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公开(公告)号：US20130068434A1
公开(公告)日：2013-03-21
申请号：US13699971
申请日：2010-05-28
申请人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
发明人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
IPC分类号： F28F3/00
CPC分类号： F28F3/005 , F28F3/025 , F28F3/027 , F28F3/12 , F28F2265/32 , F28F2280/04 , H01L23/473 , H01L2924/0002 , Y10T29/494 , H01L2924/00
摘要： In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions ormed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.
摘要翻译： 在热交换器中，翅片被简单且精确地定位在适当的位置，并且有效地交换热量而不增加制造成本，并且多个波纹状板状翅片沿壳体中的冷却剂的流动方向设置。 热交换器具有：连接部件，其连接翅片之间的相邻翅片; 连接部件上的突起; 以及用于定位形成在壳体中的翅片的定位孔。 相邻的翅片沿着冷却剂流动方向以预定的间隔设置，并且通过将突起装配在定位孔中而沿与冷却剂流动方向正交的方向上具有预定的偏移量。
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公开(公告)号：US08944147B2
公开(公告)日：2015-02-03
申请号：US13699971
申请日：2010-05-28
申请人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
发明人： Yuya Takano , Yasuji Taketsuna , Eisaku Kakiuchi , Katsuhiko Tatebe , Masahiro Morino , Tomohiro Takenaga
IPC分类号： F28F3/02 , F28F3/12 , H01L23/473
CPC分类号： F28F3/005 , F28F3/025 , F28F3/027 , F28F3/12 , F28F2265/32 , F28F2280/04 , H01L23/473 , H01L2924/0002 , Y10T29/494 , H01L2924/00
摘要： In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.
摘要翻译： 在热交换器中，翅片被简单且精确地定位在适当的位置，并且有效地交换热量而不增加制造成本，并且多个波纹状板状翅片沿壳体中的冷却剂的流动方向设置。 热交换器具有：连接部件，其连接翅片之间的相邻翅片; 在连接部分上形成的突起; 以及用于定位形成在壳体中的翅片的定位孔。 相邻的翅片沿着冷却剂流动方向以预定的间隔设置，并且通过将突起装配在定位孔中而沿与冷却剂流动方向正交的方向上具有预定的偏移量。
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公开(公告)号：US20120280383A1
公开(公告)日：2012-11-08
申请号：US13511543
申请日：2009-11-27
CPC分类号： H01L23/473 , H01L21/4803 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L2224/29101 , H01L2224/32057 , H01L2224/83101 , H01L2224/83385 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/15151 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.
摘要翻译： 一种半导体器件及其制造方法，其中通过钎焊将接合部件和接合部件接合，使得接合层内不留下空隙。 半导体器件包括接合部件和通过钎焊接合到接合部件的接合部件。 连接部件设置有与接合部件在接合面上开口的通孔，并且与接合部件的接合部件的接合面中的至少一个上设置有与通孔连通的路径， 具有接合构件的构件的表面。
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公开(公告)号：US08916964B2
公开(公告)日：2014-12-23
申请号：US13511543
申请日：2009-11-27
IPC分类号： H01L23/34 , H01L23/00 , H01L21/48 , H01L23/473
CPC分类号： H01L23/473 , H01L21/4803 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L2224/29101 , H01L2224/32057 , H01L2224/83101 , H01L2224/83385 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/15151 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member.
摘要翻译： 一种半导体器件及其制造方法，其中通过钎焊将接合部件和接合部件接合，使得接合层内不留下空隙。 半导体器件包括接合部件和通过钎焊接合到接合部件的接合部件。 连接部件设置有与接合部件在接合面上开口的通孔，并且与接合部件的接合部件的接合面中的至少一个上设置有与通孔连通的路径， 具有接合构件的构件的表面。
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5.发明授权Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device 失效热交换器，半导体装置，热交换器的制造方法以及半导体装置的制造方法公开(公告)号：US08593812B2
公开(公告)日：2013-11-26
申请号：US13259370
申请日：2009-05-11
CPC分类号： H01L23/473 , H01L21/4882 , H01L2924/0002 , H05K7/20509 , H05K7/20918 , Y10T29/4935 , Y10T29/49375 , Y10T29/49384 , Y10T29/49393 , H01L2924/00
摘要： Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged.
摘要翻译： 公开了一种热交换器，其中当具有不同线性膨胀系数的框架构件的中间构件和壁部彼此焊接时，抑制了中间构件和框架的翘曲（弯曲）。 制造热交换器的方法，其中抑制了中间构件和框架的翘曲（弯曲）的半导体装置以及半导体装置的制造方法。 具体公开了一种热交换器，其中在形成外壳的框架内布置有形成有用于制冷剂的流动通道的多个翅片的翅片构件。 框架具有第一框架部件（第一壁部分），绝缘板（介入部件）介于框架和发热体之间（半导体元件被焊接），绝缘板（介入部件）的线膨胀系数不同于 第一框架构件沿着布置有绝缘板（中间构件）的外表面的布置表面设置有可弹性变形的突起（可弹性变形的部分）。
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公开(公告)号：US08365409B2
公开(公告)日：2013-02-05
申请号：US13258602
申请日：2009-05-22
CPC分类号： H01L23/473 , B23P15/26 , B23P2700/10 , F28F3/046 , F28F3/048 , F28F3/12 , F28F13/06 , F28F2215/10 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , Y10T29/49391 , H01L2924/00
摘要： A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.
