Process for manufacturing printed circuit boards and a machine for this purpose
    1.
    发明授权
    Process for manufacturing printed circuit boards and a machine for this purpose 有权
    为此制造印刷电路板和机器的工艺

    公开(公告)号:US07565736B2

    公开(公告)日:2009-07-28

    申请号:US10549040

    申请日:2004-03-02

    IPC分类号: H05K3/36 H05K3/20 H05K3/10

    摘要: Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved Image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, an raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the Operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.

    摘要翻译: 用于制造印刷电路板的工艺和机器,其中包括由至少两个金属材料压板组成的印刷电路板,其间布置有由一个或多个金属板形成的印刷电路板组合物,所述印刷电路板组合物通过一层或多层浸渍有可聚合的 树脂和/或通过一个或多个印刷电路板,具有电路雕刻图像,被布置在印刷机的压板之间并被压制,使所述印刷包受到产生感应电流的可变感应磁场的作用 每个金属板和压片的片材,导致所述板和片的加热,从而导致绝缘材料层的热传导的加热,熔化和液化所述绝缘材料层中的树脂并粘附绝缘材料 使金属片材的温度升高,绝缘层内的聚合性树脂 然后将材料聚合,在挤压包的冷却之后,在适于制造印刷电子电路的一个或多个刚性板中。 执行上述处理的机器包括可变感应磁场产生装置,适于在压力分组的金属板和片材中产生感应电流,使其发热,以及控制磁场产生装置的操作和控制 温度和压力的压力。

    Electrode for machines for electromagnetic induction welding of the layers forming a multi-layer printed circuit
    3.
    发明授权
    Electrode for machines for electromagnetic induction welding of the layers forming a multi-layer printed circuit 有权
    用于形成多层印刷电路的层的电磁感应焊接机的电极

    公开(公告)号:US07675009B2

    公开(公告)日:2010-03-09

    申请号:US10557488

    申请日:2004-05-03

    IPC分类号: H05B6/10

    摘要: A U-shaped magnetic circuit (2) provided with a field winding (3), including respective induction electrodes (5s, 5i) at an outer end of each arm of the magnetic circuit (2) Both electrodes are perpendicularly arranged as regards the multi-layer printed circuit, coaxially to each other and capable of vertical movement in both directions. The end of each induction electrode (5s, 5i) that comes into contact with the multi-layer printed circuit is provided with a thermal barrier, in order to prevent, during the welding, heat transmission by thermal conductivity from the welding zone to the induction electrode (5s, 5i).

    摘要翻译: 设置有励磁绕组(3)的U形磁路(2),在磁路(2)的每个臂的外端包括各自的感应电极(5s,5i)。两个电极相对于多个 层印刷电路,彼此同轴并且能够在两个方向上垂直移动。 与多层印刷电路接触的每个感应电极(5s,5i)的端部设置有热障,以便在焊接期间防止从焊接区到感应的热传导的热传递 电极(5s,5i)。

    PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND A MACHINE FOR THIS PURPOSE
    4.
    发明申请
    PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND A MACHINE FOR THIS PURPOSE 审中-公开
    制造印刷电路板的方法和本机构的机器

    公开(公告)号:US20090250456A1

    公开(公告)日:2009-10-08

    申请号:US12474739

    申请日:2009-05-29

    IPC分类号: H05B6/06 H05B6/10

    摘要: Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, on raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits.The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.

    摘要翻译: 用于制造印刷电路板的工艺和机器,其中包括由至少两个金属材料压板组成的印刷电路板,其间布置有由一个或多个金属板形成的印刷电路板组合物,所述印刷电路板组合物通过一层或多层浸渍有可聚合的 树脂和/或通过一个或多个具有电路雕刻图像的印刷电路板布置在压机的压板之间并被压制,使所述压力包受到产生感应电流的可变感应磁场的作用 每个金属板和压片的片材,导致所述板和片的加热,从而导致绝缘材料层的热传导的加热,熔化和液化所述绝缘材料层中的树脂并粘附绝缘材料 使得在提高温度的情况下,绝缘层中的可聚合树脂 然后将材料聚合,在挤压包的冷却之后,在适于制造印刷电子电路的一个或多个刚性板中。 执行上述过程的机器包括可变感应磁场产生装置,适于在压力分组的金属板和片材中产生感应电流,使其发热,以及控制磁场产生装置的操作的装置,并控制 温度和压力的压力。

    TOOL, METHOD AND MACHINE FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARDS
    5.
    发明申请
    TOOL, METHOD AND MACHINE FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARDS 有权
    制造多层印刷电路板的工具,方法和机器

    公开(公告)号:US20150223344A1

    公开(公告)日:2015-08-06

    申请号:US14418763

    申请日:2013-07-24

    摘要: The invention relates to a tool for supporting multilayer printed circuit boards during manufacture comprising a frame in which there is fixed a pretensed, non-electrically conductive fabric which has a thickness less than 0.1 mm and can be accessed by its two faces. The present tool allows the induction bonding of the mentioned layers at internal points of the bundle following a method in which said bundle is placed on the tool of the invention and at least one of the welding electrodes used in the welding operation is applied on the lower face of a fabric of the tool supporting the bundle. A machine especially suitable for putting the method into practice comprises C-shaped magnetic cores the arms of which are long enough to reach the internal points of the bundle.

    摘要翻译: 本发明涉及一种用于在制造过程中支撑多层印刷电路板的工具,其包括框架,其中固定有厚度小于0.1mm并且可由其两个面访问的预注射非导电织物。 本工具允许按照将所述束放置在本发明的工具上的方法将所述层的感应结合在束的内部点处,并且用于焊接操作的焊接电极中的至少一个施加在下部 面对支撑束的工具的织物。 特别适用于实施该方法的机器包括C形磁芯,其臂足够长以到达束的内部点。