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Patent Agency Ranking
公开(公告)号：US20140203065A1
公开(公告)日：2014-07-24
申请号：US14161527
申请日：2014-01-22
Applicant: Micro Point Pro LTD.
Inventor： Uri Zaks , Irina Voskoboynikov , Yefim Prosso , Irina Sastiel
IPC: H01L23/00
CPC classification number: H01L24/78 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/78315 , H01L2224/78318 , H01L2224/78319 , H01L2924/00014 , H01L2924/381 , Y10T29/49995 , H01L2924/20752 , H01L2924/20751 , H01L2224/45099 , H01L2924/00
Abstract: An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.
Abstract translation: 公开了一种用于其制造的超细节距楔形结合工具及其方法。 楔形工具形成有足够的宽度，其足以使得以超细间距分离的线的精确结合。 楔形工具由具有符合规定的限制的特性的碳化钨合金制成，导致改进的性能并且能够使用较粗的线。 在楔形工具的尖端处形成有口袋，并且从工具的后侧形成送丝孔，并且在接合脚的上方的高度处离开口袋内部。 侧壁设置在口袋的两侧，以引导离开口袋内的进给孔的线朝着接合脚。
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公开(公告)号：US20180200828A1
公开(公告)日：2018-07-19
申请号：US15924056
申请日：2018-03-16
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Dominick A. DeAngelis
CPC classification number: B23K20/106 , B23K20/004 , B23K20/005 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/78252 , H01L2224/78319 , H01L2224/78343 , H01L2224/78349 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2924/206
Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
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公开(公告)号：US09543267B2
公开(公告)日：2017-01-10
申请号：US14161527
申请日：2014-01-22
Applicant: Micro Point Pro LTD.
Inventor： Uri Zaks , Irina Voskoboynikov , Yefim Prosso , Irina Sastiel
CPC classification number: H01L24/78 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/78315 , H01L2224/78318 , H01L2224/78319 , H01L2924/00014 , H01L2924/381 , Y10T29/49995 , H01L2924/20752 , H01L2924/20751 , H01L2224/45099 , H01L2924/00
Abstract: An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.
Abstract translation: 公开了一种用于其制造的超细节距楔形结合工具及其方法。 楔形工具形成有足够的宽度，其足以使得以超细间距分离的线的精确结合。 楔形工具由具有符合规定的限制的特性的碳化钨合金制成，导致改进的性能并且能够使用较粗的线。 在楔形工具的尖端处形成有口袋，并且从工具的后侧形成送丝孔，并且在接合脚的上方的高度处离开口袋内部。 侧壁设置在口袋的两侧，以引导离开口袋内的进给孔的线朝着接合脚。
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公开(公告)号：US09931709B2
公开(公告)日：2018-04-03
申请号：US15409172
申请日：2017-01-18
Applicant: ORTHODYNE ELECTRONICS CORPORATION
Inventor： Dominick A. DeAngelis
CPC classification number: B23K20/106 , B23K20/004 , B23K20/005 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/78252 , H01L2224/78319 , H01L2224/78349 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099
Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
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公开(公告)号：US20170209956A1
公开(公告)日：2017-07-27
申请号：US15409172
申请日：2017-01-18
Applicant: ORTHODYNE ELECTRONICS CORPORATION
Inventor： Dominick A. DeAngelis
CPC classification number: B23K20/106 , B23K20/004 , B23K20/005 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/78252 , H01L2224/78319 , H01L2224/78349 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099
Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
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