公开(公告)号：US20080003708A1

公开(公告)日：2008-01-03

申请号：US11819673

申请日：2007-06-28

申请人： Hitoshi Hoshino ,  Koji Yamaguchi ,  Kenji Furuta ,  Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige

发明人： Hitoshi Hoshino ,  Koji Yamaguchi ,  Kenji Furuta ,  Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige

IPC分类号： H01L21/30

CPC分类号： H01L33/0095 ,  B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011

摘要： To provide a method of processing a sapphire substrate, where reduction in luminance of light emitting devices can be suppressed if a sapphire substrate is divided into individual light emitting devices by irradiation of a laser beam, a pulsed laser beam having a small pulse energy of 0.6 μJ to 10 μJ, and an extremely small pulse width in a range of femto-second is irradiated to the sapphire substrate while a condensing point is positioned within each of regions corresponding to predetermined division lines on the sapphire substrate so that affected zones are formed, thereby the laser beam can be irradiated even at a high peak power density of 4×1013 W/cm2 to 5×1015 W/cm2, consequently each of the affected zones can be formed at only a desired condensing point within the sapphire substrate, and necessary processing can be performed while damage to nitride semiconductors or the sapphire substrate is minimized.

摘要翻译： 为了提供一种处理蓝宝石衬底的方法，其中如果通过激光束的照射将蓝宝石衬底分成单独的发光器件，则可以抑制发光器件的亮度降低，脉冲能量为0.6的脉冲激光束 在蓝宝石衬底上照射到毫微微秒范围内的非常小的脉冲宽度，同时聚光点位于与蓝宝石衬底上的预定划分线对应的每个区域内，形成影响区域， 从而激光束即使在4×10 13 W / cm 2至高达5×10 15 W / cm 2的高峰值功率密度下也能够照射 > 2 ，因此每个受影响的区域可以仅形成在蓝宝石衬底内的期望的凝聚点处，并且可以执行必要的处理，同时对氮化物半导体或蓝宝石衬底的损伤最小化。

公开(公告)号：US07601616B2

公开(公告)日：2009-10-13

申请号：US11826911

申请日：2007-07-19

申请人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

发明人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/50

摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.

摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。

公开(公告)号：US20080020548A1

公开(公告)日：2008-01-24

申请号：US11826911

申请日：2007-07-19

申请人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

发明人： Hiroshi Morikazu ,  Ryugo Oba ,  Yukio Morishige ,  Toshio Tsuchiya ,  Koji Yamaguchi

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/50

摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.

摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。

公开(公告)号：US20080047408A1

公开(公告)日：2008-02-28

申请号：US11892150

申请日：2007-08-20

申请人： Ryugo Oba ,  Hiroshi Morikazu ,  Kenji Furuta ,  Yohei Yamashita

发明人： Ryugo Oba ,  Hiroshi Morikazu ,  Kenji Furuta ,  Yohei Yamashita

IPC分类号： B26D3/00

CPC分类号： H01L21/78 ,  Y10T83/0524

摘要： A method of dividing a wafer having devices in areas sectioned by lattice pattern-like streets on the front surface and a metal layer formed on the rear surface along the streets, comprising the steps of cutting the wafer with a cutting blade from the front surface side along the streets to form a cut groove, leaving behind a remaining portion having a predetermined thickness from the rear surface; and applying a laser beam along the cut groove formed by the above cut groove forming step to cut the remaining portion and the metal layer.

摘要翻译： 一种在前表面上由格子状街道划分的区域中的装置分割晶片的方法以及沿着街道形成在后表面上的金属层的方法，包括以下步骤：从前表面侧切割晶片 沿着街道形成切割槽，从后表面留出具有预定厚度的剩余部分; 以及沿着由上述切槽形成步骤形成的切割槽施加激光束以切割剩余部分和金属层。

公开(公告)号：US08610030B2

公开(公告)日：2013-12-17

申请号：US11783190

申请日：2007-04-06

申请人： Ryugo Oba ,  Hiroshi Morikazu

发明人： Ryugo Oba ,  Hiroshi Morikazu

IPC分类号： B23K26/02

CPC分类号： B23K26/0853 ,  B23K26/0736

摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis at the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal spot should follow along the processing line based on the X, Y coordinate values of the detected current position and the X, Y coordinate values of the processing line stored in the storage means.

