FinFET-based SRAM cell
    1.
    发明授权
    FinFET-based SRAM cell 有权
    基于FinFET的SRAM单元

    公开(公告)号:US06765303B1

    公开(公告)日:2004-07-20

    申请号:US10429697

    申请日:2003-05-06

    IPC分类号: H01L2711

    摘要: A SRAM cell includes a single FinFET and two resonant tunnel diodes. The FinFet has multiple channel regions formed from separate fins. The resonant tunnel diodes may be formed from FinFET type fins. In particular, the resonant diodes may includes a thin, undoped silicon region surrounded by a dielectric. The SRAM cell is small and provides fast read/write access times.

    摘要翻译: SRAM单元包括单个FinFET和两个谐振隧道二极管。 FinFet具有由独立翅片形成的多个通道区域。 谐振隧道二极管可以由FinFET型鳍形成。 特别地,谐振二极管可以包括由电介质围绕的薄的未掺杂的硅区域。 SRAM单元很小,并提供快速的读/写访问时间。

    FinFET device with multiple fin structures
    2.
    发明授权
    FinFET device with multiple fin structures 有权
    FinFET器件具有多个鳍结构

    公开(公告)号:US07679134B1

    公开(公告)日:2010-03-16

    申请号:US10754515

    申请日:2004-01-12

    IPC分类号: H01L29/94

    摘要: A semiconductor device includes a group of fin structures. The group of fin structures includes a conductive material and is formed by growing the conductive material in an opening of an oxide layer. The semiconductor device further includes a source region formed at one end of the group of fin structures, a drain region formed at an opposite end of the group of fin structures, and at least one gate.

    摘要翻译: 半导体器件包括一组翅片结构。 翅片结构的组包括导电材料,并且通过在氧化物层的开口中生长导电材料而形成。 半导体器件还包括形成在鳍片结构组的一端处的源极区域,形成在鳍片结构组的相对端处的漏极区域和至少一个栅极。

    Double spacer FinFET formation
    3.
    发明授权
    Double spacer FinFET formation 有权
    双间隔FinFET形成

    公开(公告)号:US06709982B1

    公开(公告)日:2004-03-23

    申请号:US10303702

    申请日:2002-11-26

    IPC分类号: H01L21311

    摘要: A method for forming a group of structures in a semiconductor device includes forming a conductive layer on a substrate, where the conductive layer includes a conductive material, and forming an oxide layer over the conductive layer. The method further includes etching at least one opening in the oxide layer, filling the at least one opening with the conductive material, etching the conductive material to form spacers along sidewalls of the at least one opening, and removing the oxide layer and a portion of the conductive layer to form the group of structures.

    摘要翻译: 一种在半导体器件中形成一组结构的方法包括在基底上形成导电层,其中导电层包括导电材料,并在导电层上形成氧化物层。 该方法还包括蚀刻氧化物层中的至少一个开口,用导电材料填充至少一个开口,蚀刻导电材料以在至少一个开口的侧壁上形成间隔物,并且去除氧化物层和一部分 导电层形成一组结构。

    Method for forming channels in a finfet device
    4.
    发明授权
    Method for forming channels in a finfet device 失效
    在finfet装置中形成通道的方法

    公开(公告)号:US06716686B1

    公开(公告)日:2004-04-06

    申请号:US10613997

    申请日:2003-07-08

    IPC分类号: H01L2100

    摘要: A method for forming one or more FinFET devices includes forming a source region and a drain region in an oxide layer, where the oxide layer is disposed on a substrate, and etching the oxide layer between the source region and the drain region to form a group of oxide walls and channels for a first device. The method further includes depositing a connector material over the oxide walls and channels for the first device, forming a gate mask for the first device, removing the connector material from the channels, depositing channel material in the channels for the first device, forming a gate dielectric for first device over the channels, depositing a gate material over the gate dielectric for the first device, and patterning and etching the gate material to form at least one gate electrode for the first device.

    摘要翻译: 用于形成一个或多个FinFET器件的方法包括在氧化物层中形成源极区域和漏极区域,其中氧化物层设置在衬底上,并且蚀刻源极区域和漏极区域之间的氧化物层以形成基团 的第一装置的氧化物壁和通道。 该方法还包括在第一器件的氧化物壁和通道上沉积连接器材料,形成用于第一器件的栅极掩模,从通道移除连接器材料,将沟道材料沉积在第一器件的通道中,形成栅极 在沟道上的第一器件的电介质,在第一器件的栅极电介质上沉积栅极材料,以及图案化和蚀刻栅极材料以形成用于第一器件的至少一个栅电极。

    Germanium MOSFET devices and methods for making same
    5.
    发明授权
    Germanium MOSFET devices and methods for making same 有权
    锗MOSFET器件及其制造方法

    公开(公告)号:US07148526B1

    公开(公告)日:2006-12-12

    申请号:US10348758

    申请日:2003-01-23

    IPC分类号: H01L29/72

    摘要: A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

    摘要翻译: 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍

    FinFET device with multiple channels
    9.
    发明授权
    FinFET device with multiple channels 有权
    FinFET器件具有多个通道

    公开(公告)号:US07432557B1

    公开(公告)日:2008-10-07

    申请号:US10755344

    申请日:2004-01-13

    IPC分类号: H01L23/62

    摘要: A method for forming one or more FinFET devices includes forming a source region and a drain region in an oxide layer, where the oxide layer is disposed on a substrate, and etching the oxide layer between the source region and the drain region to form a group of oxide walls and channels for a first device. The method further includes depositing a connector material over the oxide walls and channels for the first device, forming a gate mask for the first device, removing the connector material from the channels, depositing channel material in the channels for the first device, forming a gate dielectric for first device over the channels, depositing a gate material over the gate dielectric for the first device, and patterning and etching the gate material to form at least one gate electrode for the first device.

    摘要翻译: 半导体器件包括源极区域,漏极区域和形成在源极区域和漏极区域之间的沟道组。 通道组中的至少一个通道通过氧化物结构与通道组中的另一个通道分离。 半导体器件还包括至少一个形成在该组沟道的至少一部分上的栅极。

    Germanium MOSFET devices and methods for making same
    10.
    发明授权
    Germanium MOSFET devices and methods for making same 有权
    锗MOSFET器件及其制造方法

    公开(公告)号:US08334181B1

    公开(公告)日:2012-12-18

    申请号:US12836378

    申请日:2010-07-14

    IPC分类号: H01L29/72

    摘要: A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

    摘要翻译: 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