公开(公告)号：US20250070532A1

公开(公告)日：2025-02-27

申请号：US18945690

申请日：2024-11-13

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Siu Kwan CHEUNG ,  Lijun ZHU ,  Raman SRINIVASAN ,  Huanlin ZHU

IPC: H01S5/024 ,  H01S5/02 ,  H01S5/02315 ,  H01S5/02355 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

Abstract: An optical device may include a substrate including a conductive core, a first layer stack on a first surface of the conductive core, a conductor-filled trench extending through the first layer stack to the conductive core such that the conductor-filled trench is on the first surface of the conductive core, and a second layer stack on a second surface of the conductive core. The optical device may include a vertical-cavity surface-emitting laser (VCSEL) chip above the conductor-filled trench. The VCSEL chip may include an array of VCSELs. A size of the conductor-filled trench may match a size of the VCSEL chip, match a size of an emission region of the array of VCSELs, or be greater than the size of the emission region of the array of VCSELs and less than the size of the VCSEL chip.

公开(公告)号：US20250054832A1

公开(公告)日：2025-02-13

申请号：US18718949

申请日：2022-12-13

Applicant: ROGERS GERMANY GMBH

Inventor： Vitalij GIL ,  Johannes WIESEND ,  Fabian WAGLE

IPC: H01L23/373 ,  H01L21/683 ,  H01L23/473 ,  H01S5/024

Abstract: Carrier substrate (1) for electrical components (4), comprising: a heat sink (20), and a ceramic element (71), wherein the ceramic element (71) is bonded to the heat sink (20) at least in sections, wherein a bonding layer free of solder material is formed in the manufactured carrier substrate (1) between the heat sink (20) and the ceramic element (71), and wherein a adhesion agent layer of the bonding layer has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq.

公开(公告)号：US12176676B2

公开(公告)日：2024-12-24

申请号：US17076443

申请日：2020-10-21

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu

IPC: H01S3/04 ,  H01S5/023 ,  H01S5/024 ,  H01S5/042

Abstract: Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.

公开(公告)号：US20240421561A1

公开(公告)日：2024-12-19

申请号：US18817525

申请日：2024-08-28

Applicant: INNOLIGHT TECHNOLOGY PTE. LTD.

Inventor： Liang LUO ,  Wenkai TU ,  Jinan GU ,  Yuzhou SUN

IPC: H01S5/0687 ,  H01S3/139 ,  H01S5/02208 ,  H01S5/02251 ,  H01S5/02325 ,  H01S5/024 ,  H01S5/10 ,  H01S5/14

Abstract: An optical module includes an outer housing; and a module circuit board, a controller, a photonic integrated circuit and a tunable laser that are disposed in the outer housing. The tunable laser includes a sealed housing having an optical interface and an electrical interface, and a free-space external cavity laser disposed in the sealed housing and configured to emit an optical signal whose wavelength is tunable. The free-space external cavity laser includes an external resonant cavity formed of a first cavity surface and a second cavity surface, and a gain chip, a collimating lens, and a tunable filter assembly that are disposed between the first cavity surface and the second cavity surface.

公开(公告)号：US12170435B2

公开(公告)日：2024-12-17

申请号：US18447989

申请日：2023-08-10

Applicant: Western Digital Technologies, Inc.

Inventor： Erhard Schreck ,  Sukumar Rajauria ,  Robert Smith

IPC: G11B5/00 ,  G11B5/03 ,  G11B11/105 ,  H01S5/024 ,  H01S5/065

Abstract: A data storage device may include one or more disks, an actuator arm assembly comprising one or more magnetic recording heads, a laser diode positioned inside a laser diode cavity, and one or more processing devices configured to initiate a write operation, wherein initiating the write operation comprises activating a magnetic recording head corresponding to the laser diode, and applying a forward bias to the laser diode; apply a first reverse bias to the laser diode during at least one intervening event; and transition from applying the first reverse bias to the at least one laser diode to applying the forward bias to the at least one laser diode.

公开(公告)号：US12163773B2

公开(公告)日：2024-12-10

申请号：US17856914

申请日：2022-07-01

Applicant: iSenseCloud, Inc.