摘要翻译： 一种激光束处理机，包括用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，加工进给装置，分度供给装置，用于检测进给量的加工进给量检测装置 ，分度供给量检测装置和控制装置，其中构成激光束施加装置的电容器包括用于将焦点形成为椭圆形的椭圆点形成装置和用于转动椭圆焦点的焦斑转动装置 在其中心的光轴上; 并且所述控制装置包括用于存储在所述工件上形成的处理线的X，Y坐标值的存储装置，基于来自所述处理对象的检测信号，获得所述激光束施加位置的当前位置的X，Y坐标值， 进给量检测装置和分度供给量检测装置，并且控制焦点转动装置，以基于检测到的当前位置的X，Y坐标值，确保焦斑的长轴沿着处理线跟随， 存储在存储装置中的处理线的X，Y坐标值。

公开(公告)号：US08049133B2

公开(公告)日：2011-11-01

申请号：US12110965

申请日：2008-04-28

申请人： Ryugo Oba ,  Hiroshi Morikazu

发明人： Ryugo Oba ,  Hiroshi Morikazu

IPC分类号： B23K26/073

CPC分类号： B23K26/0736 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/067 ,  B23K26/0676 ,  B23K26/0853

摘要： A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a first laser beam and a second laser beam; a rotary half-wave plate disposed between the laser beam oscillator and the beam splitter; a condenser lens disposed in a first optical path for guiding the first laser beam split by the beam splitter; a first reflecting mirror disposed in a second optical path for guiding the second laser beam split by the beam splitter; a first quarter-wave plate disposed between the beam splitter and the first reflecting mirror; a second reflecting mirror disposed in a third optical path for splitting thereinto the second laser beam returned to the beam splitter through the second optical path; a second quarter-wave plate disposed between the beam splitter and the second reflecting mirror; and a cylindrical lens disposed between the beam splitter and the second quarter-wave plate.

摘要翻译： 一种激光束加工设备，包括激光束照射单元，所述激光束照射单元包括：用于振荡激光束的激光束振荡器; 由激光束振荡器振荡的激光束通过该分束器被分成第一激光束和第二激光束; 设置在激光束振荡器和分束器之间的旋转半波片; 聚光透镜，设置在第一光路中，用于引导由分束器分裂的第一激光束; 第一反射镜，设置在第二光路中，用于引导由分束器分裂的第二激光束; 设置在分束器和第一反射镜之间的第一四分之一波长板; 第二反射镜，设置在第三光路中，用于将通过第二光路返回到分束器的第二激光束分离; 设置在分束器和第二反射镜之间的第二四分之一波片; 以及设置在分束器和第二四分之一波片之间的柱面透镜。

公开(公告)号：US20070235430A1

公开(公告)日：2007-10-11

申请号：US11783190

申请日：2007-04-06

申请人： Ryugo Oba ,  Hiroshi Morikazu

发明人： Ryugo Oba ,  Hiroshi Morikazu

IPC分类号： B23K26/03 ,  B23K26/06

CPC分类号： B23K26/0853 ,  B23K26/0736

摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis as the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal spot should follow along the processing line based on the X, Y coordinate values of the detected current position and the X, Y coordinate values of the processing line stored in the storage means.

摘要翻译： 一种激光束处理机，包括用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，加工进给装置，分度供给装置，用于检测进给量的加工进给量检测装置 ，分度供给量检测装置和控制装置，其中构成激光束施加装置的电容器包括用于将焦点形成为椭圆形的椭圆点形成装置和用于转动椭圆焦点的焦斑转动装置 在光轴上作为其中心; 并且所述控制装置包括用于存储在所述工件上形成的处理线的X，Y坐标值的存储装置，基于来自所述处理对象的检测信号，获得所述激光束施加位置的当前位置的X，Y坐标值， 进给量检测装置和分度供给量检测装置，并且控制焦点转动装置，以基于检测到的当前位置的X，Y坐标值，确保焦斑的长轴沿着处理线跟随， 存储在存储装置中的处理线的X，Y坐标值。

公开(公告)号：US20080296275A1

公开(公告)日：2008-12-04

申请号：US12110965

申请日：2008-04-28

申请人： Ryugo Oba ,  Hiroshi Morikazu

发明人： Ryugo Oba ,  Hiroshi Morikazu

IPC分类号： B23K26/067 ,  B23K26/06

CPC分类号： B23K26/0736 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/067 ,  B23K26/0676 ,  B23K26/0853

