公开(公告)号：US10373996B2

公开(公告)日：2019-08-06

申请号：US15651510

申请日：2017-07-17

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US10437005B2

公开(公告)日：2019-10-08

申请号：US15322884

申请日：2015-06-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Markus Rossi ,  Stephan Heimgartner

IPC: G02B7/02 ,  G02B3/00 ,  G02B3/02 ,  G02B3/08 ,  G02B1/04 ,  G02B27/09

Abstract: According to embodiments of the present invention, an apparatus comprising a beam shaping element (lens) is provided. The apparatus comprises a substrate; a beam shaping element; and an elastic intermediate layer disposed between, and in contact with, the substrate and the beam shaping element, wherein the elastic intermediate layer has a Young's Modulus in a range of 2-600 MPa and a Poisson's ratio in a range of 0.2-0.5. Techniques for reducing thermal distortion of lens are described.

公开(公告)号：US10236314B2

公开(公告)日：2019-03-19

申请号：US15341210

申请日：2016-11-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: H01L27/14 ,  H01L27/146 ,  H01L27/148

Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate.The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

公开(公告)号：US10741613B2

公开(公告)日：2020-08-11

申请号：US15516692

申请日：2015-10-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Peter Riel

IPC: H01L27/32 ,  H01L31/0232 ,  G02B5/18 ,  B32B33/00 ,  B32B37/02 ,  H01L23/00 ,  B32B37/12 ,  G02B27/09 ,  G02B27/42 ,  H01S5/00 ,  B32B37/24 ,  G02B3/00

Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.