Vacuum electron device electrodes and components manufactured from highly oriented pyrolytic graphite (HOPG)
    4.
    发明授权
    Vacuum electron device electrodes and components manufactured from highly oriented pyrolytic graphite (HOPG) 有权
    由高取向热解石墨(HOPG)制造的真空电子器件电极和部件

    公开(公告)号:US08610343B2

    公开(公告)日:2013-12-17

    申请号:US13492645

    申请日:2012-06-08

    Abstract: Components for use in vacuum electron devices are fabricated from highly oriented pyrolytic graphite (HOPG) and exhibit excellent thermal conductivity, low sputtering rates, and low ion erosion rates as compared to conventional components made from copper or molybdenum. HOPG can be reliably brazed by carefully controlling tolerances, calculating braze joint material volume, and applying appropriate compression during furnace operations. The resulting components exhibit superior thermal performance and enhanced resistance to ion erosion and pitting.

    Abstract translation: 用于真空电子器件的组件由高取向热解石墨(HOPG)制成,并且与由铜或钼制成的常规元件相比,显示出优异的导热性,低溅射速率和低离子侵蚀速率。 HOPG可以通过仔细控制公差,计算钎焊接头材料体积以及在炉子操作期间施加适当的压缩来可靠地钎焊。 所得组分表现出优异的热性能和增强的抗离子侵蚀和点蚀性能。

    VACUUM ELECTRON DEVICE ELECTRODES AND COMPONENTS MANUFACTURED FROM HIGHLY ORIENTED PYROLYTIC GRAPHITE (HOPG)
    7.
    发明申请
    VACUUM ELECTRON DEVICE ELECTRODES AND COMPONENTS MANUFACTURED FROM HIGHLY ORIENTED PYROLYTIC GRAPHITE (HOPG) 有权
    真空电子装置电极和由高取向的热塑性石墨(HOPG)制造的组件

    公开(公告)号:US20120313505A1

    公开(公告)日:2012-12-13

    申请号:US13492645

    申请日:2012-06-08

    Abstract: Components for use in vacuum electron devices are fabricated from highly oriented pyrolytic graphite (HOPG) and exhibit excellent thermal conductivity, low sputtering rates, and low ion erosion rates as compared to conventional components made from copper or molybdenum. HOPG can be reliably brazed by carefully controlling tolerances, calculating braze joint material volume, and applying appropriate compression during furnace operations. The resulting components exhibit superior thermal performance and enhanced resistance to ion erosion and pitting.

    Abstract translation: 用于真空电子器件的组件由高取向热解石墨(HOPG)制成,并且与由铜或钼制成的常规元件相比,显示出优异的导热性,低溅射速率和低离子侵蚀速率。 HOPG可以通过仔细控制公差,计算钎焊接头材料体积以及在炉子操作期间施加适当的压缩来可靠地钎焊。 所得组分表现出优异的热性能和增强的抗离子侵蚀和点蚀性能。

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