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15 条记录 (耗时 0.011 秒)

    Hold down device for use in electronic systems employing integrated circuits
    4.
    发明授权
    Hold down device for use in electronic systems employing integrated circuits 失效
    压紧装置用于采用集成电路的电子系统

    公开(公告)号：US3942854A

    公开(公告)日：1976-03-09

    申请号：US513282

    申请日：1974-10-09

    申请人： Peter P. Klein ,  Robert E. Braun

    发明人： Peter P. Klein ,  Robert E. Braun

    IPC分类号： H05K7/10 ,  H01K1/12

    CPC分类号： H05K7/1069

    摘要： A hold down device is described for applying a high clamping force to a "leadless" integrated circuit package installed in a suitable connector. Use of the device results in reliable electrical connections between the package circuit leads and the connector contact elements; and reliable thermal connections between the package carrier and a cooling frame provided to dissipate the heat generated by the integrated circuits. The hold down device has added system utility in the clamping of an interconnect cable assembly adapted to plug into the aforementioned connector in lieu of the integrated circuit package.

    摘要翻译： 描述了一种压紧装置，用于将高夹紧力施加到安装在合适连接器中的“无引线”集成电路封装。 使用该设备会导致封装电路引线和连接器接触元件之间的可靠电连接; 以及在包装载体和用于消散集成电路产生的热量的冷却框架之间的可靠的热连接。 压紧装置在夹紧适于插入上述连接器以替代集成电路封装的互连电缆组件中增加了系统效用。

    Fluid heat transfer method and apparatus for semi-conducting devices
    5.
    发明授权
    Fluid heat transfer method and apparatus for semi-conducting devices 失效
    用于半导体器件的流体传热方法和装置

    公开(公告)号：US3673306A

    公开(公告)日：1972-06-27

    申请号：US3673306D

    申请日：1970-11-02

    申请人： TRW INC

    发明人： KIRKPATRICK MILTON E

    IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/42 ,  H01L23/427 ,  H01K1/12

    CPC分类号： F28D15/0266 ,  F28D15/04 ,  H01L23/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There is disclosed the use of a heat pipe type thermal conductive path within a metallic housing such as a transistor can for a highly efficient cooling of high power semi-conductor devices which normally require large heat dissipation. An electrically non-conductive wick structure is provided which is formed, for example, from high purity silica glass cloth in a shape resembling a hollow ''''marshmallow'''' and which forms a liner for the entire transistor can. The wick contacts both the active surface of the semi-conductor device in the bottom of the can and the upper walls of the can. Prior to placing the can upon its mounting base, an appropriate amount of electrically nonconductive, non-polar working fluid such as high purity organic liquid is loaded so that it entirely fills or saturates only the wick like structure. The working fluid held within the wick is thus in immediate contact with the active surface of the semiconducting device. In operation, the surface of the semiconductor device serves as the evaporator section of the closed loop heat pipe. As fluid is caused to evaporate from this region, heat transfer and thus cooling of the device is effected. The vapor thus produced is recondensed over regions of the can which are at slightly cooler temperatures than the semiconductor device. The working fluid vapor thus provides an efficient heat transfer path to the entire radiating surface of the can in order to dissipate the thermal energy of concern.

    摘要翻译： 公开了在诸如晶体管罐的金属壳体内使用热管式导热路径，用于通常需要大的散热的高功率半导体器件的高效冷却。 提供了一种非导电性芯结构，其例如由高纯度石英玻璃布形成为类似于中空“棉花糖”的形状，并且形成整个晶体管罐的衬垫。 灯芯接触罐底部的半导体器件的有源表面和罐的上壁。 在将罐放置在其安装基座之前，加载适当量的非导电非极性工作流体，例如高纯度有机液体，使得其仅完全填充或饱和芯状结构。 保持在芯中的工作流体因此与半导体器件的有源表面立即接触。 在操作中，半导体装置的表面用作闭环热管的蒸发器部分。 当流体从该区域蒸发时，实现装置的热传递和冷却。 如此产生的蒸汽在罐的区域再重新稠化，其温度比半导体器件略温。 因此，工作流体蒸汽因此提供了到罐的整个辐射表面的有效的热传递路径，以消散所关注的热能。

    Indamines for dyeing keratinic fibers
    8.
    发明授权
    Indamines for dyeing keratinic fibers 失效
    用于染色可卡因纤维的痕迹

    公开(公告)号：US3876368A

    公开(公告)日：1975-04-08

    申请号：US38761373

    申请日：1973-08-13

    申请人： OREAL

    发明人： KALOPISSIS GREGOIRE ,  BUGAUT ANDREE ,  ESTRADIER FRANCOISE

    IPC分类号： A61K8/41 ,  A61Q5/10 ,  H01K1/12 ,  D06P3/04

    CPC分类号： A61K8/413 ,  A61Q5/10 ,  Y10S424/01 ,  Y10S424/02

    摘要： Imdamine having the formula

    Wherein R and R'' each independently represent a member selected from the group consisting of hydrogen, lower alkyl having 1-4 carbon atoms, lower alkoxy having 1-4 carbon atoms, amino, acylamino wherein the acyl moiety has 1 to 4 carbon atoms and hydroxy, with the proviso that one, but not both of R and R'' is said amino, acylamino or hydroxy; R.sub.1 and R.sub.2 each independently represent a member selected from the group consisting of lower alkyl having 1-4 carbon atoms and lower alkyl having 1-4 carbon atoms and substituted with a member selected from the group consisting of hydroxy, acylamino wherein the acyl moiety has 1 to 4 carbon atoms, carbamyl, piperidino, benzoylamino and alkylsulfonamido wherein the alkyl moiety has 1 to 4 carbon atoms; R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 each independently represent a member selected from the group consisting of hydrogen, lower alkyl having 1-4 carbon atoms and lower alkoxy having 1-4 carbon atoms, and the salts formed by these indamines with organic or inorganic acids, in particular, their acetates, hydrochlorides, hydrobromides, persulfates, perchlorates and the double zinc salts of these compounds, which can, of course, be in a tautomeric form of that represented by formula (I), are usefully employed for dyeing keratinous fibers, and, in particular, human hair.

    Electrical assembly
    9.
    发明授权
    Electrical assembly 失效
    电气总成

    公开(公告)号：US3836823A

    公开(公告)日：1974-09-17

    申请号：US38000873

    申请日：1973-07-17

    申请人： SARKES TARZIAN

    发明人： SHIELDS M

    IPC分类号： H01L23/467 ,  H01L23/473 ,  H01K1/12

    CPC分类号： H01L23/473 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In combination one or more heat producing electrical components, each component having an elongated body and electrical connector leads extending from one or both opposite ends thereof; electrical insulating means provides a tubular conduit structure for containing a fluid heat exchange medium for cooling contact with the body of the electrical components, said conduit encapsulates and supports at least one end of the body of each electrical component body and also encapsulates and holds the electrical leads extending therefrom in secure electrically insulating arrangement with respect to other components, said conduit structure includes inner wall surfaces spaced apart from the exposed body surfaces of the electrical components except for short end portions encapsulated and supported thereby.

    摘要翻译： 组合一个或多个发热电气部件，每个部件具有从其一个或两个相对端延伸的细长主体和电连接器引线; 电绝缘装置提供用于容纳用于与电气部件的主体冷却接触的流体热交换介质的管状导管结构，所述导管封装并支撑每个电气部件主体的主体的至少一个端部，并且还封装并保持电气 所述管道结构包括与电气部件的暴露的主体表面间隔开的内壁表面，除了被封装和支撑的短端部分之外。