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公开(公告)号：US09415466B2
公开(公告)日：2016-08-16
申请号：US13882928
申请日：2011-09-16
Applicant: Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
Inventor： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
CPC classification number: B23K26/0648 , B23C2226/125 , B23C2226/315 , B23C2260/56 , B23D65/02 , B23K26/06 , B23K26/0613 , B23K26/064 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2103/50 , Y10T407/27
Abstract: Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.
Abstract translation: 提供了一种用于制造切削工具的技术，其能够提供具有表面均匀光滑并且具有稳定性能的切割表面的切削工具。 提供一种切削工具制造方法，其中通过使用通过组合两个线性偏振激光束形成的激光束来切割切削工具材料，使得两个线性偏振激光束的偏振方向在右侧 彼此的角度; 使用圆偏振激光束作为激光束的切削工具制造方法; 使用随机偏振激光束作为激光束的切削工具制造方法; 通过制造方法制造的切削工具; 一种切削工具制造装置，包括用于产生由两个线偏振激光束形成的组合激光束的装置，两个线偏振激光束的偏振方向彼此成直角;以及光学系统，其引导组合的激光束 对刀具材料; 一种切削工具制造装置，包括用于产生圆偏振激光束的装置; 以及包括用于产生随机偏振激光束的装置的切削工具制造装置。
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公开(公告)号：US20160101492A1
公开(公告)日：2016-04-14
申请号：US14510544
申请日：2014-10-09
Inventor： Yin CHUANG , Chao-Yung YEH , Chung-Li TSAI , Yu-Ting LYU
CPC classification number: B23P25/006 , B23C3/00 , B23C2226/18 , B23C2260/56 , B23K26/0093
Abstract: A laser-assisted machining device includes a spindle, a beam splitting module and a cutting tool. The spindle has a chamber, and multiple exit holes. The beam splitting module is disposed in the spindle and includes a beam splitter for splitting a main laser beam into a plurality of secondary laser beams that are directed into the chamber, and an outer reflecting unit mounted in the chamber for reflecting the secondary laser beams out of the spindle through the exit holes. The cutting tool is fixedly mounted on the spindle, for machining a workpiece, and includes multiple cutting teeth. The secondary laser beams maintain constant irradiation on multiple areas of the workpiece during rotation of the spindle.
Abstract translation: 激光辅助加工装置包括主轴，分束模块和切割工具。 主轴具有一个腔室和多个出口孔。 分束模块设置在主轴中，并且包括分束器，用于将主激光束分成多个被引导到腔室中的次级激光束;以及外反射单元，其安装在腔室中以将次级激光束反射出来 主轴通过出口孔。 切割工具固定在主轴上，用于加工工件，并包括多个切割齿。 次级激光束在主轴转动期间保持工件的多个区域恒定的照射。
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公开(公告)号：US20180065226A1
公开(公告)日：2018-03-08
申请号：US15728074
申请日：2017-10-09
Applicant: Minute Key Inc.
Inventor： Richard L. Gardner , Bradford Shayne Cooley , David Kortbawi
CPC classification number: B23Q35/00 , B23C2235/24 , B23C2235/32 , B23C2235/41 , B23C2260/56 , B23C2260/76 , G01B5/0018 , G01B11/24
Abstract: A system for duplicating a master key includes a mechanism for receiving and positioning a master key. The master key defines a major key axis and an intermediate key axis along which a key blade variably extends, and a minor key axis along a key thickness. Optical path components direct a light beam along the minor key axis. The light beam impinges upon the key blade. A portion of the light beam traverses the key blade. A detector receives the portion of the light beam that traverses the key blade. An apparatus imparts relative motion along the major key axis between the light beam and the master key. The light beam scans along the major key axis of the master key. A processor receives a signal from the detector as the beam scans along the major key axis and generates information usable for defining the machining of a duplicate key.
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公开(公告)号：US20140054275A1
公开(公告)日：2014-02-27
申请号：US13882928
申请日：2011-09-16
Applicant: Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
Inventor： Kazuo Nakamae , Hiroyuki Murase , Katsuko Yamamoto , Mamoru Ono , Katsuyuki Tanaka , Toshimitsu Sakata , Teruhiro Enami , Yutaka Kobayashi
CPC classification number: B23K26/0648 , B23C2226/125 , B23C2226/315 , B23C2260/56 , B23D65/02 , B23K26/06 , B23K26/0613 , B23K26/064 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2103/50 , Y10T407/27
Abstract: Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.
