公开(公告)号：US20140326778A1

公开(公告)日：2014-11-06

申请号：US13888189

申请日：2013-05-06

申请人： Shang-Che Lee

发明人： Shang-Che Lee

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/78315 ,  H01L2224/78316 ,  H01L2224/78756 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/45099

摘要： An ultrasonic wire bonding wedge with multiple bonding wire slots is provided. The wire bonding wedge includes a pillar fixing part for providing fixed connection to the bonding device. One end of the fixing part includes a wire bonding wedge nozzle, with feature that the tip of the nozzle including at least two bonding wire slots. The tip of nozzle of the wire bonding wedge includes at least two bonding wire slots, and is able to realize bonding operations between two or more bonding wires and the chips to improve bonding operation efficiency. When bonding operation is performed on a smaller bonding area, or two or more parallel bonding wires, the wire bonding wedge is able to perform a single bonding operation in a smaller bonding operation so as to reduce defective rate of the chips and ensure sufficient bonding strength of the bonding operation.

摘要翻译： 提供具有多个接合线槽的超声波引线接合楔。 引线键合楔包括用于提供与接合装置的固定连接的柱固定部。 固定部分的一端包括引线键合楔形喷嘴，其特征在于喷嘴的尖端包括至少两个接合线槽。 引线接合楔的喷嘴的尖端包括至少两个接合线槽，并且能够实现两个或更多个接合线和芯片之间的接合操作，以提高接合操作效率。 当在较小的接合面积或两根或多根平行的接合线上进行接合操作时，引线接合楔可以在较小的接合操作中进行单次接合操作，以便减少切屑的缺陷率并确保足够的接合强度 的接合操作。

公开(公告)号：US07934633B2

公开(公告)日：2011-05-03

申请号：US12103284

申请日：2008-04-15

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B23K20/10 ,  B29C65/08

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

公开(公告)号：US07838101B2

公开(公告)日：2010-11-23

申请号：US12535928

申请日：2009-08-05

申请人： Mark Arnold Delsman ,  Christoph Benno Luechinger

发明人： Mark Arnold Delsman ,  Christoph Benno Luechinger

IPC分类号： B32B3/00 ,  H01L23/48

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4807 ,  H01L2224/48458 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

摘要翻译： 使用具有薄突起的华夫饼形状和突起之间的间隙的接合工具脚形成超声波接合。 使该工具与丝带接触一段深度，以在距离下面的粘合表面大约150μm或更小的条带上产生凹陷。 然后将该工具进一步下降到带状物中以在凹部之间接触带的部分，例如额外的25至50μm。 结果是在凹槽部分之下的轻度粘合区域和在突起的下方和键周围的高度粘合区域。 在另一个实施例中，沿带的部分宽度形成超声波接合。

公开(公告)号：US20230318207A1

公开(公告)日：2023-10-05

申请号：US18001814

申请日：2021-06-14

申请人： Heraeus Nexensos GmbH

发明人： Matthias MUZIOL ,  Martin BLEIFUß

IPC分类号： H01R4/02 ,  H01R4/12 ,  H01L23/00

CPC分类号： H01R4/023 ,  H01L2924/351 ,  H01L24/43 ,  H01L24/49 ,  H01L24/85 ,  H01L24/45 ,  H01L2224/45147 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/45124 ,  H01L2224/45026 ,  H01L2224/49111 ,  H01L2224/78252 ,  H01L2224/8584 ,  H01L24/78 ,  H01L2224/85203 ,  H01L2224/78315 ,  H01R2201/20 ,  H01L2224/43822 ,  H01L2224/45639 ,  H01L2224/45139 ,  H01L2224/45565 ,  H01L2224/45691 ,  H01R4/12

摘要： The invention relates to an electrical element having at least one functional region and a contact surface, wherein a connecting element is arranged on the contact surface, wherein the connecting element comprises a stranded wire coated with sintered material, wherein the stranded wire is connected, in particular sintered, to the contact surface by a sintered material. Furthermore, the invention relates to a method for producing the electrical element according to the invention.

公开(公告)号：US09543267B2

公开(公告)日：2017-01-10

申请号：US14161527

申请日：2014-01-22

申请人： Micro Point Pro LTD.

发明人： Uri Zaks ,  Irina Voskoboynikov ,  Yefim Prosso ,  Irina Sastiel

IPC分类号： B23K31/02 ,  H01L23/00

CPC分类号： H01L24/78 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78315 ,  H01L2224/78318 ,  H01L2224/78319 ,  H01L2924/00014 ,  H01L2924/381 ,  Y10T29/49995 ,  H01L2924/20752 ,  H01L2924/20751 ,  H01L2224/45099 ,  H01L2924/00

摘要： An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.

