摘要:
A semiconductor memory device and a method of generating a chip selection signal that enable the analysis of the causes of defects of defective memory devices selected by a user from a system with a plurality of memory devices and the fixing the defects are provided. The semiconductor memory device includes a programming register, an input buffer control circuit, and a chip selection circuit. The programming register activates an output signal in response to an address and a command input from the outside. The input buffer control circuit activates the plurality of data input buffer circuits in response to the output signal of the programming register. The chip selection circuit activates a defect detecting & repairing circuit, such as a repair circuit or a test time shortening circuit, when at least one of output signals of the plurality of data input buffer circuits is in a first logic state.
摘要:
Circuits and methods for refreshing memory banks in a DRAM are provided. A refresh circuit is provided in a DRAM having at least one memory bank and a plurality of word lines connected to memory locations in the memory bank. The word lines are subdivided into first and second groups of subword lines. The refresh circuit includes a delay circuit, a first driving circuit, and a second driving circuit. The delay circuit receives a refresh signal and outputs a delayed refresh signal a predetermined time delay later. The first driving circuit responds to the refresh signal by driving word lines in the first group of subword lines and the second driving circuit responds to the delayed refresh signal by driving word lines in the second group of subword lines.
摘要:
A semiconductor memory device, having a test mode and a normal mode, includes a frequency multiplier and a test command sequence generator. The frequency multiplier receives a test clock signal in the test mode and generates multiple internal test clock signals, each of which has a frequency equal to a frequency of an operation clock signal in the normal mode. The test clock signal has a frequency lower than the frequency of the operation clock signal. The test command sequence generator generates at least one command signal in response to the internal test clock signals in the test mode. The at least one command signal corresponds to at least one operation timing parameter of the semiconductor memory device that is to be measured. The frequency multiplier may include a Phase Locked Loop (PLL) or a Delay Locked Loop (DLL).
摘要:
Integrated circuit memory devices include a memory cell array that is configured to write N data bits in parallel and a write data path that is configured to serially receive 2N data bits from an external terminal. The write data path includes 2N write data buffers that are configured to store the 2N data bits, 2N switches, and N data lines that are configured to connect at least N of the 2N switches to the memory cell array to write therein N data bits in parallel. A reduced number of local data lines and/or global data lines may be provided.
摘要:
Integrated circuit memory devices include a rectangular integrated circuit memory device substrate that includes a pair of short sides, a pair of long sides and a pair of opposing faces. The substrate also includes an array of memory cells and peripheral circuits therein. A plurality of spaced apart rows of input/output pads on one of the faces extend parallel to the short sides. The face is free of (i.e. does not include) a row of input/output pads that extends parallel to the long sides. The input/output pads are preferably arranged on the integrated circuit memory device substrate, relative to the circuits in the integrated circuit memory device substrate. More specifically, the integrated circuit memory device includes a plurality of memory cell array blocks, first decoder blocks and second decoder blocks in the substrate. A respective first decoder block extends parallel to the short sides adjacent a respective memory cell array block and opposite a short side. A respective second decoder block extends parallel to the long sides, between adjacent memory cell array blocks. The plurality of input/output pads are included between the short sides and the memory cell array blocks adjacent thereto and between the first decoder blocks.
摘要:
A sense amplifier includes a reference signal providing unit and an internal sense amplification unit. The reference signal providing unit provides a reference bit line signal in response to a reference control signal. The internal sense amplification unit receives the reference bit line signal and data signals that correspond to the data. The received signals are provided through bit lines connected to the memory cell array. The internal sense amplification unit senses the received reference bit line signal and the data signals and amplifies the sensed signals. The sense amplifier senses data stored in memory cells connected to dummy bit lines of the outmost memory cell array of a semiconductor memory device such that the memory cells that are not used can be used. Accordingly, the design area and cost of the semiconductor memory device can be reduced.
摘要:
A sense amplifier includes a reference signal providing unit and an internal sense amplification unit. The reference signal providing unit provides a reference bit line signal in response to a reference control signal. The internal sense amplification unit receives the reference bit line signal and data signals that correspond to the data. The received signals are provided through bit lines connected to the memory cell array. The internal sense amplification unit senses the received reference bit line signal and the data signals and amplifies the sensed signals. The sense amplifier senses data stored in memory cells connected to dummy bit lines of the outmost memory cell array of a semiconductor memory device such that the memory cells that are not used can be used. Accordingly, the design area and cost of the semiconductor memory device can be reduced.
摘要:
A semiconductor memory device that minimizes chip area is provided. The semiconductor memory device includes local input/output (I/O) lines, global I/O lines, and a memory core that is coupled between a bit line and a complementary bit line. The memory core includes a memory cell array, a bit line equalizer circuit, a PMOS sense amplifier (S/A), a PMOS S/A driving circuit for driving the PMOS S/A, a transmission gate circuit, an NMOS S/A, and an NMOS S/A driving circuit for driving the NMOS S/A. First and second transistors for connecting the local I/O lines to the global I/O lines are installed between adjacent bit lines. The PMOS S/A driving circuit, which is a first driving transistor, and the NMOS S/A driving circuit, which is a second driving transistor, are also installed between adjacent bit lines. Because the semiconductor memory device arranges a PMOS S/A driving circuit, an NMOS S/A driving circuit, and a gating circuit for connecting local I/O lines to global I/O lines, between adjacent bit lines, the chip area is reduced.
摘要翻译:提供了最小化芯片面积的半导体存储器件。 半导体存储器件包括本地输入/输出(I / O)线,全局I / O线和耦合在位线和互补位线之间的存储器核。 存储器芯包括存储单元阵列,位线均衡器电路,PMOS读出放大器(S / A),用于驱动PMOS S / A的PMOS S / A驱动电路,传输门电路,NMOS S / A 以及用于驱动NMOS S / A的NMOS S / A驱动电路。 用于将本地I / O线连接到全局I / O线的第一和第二晶体管安装在相邻位线之间。 作为第一驱动晶体管的PMOS S / A驱动电路和作为第二驱动晶体管的NMOS S / A驱动电路也安装在相邻位线之间。 由于半导体存储器件在相邻位线之间配置PMOS S / A驱动电路,NMOS S / A驱动电路和用于将本地I / O线连接到全局I / O线的选通电路,芯片面积减小 。
摘要:
A method and circuit are provided for driving a word line. The word line driving circuit includes first and second power drivers, a switching unit and a word line driver. The first power driver is driven to a boosting voltage level and the second power driver is driven to an internal power voltage level. The switching unit transfers a first output of the first power driver to the word line driver in response to a first switching signal and transfers a second output of the second power driver to the word line driver in response to a second switching signal. The word line driver alternately drives a word line to the first output and the second output transferred from the switching unit in response to a word line driving signal.
摘要:
A semiconductor memory device includes a plurality of memory banks. A refresh control block is responsive to a control address that identifies at least one of the plurality of memory banks to be refreshed. The refresh control block is configured to control refreshing of the at least one of the plurality of memory banks to be refreshed. The control address is used during read and/or write operations of the plurality of memory banks.