摘要:
A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at a fixed tip temperature ramp rate during the soldering event; and provided at an adjustable tip temperature ramp rate during the soldering event.
摘要:
An intelligent soldering handpiece comprising a housing; a solder tip; a heater for heating the solder tip; a processor for receiving an image of a solder joint being soldered by the intelligent soldering handpiece, determining solder joint information, and associating the image of the solder joint with the determined solder joint information to distinguish the determined solder joint information for each respective joint.
摘要:
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要:
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要:
A soldering iron hand piece that may be used for both a soldering tip and a soldering cartridge, allowing the same hand piece to be used for both a soldering tip and a soldering cartridge.
摘要:
A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.
摘要:
A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.
摘要:
A method of using an extractor for extracting harmful chemicals and particulates from air for a soldering iron station, the extractor including an intake assembly, a filter assembly, a fan, and an exhaust assembly, comprising receiving harmful chemicals, particulates, and air from the soldering iron station through the intake assembly; filtering the fumes from the air with the filter assembly; and exhausting the filtered air with the exhaust assembly.
摘要:
FIG. 1 is a perspective view of a tissue box shown in use without the removable section covering the dispensing hole. FIG. 2 is a perspective view of the tissue box. FIG. 3 is a front elevational view of the tissue box. FIG. 4 is a rear elevational view of the tissue box. FIG. 5 is a left side elevational view of the tissue box. FIG. 6 is a right side elevational view of the tissue box. FIG. 7 is a top plan view of the tissue box. FIG. 8 is a bottom plan view of the tissue box. FIG. 9 is a front elevational view of the tissue box according to a second embodiment; FIG. 10 is a front elevational view of the tissue box according to a third embodiment; FIG. 11 is a perspective view of the tissue box shown in a flat, pre-assembled state. FIG. 12 is a front elevational view of the flat, pre-assembled tissue box. FIG. 13 is a rear elevational view of the flat, pre-assembled tissue box. FIG. 14 is a left side elevational view of the flat, pre-assembled tissue box. FIG. 15 is a right side elevational view of the flat, pre-assembled tissue box. FIG. 16 is a top plan view of the flat, pre-assembled tissue box; and, FIG. 17 is a bottom plan view of the flat, pre-assembled tissue box. The broken lines shown in FIGS. 1-17 are included for the purpose of illustrating environmental elements only and form no part of the claimed design.
摘要:
A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at multiple tip temperatures at fixed times during the soldering event; and provided at multiple tip temperatures at self-adjusting times during the soldering event.