公开(公告)号：US06622374B1

公开(公告)日：2003-09-23

申请号：US09667294

申请日：2000-09-22

申请人： Jiangtao Wang ,  Michael A. Centanni ,  Sidney J. Clouser

发明人： Jiangtao Wang ,  Michael A. Centanni ,  Sidney J. Clouser

IPC分类号： H01F17075

CPC分类号： H05K1/167 ,  H01C7/18 ,  H01C17/07 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/0723 ,  Y10S29/016 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49156

摘要： A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

摘要翻译： 一种制造电阻箔的方法，包括具有第一侧和第二侧的铜层。 在铜层的第一面上设置有厚度为介于-5埃之间的粘结层金属层。 第一层厚度为100埃至500埃的第一电阻器金​​属设置在该涂层金属层上，并且第一层第二层第二电阻金属层，其厚度介于100埃至500埃之间。 第一电阻金属层。 第一电阻金属具有与第二电阻金属不同的电阻。