Abstract:
An electrode of an inductive output tube (IOT) is provided with channels for guiding cooling fluid. In one aspect of the invention, the channels are in a confronting relationship with a jacket surrounding the electrode and spaced from the electrode so as to define an interior region. Cooling fluid such as oil is circulated in the channels in fluid communication with the interior region, providing an escape mechanism for trapped bubbles in order to prevent localized heating of the electrode. In another aspect of the invention, the channels form multiple intersecting helical patterns of different pitches, with the steeper-pitched channels providing a more direct escape route for the bubbles.
Abstract:
The invention relates to a cooling device for an electron tube designed to amplify a high frequency signal. The invention is particularly suitable for cooling electron tubes that amplify radio frequency signals used for television or for radio. The electron tube (100) is installed on a portal frame (101) designed to hold it. The device comprises a first hydraulic circuit (103) inside which a first fluid circulates to cool at least part (8, 15) of the tube (100). The device also comprises a fluidnullfluid exchanger (104) to transfer heat transported by the first fluid to a second hydraulic circuit (120). The exchanger (104) is also located on the portal frame (101).
Abstract:
A plurality of a U-shaped heat radiation plates are provided on a heat radiating tube. These U-shaped plates have different sizes and elongated in the same direction so as to cross an axis of the tube. The emissive heat radiator may also includes at least one radiating plate 2 substantially perpendicular to each axis of the U-shaped plates. A concave surface of the U-shaped plate is subjected to a radiation surface processing, and a convex surface thereof is subjected to a reflection surface processing.
Abstract:
A collector for a travelling-wave tube includes a collector core and a fin structure surrounding the core and having a plurality of fins for heat radiation. An oxide film having a thickness of greater than 50 .mu.m inclusive is formed on the outer periphery of the fin structure by anodization and has the maximum surface roughness of 12 .mu.m inclusive. When the 50 .mu.m or thicker oxide film is sealed or when a 45 .mu.m or thicker oxide film is formed and sealed, the oxide film is provided with the maximum surface roughness of greater than 12 .mu.m inclusive. The collector with any one of such structures achieves an emissivity of 0.90 or above and can efficiently radiate heat generated by the tube in the space.
Abstract:
In a traveling wave tube, an electron beam collector and an electrically insulating cylinder having good thermal conductivity and dielectric strength are arranged in a bore of a cooling housing to improve heat elimination from the electron beam collector. The cylinder is deformable in a radial direction, is of an elastic material, and is dimensioned so that it fixes the electron beam collector in the bore of the housing with a tight fit.
Abstract:
In a power electronic tube the outer surface of the collector is in the shape of a cylinder and has equidistant grooves formed in cross-sections and along the generatrices of this cylinder, which gives them flexibility and allows assembly with an insulating sleeve.
Abstract:
A heat-dissipating device for the collectors of electron-beam tubes such as a traveling wave tube. The collector slides loosely into a bore within a cylindrical heat-absorbing and conducting member. The heat-absorbing member is connected to a finned heatradiating structure to which heat is conducted for dissipation. A tight fitting between the collector and the heat-absorbing member is created by the presence of a restraining collar placed around the heat-absorbing member. The collar has a smaller coefficient of expansion than the heat-absorbing member, and the heatabsorbing member has longitudinal slots therein, the net effect of which is to cause the heat-absorbing member to constrict about the collector when the assembly heats to operating temperature.