Liquid cooling device for memory module
    1.
    发明公开

    公开(公告)号:US20240145333A1

    公开(公告)日:2024-05-02

    申请号:US18337399

    申请日:2023-06-19

    摘要: A liquid cooling device for cooling a memory module is provided. The liquid cooling device includes a slot, installed on a motherboard, where the memory module is inserted into the slot; a first heat sink and a second heat sink, where the first, second heat sinks dissipate heat from the memory module between the first heat sink and the second heat sink, with the first, second heat sinks abutting the memory module; a liquid cooling plate, movably installed on a side of the slot, covering a top part of the memory module after the memory module is inserted into the slot, for liquid cooling of the first heat sink and the second heat sink; and at least one first fixing clamp, abutting surfaces of the first, second heat sinks, and clamping the first, second heat sinks and the memory module together.

    PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF

    公开(公告)号:US20230164916A1

    公开(公告)日:2023-05-25

    申请号:US17834874

    申请日:2022-06-07

    IPC分类号: H05K1/11 H05K1/18 H05K1/02

    摘要: The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.

    Chassis and electronic device applying the chassis

    公开(公告)号:US11432428B2

    公开(公告)日:2022-08-30

    申请号:US17035759

    申请日:2020-09-29

    摘要: The present disclosure provides a chassis and an electronic device applying the chassis. The chassis includes: a chassis body; the chassis body is a 2U chassis body or a 4U chassis body; a hard disk module, installed in a front end area of the chassis body; a power supply module, installed at one side of a rear end area of the chassis body; a controller module, installed in a remaining rear end area of the chassis body except the power supply module, parallel with the power supply module, and including a plurality of pluggable functional modules; a middle board, connected with the power supply module, the hard disk module, and the control module, respectively, to realize the electrical connection between the power supply module, the hard disk module, and the control module. The present disclosure can improve the versatility of the chassis modules.

    CABLE MANAGEMENT ARM AND RACK APPLYING THE CABLE MANAGEMENT ARM

    公开(公告)号:US20210259128A1

    公开(公告)日:2021-08-19

    申请号:US16871059

    申请日:2020-05-11

    发明人: Wenjin LI

    IPC分类号: H05K7/14

    摘要: The present disclosure provides a cable management arm and a rack applying the cable management arm. The cable management arm includes: a left cable management assembly, a right cable management assembly, a connection assembly, and an elastic assembly. When a chassis in the rack is pulled out of the rack, the elastic assembly causes the left cable management assembly and the right cable management assembly to move following the movement of the controller at the rear of the chassis in the pulling out direction, and causes the left cable management assembly and the right cable management assembly to reset due to elastic force. The connection assembly and the elastic assembly assist the movement of the left cable management assembly and the right cable management assembly to cause their resetting, and ensure them to move in an approximately horizontal space.

    STORAGE CHASSIS AND ELECTRONIC APPARATUS COMPRISING THE SAME

    公开(公告)号:US20200075058A1

    公开(公告)日:2020-03-05

    申请号:US16529711

    申请日:2019-08-01

    IPC分类号: G11B33/04 H05K7/20 G11B33/12

    摘要: The present disclosure provides a storage chassis and an electronic device including the storage chassis. The storage chassis has a first receiving space at an upper portion of a rear end, the first receiving space is configured to be shared by a plurality of functional modules, and each functional module includes cable management supports, CPU computation control modules or storage hard disks. In the present disclosure, more modules can be arranged in a limited chassis space flexibly and reasonably, thereby improving the utilization of the chassis space and implementing configuration of various functions.

    CLOSED LOOP LIQUID COOLER AND ELECTRONIC DEVICE USING THE SAME

    公开(公告)号:US20190206765A1

    公开(公告)日:2019-07-04

    申请号:US16234886

    申请日:2018-12-28

    IPC分类号: H01L23/473

    CPC分类号: H01L23/473

    摘要: The present disclosure provides a closed loop liquid cooler and an electronic device using the same. The closed loop liquid cooler includes: a first liquid cooling module and a second liquid cooling module, where a cooling reflux at an output end of the first liquid cooling module is outputted to a cooling liquid input end of the second liquid cooling module; and a cooling reflux at an output end of the second liquid cooling module is outputted to a cooling liquid input end of the first liquid cooling module.

    Fan control system and method thereof

    公开(公告)号:US09829867B2

    公开(公告)日:2017-11-28

    申请号:US14485597

    申请日:2014-09-12

    发明人: Yaoyin Fan

    IPC分类号: G05B11/42 F04D27/00 H05K7/20

    摘要: Provided are a fan control method and a fan control system. The fan control method of the present invention includes the steps of predetermining a reliable operating temperature of a hard disk; creating a storing a corresponding relationship between an average hard disk temperature and a fan speed, and creating and storing a corresponding relationship between a hard disk temperature greater than the reliable operating temperature and a fan speed; reading actual temperatures of the plurality of hard disks; comparing the actual temperatures of the plurality of hard disks with the reliable operating temperature; computing an average temperature of the plurality of hard disks; and outputting a control signal to adjust the fan speed based on the stored corresponding relationship between an average hard disk temperature and a fan speed. Accordingly, the present invention may increase hard disk reliability and decrease power dissipation of a fan and system noise.