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公开(公告)号：US20070023691A1
公开(公告)日：2007-02-01
申请号：US11483614
申请日：2006-07-11
IPC分类号： H01S3/00
CPC分类号： B23K26/364 , B23K26/0613 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/172
摘要： A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
摘要翻译： 一种激光加工装置，包括：卡盘台，用激光束照射夹持台上的工件的激光束照射装置，以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。 激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置 。 第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。
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公开(公告)号：US07473866B2
公开(公告)日：2009-01-06
申请号：US11483614
申请日：2006-07-11
CPC分类号： B23K26/364 , B23K26/0613 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/172
摘要： A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
摘要翻译： 一种激光加工装置，包括：卡盘台，激光束照射夹持台上夹持的工件的激光束照射装置，以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。 激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置 。 第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。
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公开(公告)号：US20060203222A1
公开(公告)日：2006-09-14
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
IPC分类号： G03B27/58
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： To prevent heating of a holding table that holds a wafer when using a laser beam to process a wafer, a wafer holding mechanism has a wafer holder having a holding surface that holds a wafer and a suction part formed on an outer peripheral side of the wafer holder, with the wafer held to the holding surface by a suction force transmitted to the holding surface from the suction part through an outer peripheral edge part of the wafer holder. The wafer can be held in place with suction without forming fine holes that penetrate the wafer holder from a front surface thereof to a back surface thereof, and therefore a material of good permeability and dispersibility with respect to the wavelength of the laser light can be selected for the wafer holder.
摘要翻译： 为了防止在使用激光束处理晶片时保持晶片的保持台的加热，晶片保持机构具有晶片保持器，该晶片保持器具有保持晶片的保持表面和形成在晶片的外周侧的吸引部分 保持器，其中晶片通过来自抽吸部分的透镜通过晶片保持器的外周边缘部分传递到保持表面的吸力保持在保持表面上。 可以通过抽吸将晶片保持在适当位置，而不会形成从其前表面到其后表面穿透晶片保持器的细孔，因此可以选择相对于激光的波长具有良好的渗透性和分散性的材料 用于晶片座。
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公开(公告)号：US07557904B2
公开(公告)日：2009-07-07
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
摘要翻译： 一种晶片保持机构，用于利用吸力将带有胶带的胶片固定在框架上。 晶片保持机构包括抽吸体，具有用于通过带保持晶片的保持表面的晶片保持器和具有设置在晶片保持器的外周边缘处的抽吸部分的抽吸单元。 抽吸部分穿过保持表面穿过晶片保持器的外周边缘传递吸力，使得当吸引部分被带覆盖和密封时，晶片保持器被保持在抽吸单元处，并且晶片保持在 保持表面。
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公开(公告)号：US07601616B2
公开(公告)日：2009-10-13
申请号：US11826911
申请日：2007-07-19
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。
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公开(公告)号：US20080020548A1
公开(公告)日：2008-01-24
申请号：US11826911
申请日：2007-07-19
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。
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公开(公告)号：US07408129B2
公开(公告)日：2008-08-05
申请号：US11593045
申请日：2006-11-06
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。
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公开(公告)号：US20070109526A1
公开(公告)日：2007-05-17
申请号：US11593045
申请日：2006-11-06
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。
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公开(公告)号：US07642485B2
公开(公告)日：2010-01-05
申请号：US11338761
申请日：2006-01-25
IPC分类号： B23K26/02
CPC分类号： B23K37/0235 , B23K26/0622 , B23K26/0853 , B23K26/0876 , B23K26/40 , B23K37/0408 , B23K37/0435 , B23K2103/172 , B23K2103/50
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，以及用于移动卡盘台和激光束施加装置的加工进给装置 相对于彼此，其中所述卡盘台包括主体和设置在所述主体的顶表面上的工件保持构件，并且所述工件保持构件由透射具有预定波长的激光束的材料制成。
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公开(公告)号：US20080003708A1
公开(公告)日：2008-01-03
申请号：US11819673
申请日：2007-06-28
申请人： Hitoshi Hoshino , Koji Yamaguchi , Kenji Furuta , Hiroshi Morikazu , Ryugo Oba , Yukio Morishige
发明人： Hitoshi Hoshino , Koji Yamaguchi , Kenji Furuta , Hiroshi Morikazu , Ryugo Oba , Yukio Morishige
IPC分类号： H01L21/30
CPC分类号： H01L33/0095 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011
摘要： To provide a method of processing a sapphire substrate, where reduction in luminance of light emitting devices can be suppressed if a sapphire substrate is divided into individual light emitting devices by irradiation of a laser beam, a pulsed laser beam having a small pulse energy of 0.6 μJ to 10 μJ, and an extremely small pulse width in a range of femto-second is irradiated to the sapphire substrate while a condensing point is positioned within each of regions corresponding to predetermined division lines on the sapphire substrate so that affected zones are formed, thereby the laser beam can be irradiated even at a high peak power density of 4×1013 W/cm2 to 5×1015 W/cm2, consequently each of the affected zones can be formed at only a desired condensing point within the sapphire substrate, and necessary processing can be performed while damage to nitride semiconductors or the sapphire substrate is minimized.
摘要翻译： 为了提供一种处理蓝宝石衬底的方法，其中如果通过激光束的照射将蓝宝石衬底分成单独的发光器件，则可以抑制发光器件的亮度降低，脉冲能量为0.6的脉冲激光束 在蓝宝石衬底上照射到毫微微秒范围内的非常小的脉冲宽度，同时聚光点位于与蓝宝石衬底上的预定划分线对应的每个区域内，形成影响区域， 从而激光束即使在4×10 13 W / cm 2至高达5×10 15 W / cm 2的高峰值功率密度下也能够照射 > 2 ，因此每个受影响的区域可以仅形成在蓝宝石衬底内的期望的凝聚点处，并且可以执行必要的处理，同时对氮化物半导体或蓝宝石衬底的损伤最小化。
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