公开(公告)号：US20240113689A1

公开(公告)日：2024-04-04

申请号：US18476700

申请日：2023-09-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Osamu KAWAUCHI

IPC: H03H9/19 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10

CPC classification number: H03H9/19 ,  H03H3/02 ,  H03H9/0561 ,  H03H9/1035 ,  H03H2003/023

Abstract: A vibrator element includes: a plate-shaped vibrating substrate including a first surface and a second surface, which are in a front and back relationship, and including a vibrating portion and a support portion that supports the vibrating portion and has a thickness smaller than that of the vibrating portion; an electrode including a first excitation electrode disposed at the first surface at the vibrating portion, a second excitation electrode disposed at the second surface at the vibrating portion, a first pad electrode disposed at the support portion and electrically coupled to the first excitation electrode, and a second pad electrode disposed at the support portion and electrically coupled to the second excitation electrode; a first metal film disposed at an upper layer on the first pad electrode and having a thickness larger than that of the first pad electrode; and a second metal film disposed at an upper layer on the second pad electrode and having a thickness larger than that of the second pad electrode.

公开(公告)号：US20180312395A1

公开(公告)日：2018-11-01

申请号：US15961564

申请日：2018-04-24

Applicant: SEIKO EPSON CORPORATION

Inventor： Takashi YAMAZAKI ,  Akihiko EBINA ,  Osamu KAWAUCHI ,  Yoshihiko YOKOYAMA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2207/096 ,  B81C1/00301

Abstract: A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.

公开(公告)号：US20150116951A1

公开(公告)日：2015-04-30

申请号：US14527947

申请日：2014-10-30

Applicant: Seiko Epson Corporation

Inventor： Osamu KAWAUCHI ,  Shinya AOKI ,  Juichiro MATSUZAWA ,  Masaru MIKAMI

IPC: H05K5/06 ,  H05K5/02 ,  B23K1/00

CPC classification number: H05K5/066 ,  B23K1/0016 ,  B23K11/06 ,  B23K26/244 ,  B23K28/02 ,  B23K2101/40 ,  G01C19/5783 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03H9/0552 ,  H03H9/1014 ,  H03H9/1071 ,  H05K5/0239

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract translation: 一种电子装置的制造方法，其在作为盖体的基座和盖子形成的内部空间中容纳作为电子部件的陀螺元件，包括：准备在后表面设置有槽的盖， 与所述基座焊接，所述内侧空间侧的所述槽的开口面积大于所述盖的外周侧的开口面积; 焊接，首先，基部和盖子在不包括凹槽的至少一部分的未焊接部分的部分，基部和盖子的计划焊接部分; 并且在所述未焊接部分处焊接所述基部和所述盖，从而使所述凹槽闭合。

公开(公告)号：US20240113688A1

公开(公告)日：2024-04-04

申请号：US18476529

申请日：2023-09-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Osamu KAWAUCHI

IPC: H03H9/19 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10

CPC classification number: H03H9/19 ,  H03H3/02 ,  H03H9/0561 ,  H03H9/1035 ,  H03H2003/023

Abstract: A vibrator element includes: a plate-shaped vibrating substrate including a first surface and a second surface, which are in a front and back relationship, and including a vibrating portion, a support portion, and a coupling portion that couples the vibrating portion to the support portion and includes a portion having a thickness smaller than that of the support portion; an electrode layer including a first excitation electrode disposed at the first surface at the vibrating portion, a second excitation electrode disposed at the second surface at the vibrating portion, a first pad electrode disposed at the support portion, a second pad electrode disposed at the support portion, a first coupling electrode disposed at the coupling portion and coupling the first excitation electrode to the first pad electrode, and a second coupling electrode disposed at the coupling portion and coupling the second excitation electrode to the second pad electrode; a first metal film disposed at an upper layer on the first coupling electrode that is located on the coupling portion and having a thickness larger than that of the electrode layer; and a second metal film disposed at an upper layer on the second coupling electrode that is located on the coupling portion and having a thickness larger than that of the electrode layer.

公开(公告)号：US20150116974A1

公开(公告)日：2015-04-30

申请号：US14528094

申请日：2014-10-30

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA ,  Osamu KAWAUCHI ,  Shinya AOKI ,  Masaru MIKAMI

IPC: H05K5/06 ,  H05K5/02 ,  B23K1/00

CPC classification number: H05K5/066 ,  B23K1/0016 ,  B23K11/061 ,  B23K11/16 ,  B23K26/206 ,  B23K26/32 ,  B23K2101/42 ,  B23K2103/05 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2924/16195 ,  H05K5/0239

Abstract: A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site.

