WAFER TREATMENT DEVICE
    2.
    发明公开

    公开(公告)号:US20240304468A1

    公开(公告)日:2024-09-12

    申请号:US18664004

    申请日:2024-05-14

    发明人: Bum Je WOO

    摘要: Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.

    STACKABLE FAN
    3.
    发明公开
    STACKABLE FAN 审中-公开

    公开(公告)号:US20240200561A1

    公开(公告)日:2024-06-20

    申请号:US18543450

    申请日:2023-12-18

    摘要: A stackable fan includes a base and a cover pivotable secured thereon. One or more fan blades is formed in the cover. The base includes two lower steps extending downwardly therefrom and a spring-biased latch extending upwardly from an upper edge. The cover includes a ledge having an overhanging portion disposed opposite the spring biased latch. The fan may be secured on top of the cover or beneath the base of variously sized storage containers which also includes steps and latches. The fan may be part of a stackable wheeled storage container system.

    Wafer treatment device
    4.
    发明授权

    公开(公告)号:US12014937B2

    公开(公告)日:2024-06-18

    申请号:US17726445

    申请日:2022-04-21

    发明人: Bum Je Woo

    摘要: Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.

    Air-conditioning system
    6.
    发明授权

    公开(公告)号:US11982464B2

    公开(公告)日:2024-05-14

    申请号:US17427727

    申请日:2020-02-07

    IPC分类号: F24F7/007 F24F11/00

    CPC分类号: F24F7/007 F24F11/0001

    摘要: Provided is an air-conditioning system that air-conditions a house having an upper floor and a lower floor positioned at a lower position than the upper floor. The air-conditioning system includes an air-conditioning apparatus that conditions air in an air-conditioning room provided at the upper floor or at a higher position than the upper floor, a plurality of conveyance fans that conveys the air in the air-conditioning room to a plurality of upper rooms positioned at the higher floor independent of the air condition room, and is provided to correspond to the plurality of upper rooms, coupling fans that couple the upper rooms and lower rooms positioned at lower positions of the upper rooms to blow air from the upper rooms to the lower rooms, and a system controller that controls the air-conditioning apparatus, the conveyance fans, and the coupling fans.

    AIR TREATMENT DEVICE
    10.
    发明公开

    公开(公告)号:US20240035681A1

    公开(公告)日:2024-02-01

    申请号:US18380140

    申请日:2023-10-13

    摘要: An air treatment device includes a case having fresh and supply air ports, and return and exhaust air ports. In the case, a supply air route is formed from the fresh to the supply air ports and an exhaust air route is formed from the return to the exhaust air port. The supply and exhaust air routes are provided with fans. A heat exchanger cause heat exchange between air flowing in the supply and exhaust air routes. The heat exchanger includes multiple layers of heat exchange core fins, and multiple layers of films stacked alternately. A section perpendicular to an air flow direction and upstream of the heat exchanger includes first and second regions. In the heat exchanger, the films adjacent to each other have a gap H1 in the first region, and a distance H2 in the second region, with H1