Abstract translation: 提供了一种用于制造切削工具的技术，其能够提供具有表面均匀光滑并且具有稳定性能的切割表面的切削工具。 提供一种切削工具制造方法，其中通过使用通过组合两个线性偏振激光束形成的激光束来切割切削工具材料，使得两个线性偏振激光束的偏振方向在右侧 彼此的角度; 使用圆偏振激光束作为激光束的切削工具制造方法; 使用随机偏振激光束作为激光束的切削工具制造方法; 通过制造方法制造的切削工具; 一种切削工具制造装置，包括用于产生由两个线偏振激光束形成的组合激光束的装置，两个线偏振激光束的偏振方向彼此成直角;以及光学系统，其引导组合的激光束 对刀具材料; 一种切削工具制造装置，包括用于产生圆偏振激光束的装置; 以及包括用于产生随机偏振激光束的装置的切削工具制造装置。
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公开(公告)号：US09987715B2
公开(公告)日：2018-06-05
申请号：US15728074
申请日：2017-10-09
Applicant: Minute Key Inc.
Inventor： Richard L Gardner , Bradford Shayne Cooley , David Kortbawi
CPC classification number: B23Q35/00 , B23C2235/24 , B23C2235/32 , B23C2235/41 , B23C2260/56 , B23C2260/76 , G01B5/0018 , G01B11/24
Abstract: A system for duplicating a master key includes a mechanism for receiving and positioning a master key. The master key defines a major key axis and an intermediate key axis along which a key blade variably extends, and a minor key axis along a key thickness. Optical path components direct a light beam along the minor key axis. The light beam impinges upon the key blade. A portion of the light beam traverses the key blade. A detector receives the portion of the light beam that traverses the key blade. An apparatus imparts relative motion along the major key axis between the light beam and the master key. The light beam scans along the major key axis of the master key. A processor receives a signal from the detector as the beam scans along the major key axis and generates information usable for defining the machining of a duplicate key.
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Patent Agency Ranking
公开(公告)号：US09808900B2
公开(公告)日：2017-11-07
申请号：US15191071
申请日：2016-06-23
Applicant: Minute Key Inc.
Inventor： Richard L. Gardner , Bradford Shayne Cooley , David Kortbawi
CPC classification number: B23Q35/00 , B23C2235/24 , B23C2235/32 , B23C2235/41 , B23C2260/56 , B23C2260/76 , G01B5/0018 , G01B11/24
Abstract: A system for duplicating a master key includes a mechanism for receiving and positioning a master key. The master key defines a major key axis and an intermediate key axis along which a key blade variably extends, and a minor key axis along a key thickness. Optical path components direct a light beam along the minor key axis. The light beam impinges upon the key blade. A portion of the light beam traverses the key blade. A detector receives the portion of the light beam that traverses the key blade. An apparatus imparts relative motion along the major key axis between the light beam and the master key. The light beam scans along the major key axis of the master key. A processor receives a signal from the detector as the beam scans along the major key axis and generates information usable for defining the machining of a duplicate key.
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公开(公告)号：US20180250785A1
公开(公告)日：2018-09-06
申请号：US15971142
申请日：2018-05-04
Applicant: Minute Key Inc.
Inventor： Richard L. Gardner , Bradford Shayne Cooley , David Kortbawi
CPC classification number: B23Q35/00 , B23C2235/24 , B23C2235/32 , B23C2235/41 , B23C2260/56 , B23C2260/76 , G01B5/0018 , G01B11/24
Abstract: A system for duplicating a master key includes a mechanism for receiving and positioning a master key. The master key defines a major key axis and an intermediate key axis along which a key blade variably extends, and a minor key axis along a key thickness. Optical path components direct a light beam along the minor key axis. The light beam impinges upon the key blade. A portion of the light beam traverses the key blade. A detector receives the portion of the light beam that traverses the key blade. An apparatus imparts relative motion along the major key axis between the light beam and the master key. The light beam scans along the major key axis of the master key. A processor receives a signal from the detector as the beam scans along the major key axis and generates information usable for defining the machining of a duplicate key.
