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公开(公告)号：US07179692B2
公开(公告)日：2007-02-20
申请号：US10913409
申请日：2004-08-09
申请人： Bin Yu , Shibly S. Ahmed , Judy Xilin An , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang
发明人： Bin Yu , Shibly S. Ahmed , Judy Xilin An , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang
CPC分类号： H01L29/785 , H01L29/41733 , H01L29/42384 , H01L29/66795 , H01L29/66803
摘要： A method of forming a semiconductor device includes forming a fin on an insulating layer, where the fin includes a number of side surfaces, a top surface and a bottom surface. The method also includes forming a gate on the insulating layer, where the gate has a substantially U-shaped cross-section at a channel region of the semiconductor device.
摘要翻译： 形成半导体器件的方法包括在绝缘层上形成翅片，其中鳍片包括多个侧表面，顶表面和底表面。 该方法还包括在绝缘层上形成栅极，其中栅极在半导体器件的沟道区域具有基本上U形的横截面。
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公开(公告)号：US06833588B2
公开(公告)日：2004-12-21
申请号：US10274867
申请日：2002-10-22
申请人： Bin Yu , Shibly S. Ahmed , Judy Xilin An , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang
发明人： Bin Yu , Shibly S. Ahmed , Judy Xilin An , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang
IPC分类号： H01L2701
CPC分类号： H01L29/785 , H01L29/41733 , H01L29/42384 , H01L29/66795 , H01L29/66803
摘要： A double-gate semiconductor device includes a substrate, an insulating layer, a fin and a gate. The insulating layer is formed on the substrate and the gate is formed on the insulating layer. The fin has a number of side surfaces, a top surface and a bottom surface. The bottom surface and at least a portion of the side surfaces of the fin are surrounded by the gate. The gate material surrounding the fin has a U-shaped cross-section at a channel region of the semiconductor device.
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公开(公告)号：US06897527B2
公开(公告)日：2005-05-24
申请号：US10833112
申请日：2004-04-28
IPC分类号： H01L21/336 , H01L29/10 , H01L29/49 , H01L29/786 , H01L27/01
CPC分类号： H01L29/785 , H01L29/1054 , H01L29/4908 , H01L29/66795 , H01L29/78654 , H01L29/78687
摘要： A semiconductor device includes a fin and a layer formed on at least a portion of the fin. The fin includes a first crystalline material. The layer includes a second crystalline material, where the first crystalline material has a larger lattice constant than the second crystalline material to induce tensile strain within the layer.
摘要翻译： 半导体器件包括翅片和形成在鳍片的至少一部分上的层。 翅片包括第一结晶材料。 该层包括第二结晶材料，其中第一结晶材料具有比第二结晶材料更大的晶格常数以在层内引起拉伸应变。
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公开(公告)号：US06762483B1
公开(公告)日：2004-07-13
申请号：US10348910
申请日：2003-01-23
IPC分类号： H01L2906
CPC分类号： H01L29/785 , H01L29/42384 , H01L29/66818 , H01L29/78687
摘要： A method of forming fins for a double-gate fin field effect transistor (FinFET) includes forming a second layer of semi-conducting material over a first layer of semi-conducting material and forming double caps in the second layer of semi-conducting material. The method further includes forming spacers adjacent sides of each of the double caps and forming double fins in the first semi-conducting material beneath the double caps. The method also includes thinning the double fins to produce narrow double fins.
摘要翻译： 一种形成双栅极鳍效应晶体管（FinFET）的鳍片的方法包括在第一半导体材料层上形成第二半导电材料层，并在第二半导体材料层中形成双重盖子。 该方法还包括在每个双盖的侧面上形成间隔物，并在双盖下方的第一半导体材料中形成双翅片。 该方法还包括使双翅片变薄以产生窄的双翅片。
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公开(公告)号：US06803631B2
公开(公告)日：2004-10-12
申请号：US10349042
申请日：2003-01-23
IPC分类号： H01L2701
CPC分类号： H01L29/785 , H01L29/1054 , H01L29/4908 , H01L29/66795 , H01L29/78654 , H01L29/78687
摘要： A semiconductor structure includes a fin and a layer formed on the fin. The fin includes a first crystalline material having a rectangular cross section and a number of surfaces. The layer is formed on the surfaces and includes a second crystalline material. The first crystalline material has a different lattice constant than the second crystalline material to induce tensile strain within the first layer.
摘要翻译： 半导体结构包括翅片和形成在翅片上的层。 翅片包括具有矩形横截面和多个表面的第一结晶材料。 该层形成在表面上并且包括第二结晶材料。 第一结晶材料具有与第二结晶材料不同的晶格常数，以在第一层内引起拉伸应变。
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公开(公告)号：US06921963B2
公开(公告)日：2005-07-26
申请号：US10830006
申请日：2004-04-23
IPC分类号： H01L21/336 , H01L29/423 , H01L29/786 , H01L29/06
CPC分类号： H01L29/785 , H01L29/42384 , H01L29/66818 , H01L29/78687
摘要： A narrow channel FinFET is described herein with a narrow channel width. A protective layer may be formed over the narrow channel, the protective layer being wider than the narrow channel.