摘要翻译： 公开了一种用于其制造的超细节距楔形结合工具及其方法。 楔形工具形成有足够的宽度，其足以使得以超细间距分离的线的精确结合。 楔形工具由具有符合规定的限制的特性的碳化钨合金制成，导致改进的性能并且能够使用较粗的线。 在楔形工具的尖端处形成有口袋，并且从工具的后侧形成送丝孔，并且在接合脚的上方的高度处离开口袋内部。 侧壁设置在口袋的两侧，以引导离开口袋内的进给孔的线朝着接合脚。

公开(公告)号：US20140103095A1

公开(公告)日：2014-04-17

申请号：US14118919

申请日：2012-09-13

申请人： ORTHODYNE ELECTRONICS CORPORATION

发明人： Todd J. Walker

IPC分类号： B23K20/10

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4847 ,  H01L2224/78315 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wire bonding tool including a body portion terminating in a tip portion is provided. The tip portion includes opposing walls defining a groove, each of the opposing walls having a curved profile.

摘要翻译： 提供一种引线接合工具，其包括终止于尖端部分的主体部分。 尖端部分包括限定凹槽的相对壁，每个相对的壁具有弯曲轮廓。

公开(公告)号：US3822465A

公开(公告)日：1974-07-09

申请号：US20671571

申请日：1971-12-10

申请人： PHILIPS CORP

发明人： FRANKORT M ,  DE JONG M ,  DE GIER N ,  HULST A

IPC分类号： B23K20/10 ,  B23K21/00

CPC分类号： B23K20/10 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45565 ,  H01L2224/48455 ,  H01L2224/78315 ,  H01L2924/00011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/01052

摘要： A method of and a device for the ultrasonic welding of wires comprising a non-metal insulating layer on the metal surface of a support by means of a welding tip which is made to vibrate in a direction parallel to the longitudinal direction of a wire to be welded; according to a previously programmed welding cycle, the insulating layer is first removed locally and the wire is then welded; a preceding mechanical or chemical cleaning of the wires is not necessary. The method according to the disclosure provides a welded joint which has compact dimensions and a high mechanical strength.

摘要翻译： 一种用于超声波焊接的方法和装置，其包括通过焊接头在支撑体的金属表面上的非金属绝缘层，该焊接头在与电线纵向方向平行的方向上振动， 焊接 根据先前编程的焊接周期，绝缘层首先被局部去除，然后焊接焊丝; 电线之前的机械或化学清洁是不必要的。 根据本公开的方法提供了具有紧凑尺寸和高机械强度的焊接接头。

公开(公告)号：US3116655A

公开(公告)日：1964-01-07

申请号：US22300562

申请日：1962-09-12

申请人： ESOPI ALDO J

发明人： ESOPI ALDO J

IPC分类号： H01L21/00 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/78315 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  Y10S228/904 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：US20170062381A1

公开(公告)日：2017-03-02

申请号：US15308544

申请日：2015-05-08

申请人： ROHM CO., LTD.

发明人： Kazuya IKOMA

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/85 ,  B23K20/10 ,  B23K20/1205 ,  B23K20/129 ,  H01L21/4825 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78315 ,  H01L2224/78343 ,  H01L2224/7855 ,  H01L2224/78705 ,  H01L2224/78756 ,  H01L2224/83801 ,  H01L2224/85047 ,  H01L2224/85136 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85423 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/014

摘要： A manufacturing method for a wire bonding structure of the present invention includes a step of preparing a wire made of Cu and a step of joining the wire to a first joining target formed on an electronic device. Before the joining step, the wire has an outer circumferential surface and a withdrawn surface. The withdrawn surface is withdrawn toward a central axis of the wire from the outer circumferential surface. In the joining step, ultrasonic vibration is applied to the wire in a state in which the withdrawn surface is pressed against the first joining target.

摘要翻译： 本发明的引线接合结构体的制造方法包括：制备由Cu制成的线的步骤和将导线接合到形成在电子器件上的第一接合目标的步骤。 在接合步骤之前，电线具有外圆周表面和退出表面。 退出的表面从外周面朝着线的中心轴线退出。 在接合步骤中，在退避表面被压靠在第一接合对象上的状态下，将超声波振动施加于线。

公开(公告)号：US08820609B2

公开(公告)日：2014-09-02

申请号：US14118919

申请日：2012-09-13

申请人： Todd J. Walker

发明人： Todd J. Walker

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： B23K20/106 ,  B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4847 ,  H01L2224/78315 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wire bonding tool including a body portion terminating in a tip portion is provided. The tip portion includes opposing walls defining a groove, each of the opposing walls having a curved profile.

摘要翻译： 提供一种引线接合工具，其包括终止于尖端部分的主体部分。 尖端部分包括限定凹槽的相对壁，每个相对的壁具有弯曲轮廓。