公开(公告)号：US20180134543A1

公开(公告)日：2018-05-17

申请号：US15650822

申请日：2017-07-14

Applicant: Analog Devices, Inc.

Inventor： Jinbo Kuang ,  Gaurav Vohra

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0051 ,  B81B3/0013 ,  B81B3/0059 ,  B81B2207/012 ,  B81C1/00976 ,  B81C2201/11 ,  B81C2203/0109 ,  B81C2203/0118

Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

公开(公告)号：US20180162721A1

公开(公告)日：2018-06-14

申请号：US15379401

申请日：2016-12-14

Applicant: Texas Instruments Incorporated

Inventor： Simon Joshua Jacobs ,  Molly Nelis Sing

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B29C65/48 ,  B81B7/02 ,  B81B2201/042 ,  B81C1/00214 ,  B81C1/00285 ,  B81C2201/11 ,  H01L21/56 ,  H01L21/67 ,  H01L23/10 ,  H01L23/20 ,  H01L29/12 ,  H01L29/84

Abstract: In described examples, a MEMS device is enclosed within a sealed package including nonmetal oxide gasses at levels greater than 1% by volume. In at least one example, the MEMS device is protected against premature failure from various causes, including charging, particle growth and stiction by moieties of the nonmetal oxide gasses reacting with various exposed surfaces within the package of the MEMS device and/or the adsorbed water layers on said surfaces.