公开(公告)号：US06441297B1

公开(公告)日：2002-08-27

申请号：US09623996

申请日：2000-10-23

申请人： Steffen Keller ,  Peter Fath ,  Gerhard Willeke

发明人： Steffen Keller ,  Peter Fath ,  Gerhard Willeke

IPC分类号： H01L27142

CPC分类号： H01L31/035281 ,  B64G1/443 ,  H01L31/022441 ,  H01L31/022458 ,  H01L31/0508 ,  H01L31/0516 ,  H01L31/0682 ,  Y02E10/547 ,  Y10S439/954

摘要： The invention relates to a solar cell arrangement consisting of series-connected solar subcells. Said solar subcells consist of a semiconductor wafer which forms a common base material for all of the solar subcells and wherein a number of recesses are provided for delimiting the individual, series-connected solar subcells. The invention is characterised in that at least some of the recesses extend from the top surface of the semiconductor wafer, through the wafer itself to the bottom surface and in that at most some bridge segments are left in continuation of the recesses as far as the wafer edge, to mechanically interconnect the solar subcells.

摘要翻译： 本发明涉及由串联太阳能子电池组成的太阳能电池装置。 所述太阳能子电池由形成用于所有太阳能子电池的公共基底材料的半导体晶片组成，并且其中设置多个凹槽以限定单独的串联连接的太阳能子电池。 本发明的特征在于，至少一些凹槽从半导体晶片的顶表面延伸穿过晶片本身到底面，并且至少一些桥接部分留在凹槽的连续处，直到晶片 边缘，以机械地互连太阳能子电池。

公开(公告)号：US06437231B1

公开(公告)日：2002-08-20

申请号：US09863351

申请日：2001-05-24

申请人： Shinichiro Kurata ,  Katsuhiko Hayashi ,  Atsuo Ishikawa ,  Masataka Kondo

发明人： Shinichiro Kurata ,  Katsuhiko Hayashi ,  Atsuo Ishikawa ,  Masataka Kondo

IPC分类号： H01L27142

摘要： An integrated thin-film solar battery having a plurality of unit elements connected in series includes a substrate, a plurality of spaced apart first electrode layers formed on the substrate; a plurality of semiconductor layers disposed on said plurality of first electrode layers in such a manner that each of the semiconductor layers is formed on two adjacent first electrodes and has a connection opening located on one of the two first electrodes, an electrically conductive layer formed on each of the semiconductor layers except on the region of the connection opening, and a second electrode layer disposed on each of the electrically conductive layers such that the second electrode layer is electrically connected to one of the two adjacent first electrode layers through the connection opening, to form a region interposed between the second electrode layer and the other first electrode layer as the unit element.

公开(公告)号：US06274804B1

公开(公告)日：2001-08-14

申请号：US09421049

申请日：1999-10-19

申请人： Walter Psyk ,  Peter Lechner

发明人： Walter Psyk ,  Peter Lechner

IPC分类号： H01L27142

CPC分类号： H01L27/1421 ,  H01L31/046 ,  Y02E10/50

摘要： A thin-film solar module consists of a number of solar cells tandem mounted and series-connected on a common substrate and a number of diodes disposed antiparallel and adjacent thereto. Overlap zones are formed by a projecting edge area of an electrode layer of a solar cell or diode engaging a recess of the corresponding electrode layer of the adjacent diode or solar cell. Each diode is connected in the reverse direction with the adjacent solar cell in at least two overlap zones, the front electrode layer of the diode with the back electrode layer of the solar cell in at least one of said overlap zones, and the back electrode layer of the diode with the front electrode layer of the solar cell in at least one other overlap zone. The photovoltaically active layer sequence is additionally separated by grooves in areas of the grooves of the back electrode layer.