Abstract translation: 一种制造电子装置的方法，其中将作为电子部件的陀螺元件容纳在由基座和盖作为盖体提供的内部空间中，包括：准备作为设置有凹槽的盖体的盖 该表面是与背面相反侧的表面，该表面是与基底接​​合的一侧上的表面; 在除了焊接部位之外的位置对基座和盖子进行焊缝，该未焊接部位包括对应于凹槽的至少一部分的部位，计划连接基部和盖子的部位; 并在未焊接部位焊接底座和盖子。

公开(公告)号：US20240297636A1

公开(公告)日：2024-09-05

申请号：US18592642

申请日：2024-03-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Takuro KOBAYASHI ,  Akinori YAMADA ,  Takashi YAMAZAKI ,  Osamu KAWAUCHI

IPC: H03H9/215 ,  H03H9/19

CPC classification number: H03H9/215 ,  H03H9/19

Abstract: A resonator element includes a base part and a vibrating arm. The vibrating arm includes an arm part and a wide part whose width is larger than that of the arm part. In the arm part, a first groove is formed on the first surface side, and a second groove is formed on the second surface side. 30 μm≤Wa≤75 μm, in which a width of the arm part is Wa, a thickness T between the first surface and the second surface of the arm part satisfies 110 μm≤T≤150 μm. 0.884≤(t1+t2)/T≤0.990, in which a depth of the first groove is t1, and a depth of the second groove is t2. 0.0056≤Wb/T≤0.0326, in which a width of the first surface arranged across the first groove and a width of the second surface arranged across the second groove are Wb. A length L1 of the vibrating arm satisfies L1≤1000 μm.

公开(公告)号：US20240258981A1

公开(公告)日：2024-08-01

申请号：US18426460

申请日：2024-01-30

Applicant: SEIKO EPSON CORPORATION

Inventor： Osamu KAWAUCHI ,  Takashi YAMAZAKI ,  Takuro KOBAYASHI

IPC: H03H3/02 ,  H03H9/215

CPC classification number: H03H3/02 ,  H03H9/215 ,  H03H2003/026

Abstract: A method of manufacturing a vibration element includes: manufacturing, by wet etching, a piezoelectric substrate including a vibration element, a frame portion, and a coupling portion that couples the frame portion and the vibration element; and folding the vibration element at the coupling portion and separating the vibration element from the frame portion. In the manufacturing of the piezoelectric substrate by the wet etching, the coupling portion is formed with a first groove portion, and a first protruding portion and a second protruding portion. The first protruding portion has a first outer shape side that defines an outer shape of the coupling portion and a second outer shape side that defines a boundary between the first protruding portion and the first groove portion, and is formed in a shape in which a distance between the first outer shape side and the second outer shape side decreases as a distance from the outer shape side of the vibration element increases. The second protruding portion has a third outer shape side that defines the outer shape of the coupling portion and a fourth outer shape side that defines a boundary between the second protruding portion and the first groove portion, and is formed in a shape in which a distance between the third outer shape side and the fourth outer shape side decreases as a distance from the outer shape side of the vibration element increases.

公开(公告)号：US20200067484A1

公开(公告)日：2020-02-27

申请号：US16551137

申请日：2019-08-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Takashi YAMAZAKI ,  Osamu KAWAUCHI ,  Akihiko EBINA

IPC: H03H9/205 ,  H03H9/05 ,  H03H9/10 ,  H03H3/04 ,  B23K26/362

Abstract: A vibrator device includes: a base; a vibrator disposed in the base; and a lid including a substrate having a light transmitting property and a silicon substrate joined to the substrate and a part of the base surrounding the vibrator.

公开(公告)号：US20150116915A1

公开(公告)日：2015-04-30

申请号：US14527095

申请日：2014-10-29

Applicant: Seiko Epson Corporation

Inventor： Shinya AOKI ,  Osamu KAWAUCHI ,  Juichiro MATSUZAWA ,  Masaru MIKAMI

IPC: H05K5/02 ,  H05K5/04 ,  H05K5/06 ,  H05K5/00

CPC classification number: G01C19/5769 ,  B23K2101/12 ,  G01C19/574 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/16195 ,  H05K5/066

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract translation: 一种电子装置的制造方法，其将作为电子部件的陀螺元件容纳在由基部和盖构成的内部空间中作为盖体，包括：准备在被焊接的表面上设置有槽的盖 与所述基部相比，以及所述内侧空间侧的所述槽的开口面积小于所述盖的外周侧的开口面积; 焊接，首先，基部和盖子在不包括凹槽的至少一部分的未焊接部分的部分，基部和盖子的计划焊接部分; 并且在所述未焊接部分处焊接所述基部和所述盖，从而使所述凹槽闭合。

公开(公告)号：US20140211384A1

公开(公告)日：2014-07-31

申请号：US14164807

申请日：2014-01-27

Applicant: Seiko Epson Corporation

Inventor： Shinya AOKI ,  Juichiro MATSUZAWA ,  Osamu KAWAUCHI ,  Masaru MIKAMI

IPC: B23K26/26 ,  B23K11/06 ,  B23K1/005 ,  H05K5/03

CPC classification number: G01C19/5783 ,  H01L2224/16225 ,  H01L2924/16195 ,  H05K5/066

Abstract: A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.

Abstract translation: 一种制造电子装置的方法，其中在基座和盖之间形成用于容纳陀螺元件的内部空间，并且基座和盖被粘合包括将基座和在其上设置有凹槽的盖接合到 与基部结合，使得内部空间通过不将槽的内表面接合到基座而与外部连通并且将槽定位在设置在基座的侧表面上的凹部周围，并且通过 将激光束照射到通信部中的盖上。