摘要翻译： 热交换器设置有包括多个翅片部分的冷却翅片和支撑翅片部分的基部，以及压配合到翅片部分中的多个销。 在热交换器中，各自具有比预先形成为平行的直线形状的翅片部分之间的每个空间宽的销的销在从每个翅片部分的顶端朝向基部的方向上压配合到空间中。 因此，通过塑性变形，翅片部分形成为波纹形状，从而将销钉固定在翅片部分之间与基部分开的位置。 在每个空间中，销在每个空间的纵向方向上间隔布置。 布置在相邻空间中的销以交替模式放置。
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公开(公告)号：US20120012295A1
公开(公告)日：2012-01-19
申请号：US13258602
申请日：2009-05-22
CPC分类号： H01L23/473 , B23P15/26 , B23P2700/10 , F28F3/046 , F28F3/048 , F28F3/12 , F28F13/06 , F28F2215/10 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , Y10T29/49391 , H01L2924/00
摘要： A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.
摘要翻译： 热交换器设置有包括多个翅片部分的冷却翅片和支撑翅片部分的基部，以及压配合到翅片部分中的多个销。 在热交换器中，各自具有比预先形成为平行的直线形状的翅片部之间的每个空间宽的宽度的销在从每个翅片部分的顶端朝向基部的方向上压配合到空间中。 因此，通过塑性变形，翅片部分形成为波纹形状，从而将销钉固定在翅片部分之间与基部分开的位置。 在每个空间中，销在每个空间的纵向方向上间隔布置。 布置在相邻空间中的销以交替模式放置。
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公开(公告)号：US08860210B2
公开(公告)日：2014-10-14
申请号：US13258860
申请日：2009-06-10
IPC分类号： H01L23/34 , H01L23/473 , H01L23/13 , H01L23/367 , H01L25/07 , H01L23/373 , H01L23/433
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3677 , H01L23/3735 , H01L23/433 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.
摘要翻译： 公开了一种能够适当地缓和由绝缘基板和冷却器之间的线膨胀系数差产生的应力的半导体装置，能够通过半导体元件的冷却来适当地除去热量。 半导体器件包括绝缘衬底，设置在绝缘衬底上的半导体元件，冷却器和设置在绝缘衬底和冷却器之间的多孔金属板。 多孔金属板中的通孔至少打开面向冷却器的多孔金属板的表面。 孔的截面尺寸从冷却器侧朝向绝缘基板侧逐渐减小。
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公开(公告)号：US20120012996A1
公开(公告)日：2012-01-19
申请号：US13258860
申请日：2009-06-10
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3677 , H01L23/3735 , H01L23/433 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.
摘要翻译： 公开了一种能够适当地缓和由绝缘基板和冷却器之间的线膨胀系数差产生的应力的半导体装置，能够通过半导体元件的冷却来适当地除去热量。 半导体器件包括绝缘衬底，设置在绝缘衬底上的半导体元件，冷却器和设置在绝缘衬底和冷却器之间的多孔金属板。 多孔金属板中的通孔至少打开面向冷却器的多孔金属板的表面。 孔的截面尺寸从冷却器侧朝向绝缘基板侧逐渐减小。
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10.发明授权公开(公告)号：US09065316B2
公开(公告)日：2015-06-23
申请号：US13518311
申请日：2009-12-23
CPC分类号： H02K3/345 , H02K3/487 , Y10T29/49009
摘要： A stator structure for a rotary electric machine includes a stator core having a cylindrical shape in which slots and pole pieces are formed on an inner peripheral side and alternately arranged in a circumferential direction, a conductor segment which is a conducting wire having a rectangular cross section inserted in one of the slots through an insulator being connected with a conductor segment similarly inserted in another slot to form a coil. Each insulator has a shape including a pair of opposite side surface portions connected with an intermediate portion along a wall surface defining the slot. Each insulator includes end protrusions facing each other at free ends of the side surface portions to position the conductor segments. The insulators are made of an insulating and elastic material.
摘要翻译： 一种旋转电机的定子结构包括：具有圆筒形状的定子铁心，其中在内周侧形成有槽和极片，并且沿圆周方向交替布置;导体段，其为具有矩形横截面的导线 通过与类似地插入另一个槽中的导体段连接的绝缘体插入其中一个槽中以形成线圈。 每个绝缘体具有包括一对相对的侧表面部分的形状，所述一对相对的侧表面部分沿着限定狭缝的壁表面与中间部分连接。 每个绝缘体包括在侧表面部分的自由端处彼此面对的端部突起，以定位导体段。 绝缘子由绝缘和弹性材料制成。
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