifier circuit are connected to the bit lines. An individual cell may be addressed by addressing an individual column through a column decoder controlling the voltage on each word line, and through a row decoder controlling the voltage on each word line in response to specified row and column addresses input via row and column address buffers. A booster circuit provides the row decoder with a boosted voltage as a word-line drive voltage. This voltage has been transmitted to a pre-decoder section in the core control circuit before the row address is acquired in the row decoder.
摘要:
A dynamic random-access memory includes a plurality of spaced-apart memory cell blocks each of said memory cell blocks including rows and columns of memory cells arranged in a matrix on a substrate. Bit lines and word lines are connected to the rows and columns of memory cells in each cell block. PMOS sense amplifier sections and NMOS sense amplifier sections are associated with the memory cell blocks respectively. PMOS driver transistors for the PMOS sense amplifier sections are distributed among the PMOS sense amplifier sections such that a PMOS transistor is located between every two neighboring PMOS sense amplifier sections. NMOS driver transistors for the NMOS sense amplifier sections are distributed among the NMOS sense amplifier sections such that a NMOS transistor is located between every two neighboring NMOS sense amplifier sections. Source voltage supply lines extend in a corresponding word-line snap region between two neighboring cell blocks, and are connected to the PMOS and NMOS driver transistors, for supplying these transistors with a first and a second source voltage independently of each other.
摘要:
A dynamic semiconductor memory device is made up of a plurality of dynamic memory cells arrayed along a plurality of bit line pairs, and a plurality of dynamic sense amplifiers associated with the plurality of bit line pairs, each sense amplifier having a pair of MOS transistors connected to a corresponding pair of bit lines. In one embodiment, the first and second transistors of one of the sense amplifiers and the first and second transistors of another sense amplifier adjacent thereto are positioned within a region defined by two adjacent pairs of bit lines. Each of the bit line pairs has first and second bit lines extending in a first direction perpendicular to a second direction in which the source and drain regions are formed in the semiconductor substrate so that the transistors of the sense amplifiers are arranged one for every four bit lines in the second direction.
摘要:
A dynamic semiconductor memory device is made up of a plurality of dynamic memory cells arrayed along a plurality of bit line pairs, and a plurality of dynamic sense amplifiers associated with the plurality of bit line pairs, each sense amplifier having a pair of MOS transistors connected to a corresponding pair of bit lines. In one embodiment, the first and second transistors of one of the sense amplifiers and the first and second transistors of another sense amplifier adjacent thereto are positioned within a region defined by two adjacent pairs of bit lines. Each of the bit line pairs has first and second bit lines extending in a first direction perpendicular to a second direction in which the source and drain regions are formed in the semiconductor substrate so that the transistors of the sense amplifiers are arranged one for every four bit lines in the second direction.
摘要:
A dynamic random-access memory has bit-line pairs, word lines intersecting with the bit-line pairs, and memory cells arranged at the intersections of the bit-line pairs and the word lines, and sense amplifiers provided for the bit-line pairs, respectively. One of every two neighboring bit-line pairs is twisted at one portion, thus forming a twisted crossing section. The twisted crossing section is made of the parts of the gate electrodes of the transistors incorporated in the sense amplifier connected to the twisted bit-line pair. The bit-line pairs is twisted at a portion substantially middle with respect to the direction in which it extends, and the sensr amplifier associated with this bit-line pair is located at the twisted portion thereof.
摘要:
A dynamic random access memory has a substrate, plural pairs of parallel bit lines provided on the substrate, parallel word lines insulatively crossing the parallel bit lines to define cross points therebetween, and memory cells provided at the cross points. Each memory cell has a data storage capacitor and a transistor. Sense amplifiers are provided at bit line pairs, respectively, to sense a data voltage. A discharge control section, which is associated with the sense amplifiers, forms discharge paths branched between the bit line pairs and the substrate grounded to progress the discharging of charges, when a certain word line is designated and a memory cell is selected from those memory cells which are connected to the certain word line, whereby the operational speed of the memory is increased.
摘要:
A dynamic-type semiconductor memory device comprises bit lines, every two bit lines forming a folded bit line pair, every two pairs forming a bit-line unit such that one of the bit lines of the first pair extends between the bit lines of the second pair, and the bit lines of the second pair are twisted at middle portion, word lines intersecting with the bit lines, dummy word lines, extending parallel to the word lines, two of the dummy word lines being arranged on one side of the crossing portions of the bit lines of the second pair, and the other two of the dummy word lines being arranged on the other side of the crossing portions of the bit lines of the second pair, memory cells connected to selected ones of the intersections of the bit lines and the word lines, such that any adjacent memory cells connected to the same word line form a group which is arranged every two bit lines, and any adjacent two memory cells connected to the same bit line are shifted by half-pitch distance with respect to the corresponding two adjacent memory cells connected to either adjacent bit line, a plurality of dummy cells connected to selected ones of the intersections of the bit lines and the word lines, such that at least one dummy cell is connected to each bit line, and sense amplifiers provided for the pairs of bit lines, respectively.
摘要:
A semiconductor memory device includes a memory cell array having a plurality of memory cells, the memory cell array being divided into a plurality of blocks, a plurality first bitlines arranged in each of the blocks, the plurality of first bitlines forming a plurality of first bitline pair each having a folded bitline structure with two of the plurality of first bitlines as a basic unit, a plurality second bitlines arranged to correspond to at least one of the blocks and formed above the first bitlines, the plurality of second bitlines forming a plurality of second bitline pair each having a folded bitline structure with two of the plurality of second bitlines as a basic unit, a plurality of sense amplifier circuits, arranged to correspond to the plurality of second bitline pairs, for detecting and amplifying information stored in the memory cells, and a plurality of select circuits for selecting one of two of first bitlines included in one of the plurality of first bitline pairs to selectively connect a selected first bitline with one of two of second bitlines included in one of the plurality of second bitline pairs.
摘要:
A MOS type random access memory disclosed has a plurality of pairs of sequentially aligned folded type bit lines each of which has a first bit line and a second bit line. Memory cells are arranged at points of intersection between a memory cell word line and the first bit lines. Dummy cells are arranged at points of intersection of a dummy cell word line and the second bit lines. Sense amplifier circuits are connected to the bit line pairs, respectively. In a data read mode of the memory, when a bit data is read from a certain memory cell which is connected to a first word line selected and a first bit line of a selected bit line pair, a second bit line onto which a data voltage is read from a dummy cell of the selected bit line pair is forcedly fixed to a precharge voltage produced by a precharge voltage generator in a presented time interval after the first word line is selected and before a certain sense amplifier circuit connected to the selected bit line pair gets activated, whereby interference noise may be eliminated which is introduced onto the selected bit line pair from a bit line pair adjacent to the selected bit line pair.