Temperature-controlled substrate holder for processing in fluids
    1.
    发明授权
    Temperature-controlled substrate holder for processing in fluids 有权
    用于在流体中加工的温度控制的基板支架

    公开(公告)号:US06908512B2

    公开(公告)日:2005-06-21

    申请号:US10247895

    申请日:2002-09-20

    摘要: A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip mechanism or placed into a seat without the use of clamps. In both cases, the substrate forms a partial wall that confines the heating/cooling recess or chamber. The aforementioned recess is filled with a cooling or heating liquid (depending on the mode of metal deposition) selectively supplied from a liquid heating or cooling system. In order to ensure in the working chamber above the substrate a pressure slightly higher than the pressure in the cooling/heating recess, the working chamber is first filled with the working solution under the atmospheric pressure, and then the recess is filled with a heating or cooling liquid with simultaneous increase of pressure in the working chamber to a level slightly exceeding the pressure in the recess. The substrate holder of the invention provides direct heat/cool-exchange between the heating/cooling medium and the substrate and allows instantaneous change of temperature of the heating/cooling liquid.

    摘要翻译: 衬底保持器具有盘状体,其具有直径小于放置在保持器的上表面上的衬底的直径的中心凹部。 基板可以通过边缘抓握机构的夹具夹紧就位,或者不使用夹具而放置在座中。 在这两种情况下,基板形成限制加热/冷却凹部或室的局部壁。 上述凹部填充有从液体加热或冷却系统选择性地供应的冷却或加热液体(取决于金属沉积的模式)。 为了确保在基板上方的工作室内的压力略高于冷却/加热凹槽中的压力,工作室首先在大气压力下被工作溶液填充,然后用加热或 冷却液体,同时将工作室中的压力提高到稍微超过凹部中的压力的​​水平。 本发明的衬底保持器在加热/冷却介质和衬底之间提供直接的热/冷交换,并且允许加热/冷却液体的温度的瞬时变化。