摘要翻译： 薄膜太阳能模块由多个串联安装并串联连接在共同的基板上的多个太阳能电池组成，并且与反平行并与其相邻设置的多个二极管组成。 重叠区域由与相邻二极管或太阳能电池的相应电极层的凹部接合的太阳能电池或二极管的电极层的突出边缘区域形成。 每个二极管在与至少两个重叠区域中的相邻太阳能电池相反的方向上连接，二极管的前电极层与太阳能电池的背电极层在至少一个所述重叠区域中，而后电极层 的二极管与太阳能电池的前电极层在至少一个其他重叠区域中。 在背面电极层的凹槽的区域中，另外由凹槽分隔光电活性层序列。

公开(公告)号：US06265652B1

公开(公告)日：2001-07-24

申请号：US09033933

申请日：1998-03-03

申请人： Shinichiro Kurata ,  Katsuhiko Hayashi ,  Atsuo Ishikawa ,  Masataka Kondo

发明人： Shinichiro Kurata ,  Katsuhiko Hayashi ,  Atsuo Ishikawa ,  Masataka Kondo

IPC分类号： H01L27142

CPC分类号： H01L31/022466 ,  H01L31/022483 ,  H01L31/022491 ,  H01L31/046 ,  H01L31/056 ,  Y02E10/52

摘要： An integrated thin-film solar battery having a plurality of unit elements connected in series includes a substrate, a plurality of spaced apart first electrode layers formed on the substrate; a plurality of semiconductor layers disposed on said plurality of first electrode layers in such a manner that each of the semiconductor layers is formed on two adjacent first electrodes and has a connection opening located on one of the two first electrodes, an electrically conductive layer formed on each of the semiconductor layers except on the region of the connection opening, and a second electrode layer disposed on each of the electrically conductive layers such that the second electrode layer is electrically connected to one of the two adjacent first electrode layers through the connection opening, to form a region interposed between the second electrode layer and the other first electrode layer as the unit element.

公开(公告)号：US06351027B1

公开(公告)日：2002-02-26

申请号：US09515931

申请日：2000-02-29

申请人： Kirk S. Giboney ,  Jonathan Simon

发明人： Kirk S. Giboney ,  Jonathan Simon

IPC分类号： H01L27142

CPC分类号： H01L21/50 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip mounted enclosure (“CME”) comprises a base formed by an integrated circuit chip, a transducer element disposed on the integrated circuit chip, a side piece surrounding the transducer element that is coupled to the base, and a top piece coupled to the side piece. A method of making a CME comprises mounting a transducer element to a planar surface of an integrated circuit chip, where the planar surface forms a base of the CME. A side piece is fabricated to surround the transducer element. A top piece of the CME is placed on the side piece. Individual CMEs can be fabricated from a wafer assembly, where transducer elements, each respectively mounted to an integrated circuit wafer having corresponding integrated circuit chips, are individually surrounded by a side piece structure that is bonded to the integrated circuit wafer. Individual CMEs are formed by singulating the wafer assembly.

摘要翻译： 芯片安装的外壳（“CME”）包括由集成电路芯片形成的基座，设置在集成电路芯片上的换能器元件，围绕耦合到基座的换能器元件的侧部件，以及耦合到该基座的顶部件 侧面 制造CME的方法包括将换能器元件安装到集成电路芯片的平面表面，其中平坦表面形成CME的基底。 制造一个侧件围绕换能器元件。 CME的顶部放在侧面件上。 单独的CME可以由晶片组件制造，其中每个分别安装到具有对应的集成电路芯片的集成电路晶片的换能器元件由结合到集成电路晶片的侧片结构单独包围。 单独的CME通过单晶晶片组件形成。

公开(公告)号：US06320189B1

公开(公告)日：2001-11-20

申请号：US09352232

申请日：1999-07-13

申请人： Jean-Louis Ouvrier-Buffet ,  Chantal Beccia ,  Michel Vilain

发明人： Jean-Louis Ouvrier-Buffet ,  Chantal Beccia ,  Michel Vilain

IPC分类号： H01L27142

CPC分类号： G01J5/08 ,  G01J5/0846 ,  G01J5/20 ,  H01L27/14669 ,  H04N5/332

摘要： A device for the detection of multi-spectral infrared and visible radiation using a bolometric detector having at least one active layer and two control electrodes for the detection of both infrared and visible radiation, and also using at least one photodetector having at least two active layers and two control electrodes for detecting solely visible radiation. The device is uncooled, and the two detectors are superimposed and combined with one-another for forming the same sensitive element.

摘要翻译： 一种用于使用具有至少一个有源层和两个控制电极的测温检测器来检测多光谱红外和可见辐射的装置，用于检测红外和可见光辐射，并且还使用至少一个具有至少两个有源层的光电检测器 以及用于仅检测可见光的两个控制电极。 该装置是非冷却的，并且两个检测器被叠加并且彼此组合以形成相同的敏感元件。