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1.发明申请SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT 有权半导体器件具有这样的封装，其中底板和盖板的部分从封装露出并且由基板覆盖的基板的表面部分覆盖公开(公告)号：US20090008760A1
公开(公告)日：2009-01-08
申请号：US12233170
申请日：2008-09-18
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
摘要翻译： 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。
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2.发明申请SEMICONDUCTOR DEVICE FOR ACCOMMODATING LARGE CHIPS, FABRICATION METHOD THEREOF, AND CARRIER USED IN THE SEMICONDUCTOR DEVICE 有权用于容纳大型电池的半导体器件，其制造方法和半导体器件中使用的载体公开(公告)号：US20060273442A1
公开(公告)日：2006-12-07
申请号：US11163309
申请日：2005-10-13
IPC分类号： H01L23/24
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
摘要翻译： 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。
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3.发明申请SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT 有权半导体器件具有这样的封装，其中底板和盖板的部分从封装露出并且由基板覆盖的基板的表面部分覆盖公开(公告)号：US20110129966A1
公开(公告)日：2011-06-02
申请号：US13023185
申请日：2011-02-08
IPC分类号： H01L21/52
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
摘要翻译： 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。
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4.发明授权Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant 有权半导体器件具有倒角的密封剂，使得衬底和倒角的部分从密封剂暴露，并且衬底表面的剩余部分被密封剂覆盖公开(公告)号：US07884456B2
公开(公告)日：2011-02-08
申请号：US12233170
申请日：2008-09-18
IPC分类号： H01L23/02
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
摘要翻译： 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。
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公开(公告)号：US07985618B2
公开(公告)日：2011-07-26
申请号：US13023185
申请日：2011-02-08
IPC分类号： H01L21/00
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
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6.发明授权Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant 有权用作多媒体存储卡的半导体装置，具有倒角的封装剂，使得衬底和倒角的部分从密封剂暴露出来，并且衬底表面的剩余部分被密封剂覆盖公开(公告)号：US07443016B2
公开(公告)日：2008-10-28
申请号：US11163309
申请日：2005-10-13
CPC分类号： H01L25/18 , H01L21/565 , H01L23/04 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/15162 , H01L2924/181 , H01L2924/19105 , H05K3/284 , H05K2201/09127 , H01L2224/85 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.
摘要翻译： 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。
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