摘要:
A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.
摘要:
A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. The useful life of each plane mirror can be prolonged without displacing the optical axis itself by overcoming the problem that when the laser beam is employed as the light source and a thin beam with a high illumination density is illuminated to the same position on each of the first and second plane mirrors for a long time, the surface of the plane mirror is deteriorated, the reflectance is reduced, and the light quantity cannot be held at a required level.
摘要:
A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.
摘要:
The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
摘要:
A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.
摘要:
The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
摘要:
A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.
摘要:
A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.
摘要:
A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.
摘要:
A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.