摘要翻译： 这里描述了窄通道FinFET，其具有窄的通道宽度。 可以在窄通道上形成保护层，保护层比窄通道宽。
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公开(公告)号：US07029958B2
公开(公告)日：2006-04-18
申请号：US10699887
申请日：2003-11-04
申请人： Cyrus E. Tabery , Shibly S. Ahmed , Matthew S. Buynoski , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang , Chih-Yuh Yang , Bin Yu
发明人： Cyrus E. Tabery , Shibly S. Ahmed , Matthew S. Buynoski , Srikanteswara Dakshina-Murthy , Zoran Krivokapic , Haihong Wang , Chih-Yuh Yang , Bin Yu
IPC分类号： H01L21/00
CPC分类号： H01L29/785 , H01L29/66818 , H01L29/7842
摘要： A method for forming a metal-oxide semiconductor field-effect transistor (MOSFET) includes patterning a fin area, a source region, and a drain region on a substrate, forming a fin in the fin area, and forming a mask in the fin area. The method further includes etching the mask to expose a channel area of the MOSFET, etching the fin to thin a width of the fin in the channel area, forming a gate over the fin, and forming contacts to the gate, the source region, and the drain region.
摘要翻译： 一种形成金属氧化物半导体场效应晶体管（MOSFET）的方法包括在衬底上构图翅片区域，源极区域和漏极区域，在翅片区域中形成鳍片，并在鳍片区域中形成掩模 。 该方法还包括蚀刻掩模以暴露MOSFET的沟道区域，蚀刻鳍以在沟道区域中减薄翅片的宽度，在鳍上方形成栅极，以及形成与栅极，源区和 漏极区域。
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8.发明授权公开(公告)号：US07432558B1
公开(公告)日：2008-10-07
申请号：US10863392
申请日：2004-06-09
IPC分类号： H01L29/72
CPC分类号： H01L29/045 , H01L29/66795 , H01L29/785
摘要： A semiconductor device may include a substrate and an insulating layer formed on the substrate. A fin may be formed on the insulating layer. The fin may include a side surface and a top surface, and the side surface may have a orientation. A first gate may be formed on the insulating layer proximate to the side surface of the fin.
摘要翻译： 半导体器件可以包括衬底和形成在衬底上的绝缘层。 可以在绝缘层上形成翅片。 翅片可以包括侧表面和顶表面，并且侧表面可以具有<100>取向。 第一栅极可以形成在靠近鳍片的侧表面的绝缘层上。
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公开(公告)号：US06960804B1
公开(公告)日：2005-11-01
申请号：US10633034
申请日：2003-10-10
IPC分类号： H01L21/027 , H01L21/336 , H01L29/786 , H01L29/788
CPC分类号： H01L29/785 , H01L21/0276 , H01L29/42392 , H01L29/66795
摘要： A double-semiconductor device includes a substrate, an insulating layer, a fin and a gate. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The fin has a number of side surfaces, a top surface and a bottom surface. The gate is formed on the insulating layer and surrounds the top surface, bottom surface and the side surfaces of the fin in the channel region of the semiconductor device. Surrounding the fin with gate material results in an increased total channel width and more flexible device adjustment margins.
摘要翻译： 双半导体器件包括衬底，绝缘层，鳍和栅极。 绝缘层形成在基板上，并且鳍形成在绝缘层上。 翅片具有多个侧表面，顶表面和底表面。 栅极形成在绝缘层上并且围绕半导体器件的沟道区域中的鳍的顶表面，底表面和侧表面。 用门材料围绕翅片会导致总通道宽度增加和设备调整裕度更灵活。
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公开(公告)号：US06787854B1
公开(公告)日：2004-09-07
申请号：US10385753
申请日：2003-03-12
申请人： Chih-Yuh Yang , Shibly S. Ahmed , Srikanteswara Dakshina-Murthy , Cyrus E. Tabery , Haihong Wang , Bin Yu
发明人： Chih-Yuh Yang , Shibly S. Ahmed , Srikanteswara Dakshina-Murthy , Cyrus E. Tabery , Haihong Wang , Bin Yu
IPC分类号： H01L218238
CPC分类号： H01L29/7853 , H01L29/66818
摘要： A method for forming a fin structure on a silicon-on-insulator (SOI) wafer that includes a silicon layer on an insulating layer that is formed over a semiconductor substrate includes etching the silicon layer using a first etch procedure, etching, following the first etch procedure, the silicon layer using a second etch procedure, and etching, following the second etch procedure, the silicon layer using a third etch procedure to form a T-shaped fin structure.
摘要翻译： 一种在绝缘体上硅（SOI）晶片上形成翅片结构的方法，包括在半导体衬底上形成的绝缘层上的硅层，包括使用第一蚀刻步骤蚀刻硅层，然后蚀刻第一 蚀刻步骤，使用第二蚀刻步骤的硅层，以及在第二蚀刻程序之后，使用第三蚀刻工艺蚀刻硅层以形成T形翅片结构。
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