公开(公告)号：US20230327624A1

公开(公告)日：2023-10-12

申请号：US18334466

申请日：2023-06-14

Applicant: Wolfspeed, Inc.

Inventor： Alexander Komposch ,  Eng Wah Woo ,  Basim Noori

IPC: H03F3/72 ,  H01Q1/52 ,  H03F1/56 ,  H03F3/19 ,  H03F3/21 ,  H03H2/00

CPC classification number: H03F3/72 ,  H01Q1/526 ,  H03F1/56 ,  H03F3/19 ,  H03F3/211 ,  H03H2/008

Abstract: A transistor device package includes a component assembly comprising an interconnect structure, a transistor die having a front surface including gate, drain, and source terminal on a first surface of the interconnect structure, and one or more passive electrical components electrically coupled to the gate, drain, and/or source terminal by the interconnect structure. A thermally conductive flange is attached to a back surface of the transistor die, which is opposite the front surface, by a conductive adhesive. Respective patterns of the conductive adhesive are provided on the first surface of the interconnect structure, and least one of the respective patterns of the conductive adhesive provides an input, output, or ground signal path for the transistor device package. Related fabrication methods are also discussed.

公开(公告)号：US3488595A

公开(公告)日：1970-01-06

申请号：US3488595D

申请日：1966-10-05

Applicant: HAZELTINE RESEARCH INC

Inventor： VASILE CARMINE F

IPC: H03H2/00 ,  H03H7/01 ,  H03J3/06 ,  H04B1/16

CPC classification number: H03H2/008 ,  H03H7/0161 ,  H03H7/175 ,  H03H7/1766 ,  H03H7/1775 ,  H03J3/06

公开(公告)号：US3332020A

公开(公告)日：1967-07-18

申请号：US42062764

申请日：1964-12-23

Applicant: TELEFUNKEN PATENT

Inventor： OTTO KLANK

IPC: H03H2/00 ,  H04B1/10 ,  H04B1/18 ,  H04B1/24

CPC classification number: H03H2/008 ,  H04B1/10 ,  H04B1/18 ,  H04B1/24

公开(公告)号：US3116366A

公开(公告)日：1963-12-31

申请号：US83456159

申请日：1959-08-18

Applicant: SELIGSON ARNOLD L

Inventor： SELIGSON ARNOLD L

IPC: H03H2/00 ,  H04R19/04

CPC classification number: H04R19/04 ,  H03H2/008

公开(公告)号：US2927996A

公开(公告)日：1960-03-08

申请号：US51746155

申请日：1955-06-23

Applicant: DAVIS ROSS A

Inventor： DAVIS ROSS A

IPC: H03H2/00 ,  H03K17/88

CPC classification number: H03H2/008 ,  H03K17/88

公开(公告)号：US2798206A

公开(公告)日：1957-07-02

申请号：US38186353

申请日：1953-09-23

Applicant: MOTOROLA INC

Inventor： BAROCH GEORGE F

IPC: A01G25/09 ,  H03H2/00 ,  H03H7/01

CPC classification number: H03H7/0161 ,  A01G25/097 ,  H03H2/008 ,  H03H7/0123

公开(公告)号：US2735988A

公开(公告)日：1956-02-21

申请号：US2735988D

IPC: H03H2/00

CPC classification number: H03H2/008

公开(公告)号：US2619588A

公开(公告)日：1952-11-25

申请号：US9302149

申请日：1949-05-13

Applicant: KARL NOWAK

Inventor： KARL NOWAK

IPC: H03H2/00 ,  H04B1/16

CPC classification number: H04B1/163 ,  H03H2/008

公开(公告)号：US2595997A

公开(公告)日：1952-05-06

申请号：US68300146

申请日：1946-07-12

Applicant: HARTFORD NAT BANK & TRUST CO

Inventor： WEEL ADELBERT VAN

IPC: H03D7/14 ,  H03F3/54 ,  H03H2/00 ,  H03J3/28

CPC classification number: H03D7/1416 ,  H03F3/54 ,  H03H2/008 ,  H03J3/28

公开(公告)号：US2589736A

公开(公告)日：1952-03-18

申请号：US5307848

申请日：1948-10-06

Applicant: RCA CORP

Inventor： SANDS WILLIAM F

IPC: H03H2/00

CPC classification number: H03H2/008