Inventor： An-Dien Nguyen ,  An H. Nguyen

IPC: G01B11/16 ,  G01K11/3206 ,  H01S5/06 ,  H01S5/062 ,  H01S5/0683 ,  H01S5/0687 ,  H04B10/572 ,  H01S5/024 ,  H01S5/068 ,  H01S5/40

Abstract: A fiber optic voltage conditioner, and method therefor, generally relate to voltage conditioning. In such a fiber optic voltage conditioner, there is a laser, and an optical circulator is coupled to receive a light signal from the laser. A controller is coupled to the laser and is configured to generate first control information for wavelength-drift control of the laser. A data acquisition module is coupled to the controller and is configured to generate second control information for the controller for adjustment of the first control information. A photodetector is coupled to the optical circulator to receive a returned optical signal and is coupled to the data acquisition module to provide an analog output signal thereto. The photodetector is configured to generate the analog output signal responsive to the returned optical signal. The data acquisition module is configured to generate the second control information using the analog output signal.

公开(公告)号：US12144152B2

公开(公告)日：2024-11-12

申请号：US17277202

申请日：2019-09-18

Applicant: NEC Corporation

Inventor： Shingo Kameda

IPC: H05K7/20 ,  G02B6/44 ,  H01S5/024 ,  H04B10/29

Abstract: [Problem] To suppress the number of man-hours required to handle design changes accompanying a change in heat generation in an internal unit stored inside an electric device.
[Solution] The present invention includes: at least one internal unit, which is a heat generating body and has a prescribed cross-sectional external shape; at least one heat conduction unit, which is a good conductor of heat and has a prescribed cross-sectional external shape; and a device housing in which two or more of the internal unit and the heat conduction unit can be stored in a state of being adjacent to each other with the prescribed cross-sectional external shapes thereof overlapping each other, the device housing thermally connecting to the stored internal unit or the stored heat conduction unit.

公开(公告)号：US12142896B2

公开(公告)日：2024-11-12

申请号：US18447401

申请日：2023-08-10

Applicant: Western Digital Technologies, Inc.

Inventor： Erhard Schreck ,  Sukumar Rajauria ,  Robert Smith ,  Joey M. Poss

IPC: G11B5/00 ,  G11B5/03 ,  H01S5/024 ,  H01S5/065

Abstract: A data storage device may include one or more disks, an actuator arm assembly comprising one or more disk heads, at least one laser diode positioned inside a corresponding laser diode cavity, a preamplifier, and one or more processing devices. The one or more processing devices are configured to: generate a reverse bias; apply, using the preamplifier, the reverse bias to the at least one laser diode to preheat a corresponding laser diode cavity to a target temperature prior to a write operation; control transition of the preamplifier from applying the reverse bias to applying a forward bias to the at least one laser diode; and activate the at least one laser diode to begin the write operation.

公开(公告)号：US12142893B2

公开(公告)日：2024-11-12

申请号：US18054989

申请日：2022-11-14

Applicant: Lumentum Operations LLC

Inventor： Shibnath Pathak ,  Duanhua Kong ,  Michael C. Larson ,  Amit Mizrahi

IPC: H01S3/04 ,  H01S5/024 ,  H01S5/06 ,  H01S5/068 ,  H01S5/22

Abstract: In some implementations, a thermally-controlled photonic structure may include a suspended region that is suspended over a substrate; a plurality of bridge elements connected to the suspended region and configured to suspend the suspended region over the substrate, where a plurality of openings are defined between the plurality of bridge elements; and at least one heater element having a modulated width disposed on the suspended region. The at least one heater element having the modulated width may include at least one section of a greater width and at least one section of a lesser width. The at least one section of the greater width may be in alignment with an opening of the plurality of openings and the at least one section of the lesser width may be in alignment with a bridge element of the plurality of bridge elements.

公开(公告)号：US20240369709A1

公开(公告)日：2024-11-07

申请号：US18774717

申请日：2024-07-16

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Amir Hosseini

IPC: G01S17/58 ,  G01S17/931 ,  H01S5/024 ,  H01S5/065 ,  H01S5/343

Abstract: A LIDAR system comprising a seed laser configured to output a beam, a modulator coupled to receive the beam and modulate the beam to create a modulated beam, a photonics integrated circuit having an amplifier coupled to receive the modulated beam from the modulator and generate an amplified beam, the amplifier having an active layer for high power and a super lattice structure for thermal dissipation; and a transceiver chip coupled to the photonics integrated circuit, the transceiver chip configured to emit the amplified beam and receive a reflected beam from a target.