Abstract:
According to one embodiment, a semiconductor substrate is provided having at least two transistor regions formed therein. Overlying the channel regions is a gate dielectric and transistor gate electrodes overly the gate dielectric and are positioned overlying the channel regions. Source and drain regions are formed on either side of the channel regions to create a transistor structure. In order to provide isolation between transistors in the semiconductor substrate, a trench is formed in the substrate. A strain-inducting layer is then deposited over the transistor structures and into the trench in the semiconductor substrate. A high-stress nitride layer is one type of material which is suitable for forming the strain-inducing layer.
Abstract:
A very long instruction word processor with sequence control. During each cycle the processor generates control signals to functional units based on the values in fields of an instruction. Each instruction may include an iteration count specifying the number of cycles for which the control signals should be generated based on that instruction. The instruction set further includes flow control instructions allowing for repetitive execution of a single instruction, repetitive execution of a block of instructions or branching within a program. Such a processor is illustrated in connection with a disk controller for a hard drive of a computer. The flexible sequencing allows a hard-drive controller to be readily reprogrammed for use in connection with different types of media or to be dynamically reprogrammed upon detection of a disk read error to increase the ability of the disk controller to recover data from a disk.
Abstract:
An integrated circuit for a smart card in accordance with an exemplary embodiment includes at least one data terminal for providing communications with a host device over a system bus and a processor configured to provide an attachment signal on the at least one data terminal for recognition by the host device. Further, the processor also cooperates with the host device to perform an enumeration based upon at least one default descriptor, and receive information from the host device regarding a system event. In addition, the processor is configured to remove the attachment signal from the at least one data terminal and thereafter again provide the attachment signal on the at least one data terminal based upon the information regarding the system event, and cooperate with the host device to perform a new enumeration based upon at least one alternate descriptor.
Abstract:
A high speed processor. The processor includes terminals that each execute a subset of the instruction set. In at least one of the terminals, the instructions are executed in an order determined by data flow. Instructions are loaded into the terminal in pages. A notation is made when an operand for an instruction is generated by another instruction. When operands for an instruction are available, that instruction is a “ready” instruction. A ready instruction is selected in each cycle and executed. To allow data to be transmitted between terminals, each terminal is provided with a receive station, such that data generated in one terminal may be transmitted to another terminal for use as an operand in that terminal. In one embodiment, one terminal is an arithmetic terminal, executing arithmetic operations such as addition, multiplication and division. The processor has a second terminal, which contains functional logic to execute all other instructions in the instruction set. The invention is useful for arithmetic intensive applications, such as graphic processors.
Abstract:
Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.
Abstract:
Circuits and methods for subdividing a decoder into functional blocks that can be accessed separately. The decoder includes a decoder module having a parser, a block decoder and a motion compensation engine, which can all be further subdivided into functional blocks. The functional blocks can be bypassed in decompressing frames where the blocks are not necessary, or when the compression algorithm does not require the functional block, increasing the speed of the decoder. The functional blocks can also be reused for decompression or compression based on different standards, or for different operation in the decoder, such as decompression and compression. The decoder can be coupled to a processor and some of the functional block performed in the decoder's hardware and some are performed in the processor. In one embodiment of the invention and the processor determines which block are to be by-passed completely and which block are to be performed in software based on the decompression protocol to which the compressed frame is encoded to comply to, the capacity and speed of the processor, and the available memory. In another embodiment multiplexers can be added to the decoder to connect functional blocks so they can be by-passed or reused based on preprogramming of the multiplexers based on the decompression protocol to which the compressed frame is encoded to comply to, the capacity and speed of the processor, and the available memory.
Abstract:
A method of forming a semiconductor device is disclosed. The method including providing a substrate with at least one insulating layer disposed thereon, the at least one insulating layer including a trench; forming at least one liner layer on the at least one insulating layer; forming a nucleation layer on the at least one liner layer; forming a first metal film on a surface of the nucleation layer; etching the first metal film; and depositing a second metal film on the etched surface of the first metal film, the second metal film substantially forming an overburden above the trench.
Abstract:
A thick metal layer is formed on a semiconductor integrated circuit in multiple different deposition chambers. A first portion of the metal layer is formed in a first deposition chamber, the first thickness being approximately half the target thickness. The substrate is then removed from the first chamber and transported to a second chamber. The deposition of the same metal layer continues in a second chamber, having the same grain structure and orientation. The second portion of the metal layer is grown to achieve the final thickness. By using two different deposition chambers to form the single metal layer, layers in excess of 25,000 angstroms in thickness can be obtained.
Abstract:
A processor that can execute instructions in either scalar mode or vector mode. In scalar mode, instructions are executed once per fetch. In vector mode, instructions are executed multiple times per fetch. In vector mode, the processor recognizes scalar variables and vector variables. Scalar variables may be assigned a fixed memory location. Vector variables use different physical locations at different iterations of the same instruction. The processor includes circuitry to automatically index addresses of vector variables for each iteration of the same instruction. This circuitry partitions a register into a vector region and a scalar region. Accesses to the vector region are automatically indexed based on the number of iterations of the instruction that have been performed.
Abstract:
A high speed processor. The processor includes terminals that each execute a subset of the instruction set. In at least one of the terminals, the instructions are executed in an order determined by data flow. Instructions are loaded into the terminal in pages. A notation is made when an operand for an instruction is generated by another instruction. When operands for an instruction are available, that instruction is a “ready” instruction. A ready instruction is selected in each cycle and executed. To allow data to be transmitted between terminals, each terminal is provided with a receive station, such that data generated in one terminal may be transmitted to another terminal for use as an operand in that terminal. In one embodiment, one terminal is an arithmetic terminal, executing arithmetic operations such as addition, multiplication and division. The processor has a second terminal, which contains functional logic to execute all other instructions in the instruction set. The invention is useful for arithmetic intensive applications, such as graphic processors.