公开(公告)号：US07977801B2

公开(公告)日：2011-07-12

申请号：US11995356

申请日：2006-07-14

申请人： Ryo Takatsuki

发明人： Ryo Takatsuki

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/32 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/82 ,  H01L2924/00

摘要： A multi-chip module and an integrated structure of the present invention including: at least one of either a terminal unit formation area expanded type integrated circuit chip, or a terminal unit formation area identical type integrated circuit chip; terminal unit formation areas of these integrated circuits that are covered with protective layers, and expanded wiring units and terminal units formed in the protective layers; one or a plurality of the terminal unit formation area expanded type and the terminal unit formation area identical type integrated circuit chip components that are two-dimensionally or three-dimensionally aligned in further protective layers; a horizontal or a vertical wiring formed for arbitrarily connecting the plurality of the integrated circuit chip components in the further protective layers.

摘要翻译： 本发明的多芯片模块和集成结构包括：终端单元形成区域扩展型集成电路芯片或终端单元形成区域相同型集成电路芯片中的至少一个; 这些集成电路的端子单元形成区域被保护层覆盖，并且扩展的布线单元和形成在保护层中的端子单元; 一个或多个终端单元形成区域扩展型和终端单元形成区域在另外的保护层中二维或三维排列的相同类型的集成电路芯片组件; 形成用于任意连接其它保护层中的多个集成电路芯片部件的水平或垂直布线。

公开(公告)号：US08076179B2

公开(公告)日：2011-12-13

申请号：US13151486

申请日：2011-06-02

申请人： Ryo Takatsuki

发明人： Ryo Takatsuki

IPC分类号： H01L21/44

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/32 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/82 ,  H01L2924/00

摘要： A multi-chip module and an integrated structure of the present invention including: at least one of either a terminal unit formation area expanded type integrated circuit chip, or a terminal unit formation area identical type integrated circuit chip; terminal unit formation areas of these integrated circuits that are covered with protective layers, and expanded wiring units and terminal units formed in the protective layers; one or a plurality of the terminal unit formation area expanded type and the terminal unit formation area identical type integrated circuit chip components that are two-dimensionally or three-dimensionally aligned in further protective layers; a horizontal or a vertical wiring formed for arbitrarily connecting the plurality of the integrated circuit chip components in the further protective layers.

摘要翻译： 本发明的多芯片模块和集成结构包括：终端单元形成区域扩展型集成电路芯片或终端单元形成区域相同型集成电路芯片中的至少一个; 这些集成电路的端子单元形成区域被保护层覆盖，并且扩展的布线单元和形成在保护层中的端子单元; 一个或多个终端单元形成区域扩展型和终端单元形成区域在另外的保护层中二维或三维排列的相同类型的集成电路芯片组件; 形成用于任意连接其它保护层中的多个集成电路芯片部件的水平或垂直布线。