摘要： A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a first laser beam and a second laser beam; a rotary half-wave plate disposed between the laser beam oscillator and the beam splitter; a condenser lens disposed in a first optical path for guiding the first laser beam split by the beam splitter; a first reflecting mirror disposed in a second optical path for guiding the second laser beam split by the beam splitter; a first quarter-wave plate disposed between the beam splitter and the first reflecting mirror; a second reflecting mirror disposed in a third optical path for splitting thereinto the second laser beam returned to the beam splitter through the second optical path; a second quarter-wave plate disposed between the beam splitter and the second reflecting mirror; and a cylindrical lens disposed between the beam splitter and the second quarter-wave plate.

摘要翻译： 一种激光束加工设备，包括激光束照射单元，所述激光束照射单元包括：用于振荡激光束的激光束振荡器; 由激光束振荡器振荡的激光束通过该分束器被分成第一激光束和第二激光束; 设置在激光束振荡器和分束器之间的旋转半波片; 聚光透镜，设置在第一光路中，用于引导由分束器分裂的第一激光束; 第一反射镜，设置在第二光路中，用于引导由分束器分裂的第二激光束; 设置在分束器和第一反射镜之间的第一四分之一波长板; 第二反射镜，设置在第三光路中，用于将通过第二光路返回到分束器的第二激光束分离; 设置在分束器和第二反射镜之间的第二四分之一波片; 以及设置在分束器和第二四分之一波片之间的柱面透镜。

公开(公告)号：US07642485B2

公开(公告)日：2010-01-05

申请号：US11338761

申请日：2006-01-25

申请人： Noboru Takeda ,  Hiroshi Morikazu ,  Satoshi Genda ,  Yukio Morishige

发明人： Noboru Takeda ,  Hiroshi Morikazu ,  Satoshi Genda ,  Yukio Morishige

IPC分类号： B23K26/02

CPC分类号： B23K37/0235 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/40 ,  B23K37/0408 ,  B23K37/0435 ,  B23K2103/172 ,  B23K2103/50

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，以及用于移动卡盘台和激光束施加装置的加工进给装置 相对于彼此，其中所述卡盘台包括主体和设置在所述主体的顶表面上的工件保持构件，并且所述工件保持构件由透射具有预定波长的激光束的材料制成。

公开(公告)号：US20060203222A1

公开(公告)日：2006-09-14

申请号：US11360814

申请日：2006-02-24

申请人： Naoki Ohmiya ,  Satoshi Genda ,  Noboru Takeda ,  Koichi Takeyama ,  Yukio Morishige ,  Hiroshi Morikazu ,  Hiroshi Nomura

发明人： Naoki Ohmiya ,  Satoshi Genda ,  Noboru Takeda ,  Koichi Takeyama ,  Yukio Morishige ,  Hiroshi Morikazu ,  Hiroshi Nomura

IPC分类号： G03B27/58

CPC分类号： G03F7/707 ,  B23K26/40 ,  B23K37/0408 ,  B23K2101/40 ,  B23K2103/50 ,  B25B11/005 ,  B28D5/0094 ,  H01L21/6838

摘要： To prevent heating of a holding table that holds a wafer when using a laser beam to process a wafer, a wafer holding mechanism has a wafer holder having a holding surface that holds a wafer and a suction part formed on an outer peripheral side of the wafer holder, with the wafer held to the holding surface by a suction force transmitted to the holding surface from the suction part through an outer peripheral edge part of the wafer holder. The wafer can be held in place with suction without forming fine holes that penetrate the wafer holder from a front surface thereof to a back surface thereof, and therefore a material of good permeability and dispersibility with respect to the wavelength of the laser light can be selected for the wafer holder.

摘要翻译： 为了防止在使用激光束处理晶片时保持晶片的保持台的加热，晶片保持机构具有晶片保持器，该晶片保持器具有保持晶片的保持表面和形成在晶片的外周侧的吸引部分 保持器，其中晶片通过来自抽吸部分的透镜通过晶片保持器的外周边缘部分传递到保持表面的吸力保持在保持表面上。 可以通过抽吸将晶片保持在适当位置，而不会形成从其前表面到其后表面穿透晶片保持器的细孔，因此可以选择相对于激光的波长具有良好的渗透性和分散性的材料 用于晶片座。