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公开(公告)号：US20160377418A1
公开(公告)日：2016-12-29
申请号：US15191071
申请日：2016-06-23
Applicant: Minute Key Inc.
Inventor： Richard L. Gardner , Bradford Shayne Cooley , David Kortbawi
CPC classification number: B23Q35/00 , B23C2235/24 , B23C2235/32 , B23C2235/41 , B23C2260/56 , B23C2260/76 , G01B5/0018 , G01B11/24
Abstract: A system for duplicating a master key includes a mechanism for receiving and positioning a master key. The master key defines a major key axis and an intermediate key axis along which a key blade variably extends, and a minor key axis along a key thickness. Optical path components direct a light beam along the minor key axis. The light beam impinges upon the key blade. A portion of the light beam traverses the key blade. A detector receives the portion of the light beam that traverses the key blade. An apparatus imparts relative motion along the major key axis between the light beam and the master key. The light beam scans along the major key axis of the master key. A processor receives a signal from the detector as the beam scans along the major key axis and generates information usable for defining the machining of a duplicate key.
Abstract translation: 用于复制主密钥的系统包括用于接收和定位主密钥的机制。 主键定义主键轴和中间键轴，键盘可沿其沿可变地延伸，以及沿着键厚度的次键轴。 光路组件沿着次键轴引导光束。 光束撞击钥匙片。 光束的一部分穿过键盘。 检测器接收穿过钥匙片的光束的部分。 装置沿光束和主密钥之间的主键轴施加相对运动。 光束沿着主键的主键轴扫描。 当光束沿着主键轴扫描时，处理器从检测器接收信号，并产生可用于定义重复键的加工的信息。
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公开(公告)号：US20090196697A1
公开(公告)日：2009-08-06
申请号：US12155698
申请日：2008-06-09
Applicant: Chia-Lung Kuo , Jr-Shiang You
Inventor： Chia-Lung Kuo , Jr-Shiang You
CPC classification number: B23C3/00 , B23C5/10 , B23C2260/56 , B23Q17/2233 , B23Q17/24 , Y10T408/21 , Y10T408/44
Abstract: A multi-function cutting machine includes a cutting tool for cutting a workpiece, a feeder for selectively feeding a gas or fluid to through a longitudinal passage of the cutting tool to the workpiece to carry away cutting chips from the workpiece, a first laser beam and a second laser beam respectively projected through the passage of the cutting tool onto the workpiece, and a detection control device for receiving the reflective light wave of the second laser beam reflected by the workpiece for measuring the working depth of the cutting tool.
Abstract translation: 多功能切割机包括用于切割工件的切割工具，用于选择性地将气体或流体供给到通过切割工具的纵向通道到工件以将切屑从工件运送出来的进料器，第一激光束和 分别通过切割工具通过工件的第二激光束;以及检测控制装置，用于接收由工件反射的第二激光束的反射光波，以测量切削工具的工作深度。
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公开(公告)号：US20180113425A1
公开(公告)日：2018-04-26
申请号：US15335202
申请日：2016-10-26
Applicant: Embraer S.A.
Inventor： Megumi NAKASHIMA , Erik Spada DA SILVA , Lincoln José LEPRI , Pércio Roiz SAITO
CPC classification number: G05B13/041 , B23C3/13 , B23C2215/04 , B23C2220/28 , B23C2260/56 , B64C1/26 , B64F5/10 , G05B2219/33198 , G05B2219/37355 , G05B2219/45071
Abstract: Every junction part for an airplane wing is manufactured with overmaterial. Each part is measured with a laser based interferometer or other scanning technique and the “as built” measurements are compared with a model to generate a new trajectory milling program to fill or prevent gaps between parts using a points cloud and B-Spline algorithm to generate a new surface to be milled. Once the program is generated (new trajectories) and post processed, it is sent to a milling machine to perform overmaterial milling on already milled parts with overmaterial. This technique can be used to eliminate gaps between junction parts and the corresponding need for shims.
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